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Transparent circuit board, and transparent circuit board module and manufacturing method thereof

A transparent circuit board and circuit substrate technology, which is applied in the direction of transparent dielectric, printed circuit manufacturing, circuit substrate materials, etc., can solve the problems affecting the efficiency of circuit board assembly and the transparency of transparent circuit boards, and achieve the effect of ensuring transparency

Inactive Publication Date: 2014-06-11
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of assembling with UV glue, the coating thickness of UV glue is usually about 0.1 mm, which affects the transparency of the transparent circuit board
Moreover, when using ultraviolet glue for assembly, it is necessary to assemble the two sides of the transparent circuit board separately, which affects the efficiency of circuit board assembly

Method used

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  • Transparent circuit board, and transparent circuit board module and manufacturing method thereof
  • Transparent circuit board, and transparent circuit board module and manufacturing method thereof
  • Transparent circuit board, and transparent circuit board module and manufacturing method thereof

Examples

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Embodiment Construction

[0015] The transparent circuit board provided by the technical solution, its manufacturing method and the transparent circuit board module will be further described in detail below with reference to the drawings and embodiments.

[0016] see figure 1 The transparent circuit board 100 provided by this technical solution includes a transparent circuit substrate 110 , a first optical adhesive layer 130 , a second optical adhesive layer 140 , a first release film 150 and a second release film 160 .

[0017] The transparent circuit substrate 110 includes a transparent substrate 111 , a first adhesive layer 112 , a conductive circuit 113 and a transparent cover film 120 arranged in sequence. The transparent substrate 111 can be made of transparent polyethylene terephthalate (PET), which has good optical performance and weather resistance, and has good optical transparency. The first glue layer 112 is made of transparent glue. The conductive circuit 113 is composed of a conductive ...

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PUM

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Abstract

The invention relates to a transparent circuit board, which comprises a transparent circuit substrate, a first optical adhesive layer and a second optical adhesive layer, wherein the first optical adhesive layer and the second optical adhesive layer are polymethyl methacrylate optical-grade pressure-sensing adhesives. The invention also relates to a transparent circuit board module and a manufacturing method thereof.

Description

technical field [0001] The invention relates to circuit board manufacturing technology, in particular to a transparent circuit board, a transparent circuit board module and a manufacturing method thereof. Background technique [0002] Printed circuit boards have been widely used due to their advantages such as high assembly density. For the application of the circuit board, please refer to the literature Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans . on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 1418-1425. [0003] Due to the personalization of electronic products, the requirements for printed circuit boards used in electronic products are becoming more and more diverse. At present, there is a transparent printed circuit board. The insulating substrate and cover film used to carry and protect the conductive circuit layer are transparent materials...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K3/00
CPCH05K1/0274H05K3/00H05K3/0058H05K2201/0108
Inventor 何明展胡先钦
Owner AVARY HLDG (SHENZHEN) CO LTD