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Edible fungus temperature modulation cooking device

An edible fungus and heater technology, which is applied in cooking utensils, applications, heating devices, etc., can solve problems such as not easy to leak electricity, and achieve the effects of preventing water loss, avoiding overflow, and good sealing

Inactive Publication Date: 2015-04-29
重庆市武陵山珍经济技术开发(集团)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is an edible fungus modulation warmer that is not easy to leak electricity

Method used

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  • Edible fungus temperature modulation cooking device
  • Edible fungus temperature modulation cooking device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Such as figure 1 As shown, the edible fungus preparation warmer includes a pot body 10 and a pot cover 30. The pot body 10 is provided with an opening, and the pot cover 30 is closed on the opening, and also includes a place to cover the opening. Groove, the storage tank is below the pot cover 30 and is connected to the opening by the tongue and groove 36, and the storage tank is provided with an ultrasonic heater. An annular sealing ring is provided between the pot cover 30 and the storage tank.

[0022] The storage tank includes a lower tank 25 and an upper tank 21, wherein the ultrasonic heater is arranged at the lower tank 25, and the upper tank 21 is provided with a pressure relief hole 23, and the diameter of the pressure relief hole 23 is between 2 and 3 mm. .

[0023] The medium ultrasonic heater includes a heating head and a high-frequency generator and a power module connected to the heating head in turn. The power module includes a vehicle-mounted power mod...

Embodiment 2

[0028] The difference between this embodiment and Embodiment 1 is that: figure 2 As shown, the storage trough is a three-stage stepped trough 213 shape, the upper two slightly larger troughs 211 are the upper trough 21, and the lowermost one is the lower trough 25. The higher the depth of intervention, the better the effect of ultrasonic heating.

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PUM

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Abstract

The invention discloses a food processing device and particularly relates to an edible fungus temperature modulation cooking device. The edible fungus temperature modulation cooking device comprises a pot body, a pot cover and an object placement groove, wherein an opening is formed in the pot body; the pot cover covers the opening; the object placement groove is formed at the opening in a coverage way, is positioned below the pot cover and is connected to the opening through grooves and tongues; an ultrasonic heater is arranged in the object placement groove and comprises a heating head; a port allowing the penetration of the heating head is formed inside the object placement groove; the heating head is hermetically connected with the port. The defect of electric leakage easily caused by the overflow of liquid in a pot during heating in the prior art is overcome. The electricity of the edible fungus temperature modulation cooking device provided by the invention is not easy to leak.

Description

technical field [0001] The invention relates to a food processing device, in particular to a cooking warmer for edible fungi. Background technique [0002] Existing sand heating pots are mostly heated by resistance heating wires, such as a cooking device disclosed in Chinese patent CN103690029, which includes a shell with an upper opening, a heating element and a food container located in the shell, It also includes a control circuit electrically connected to the heating element, and an upper cover arranged above the casing; and a refrigeration assembly communicated with the cavity of the food container; the refrigeration assembly is electrically connected to the control circuit. The heating method of the cooking device is resistance heating. [0003] However, the electromagnetic and resistance heating method adopted in Chinese patent CN103690029 makes the conductive resistor contact the liquid in the cooking device. If the liquid in the pot overflows during heating, it wil...

Claims

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Application Information

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IPC IPC(8): A47J27/00A47J36/24
Inventor 王竹丰
Owner 重庆市武陵山珍经济技术开发(集团)有限公司
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