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Integrated circuits and method for manufacturing integrated circuit

An integrated circuit, electrical connection technology, applied in the direction of circuits, electrical components, electrical solid devices, etc.

Active Publication Date: 2014-03-26
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, different materials may have to fit and / or be well matched for use with each other

Method used

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  • Integrated circuits and method for manufacturing integrated circuit
  • Integrated circuits and method for manufacturing integrated circuit
  • Integrated circuits and method for manufacturing integrated circuit

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Embodiment Construction

[0012] The following detailed description refers to the accompanying drawings, which show by way of illustrations embodiments and specific details in which the invention may be practiced.

[0013] The word "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any embodiment or design described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments or designs.

[0014] The word "above" used with reference to a deposited material formed "on" a side or surface may be used herein to indicate that the deposited material may be formed "directly" on the implied side or surface, for example with the implied side or surface in direct contact. The word "over" as used with reference to a deposited material formed "on" a side or surface may be used herein to mean that it may be formed "indirectly" on the implied side or surface, with one or more additional layers is disposed between the implied side o...

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PUM

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Abstract

An integrated circuit and a method for manufacturing the same are provided. The integrated circuit includes: a chip and encapsulation material covering at least three sides of the chip, the encapsulation material being formed from adhesive material. The integrated circuit includes a carrier adhered to the chip by means of the encapsulation material.

Description

technical field [0001] Various embodiments relate generally to integrated circuits and methods for fabricating integrated circuits. Background technique [0002] Until now, semiconductor chips and semiconductor chip packages could be made by first adhering the chip to a carrier or lead frame and then subsequently, usually after further processing, encapsulating the chip with a further material, such as a polymer material. Several challenges may be associated with these fabrication processes. Sawing may have to be performed through brittle silicon and soft polymer materials. Also, it may be necessary for multiple processes to depend on each other. Multiple materials may be required such as adhesive material, encapsulating material and fixing material. The processes used to deposit different materials may need to be well integrated with each other. Also, different materials may have to fit and / or match well for use with each other. Contents of the invention [0003] Var...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/29H01L23/373H01L23/31H01L21/56H01L21/60
CPCH01L2224/83851H01L2224/29344H01L24/96H01L2224/29318H01L24/73H01L2224/32245H01L24/32H01L24/13H01L2224/29324H01L2224/29347H01L2224/29499H01L2224/29355H01L23/482H01L23/29H01L2224/32105H01L2224/29339H01L2224/83855H01L2224/2929H01L2224/96H01L23/3107H01L2224/2936H01L23/42H01L2224/29311H01L2221/68327H01L21/568H01L24/83H01L24/29H01L2224/29364H01L2224/32106H01L21/6836H01L2224/73104H01L2224/04105H01L2224/2919H01L2224/73253H01L2924/181H01L2224/83H01L2924/00014H01L2924/0665H01L2924/00012H01L2924/00
Inventor K.霍赛尼J.马勒I.尼基廷L.奥索夫斯基
Owner INFINEON TECH AG