Asymmetric flex-rigid combined circuit board and preparation method thereof

A rigid-flexible combination and asymmetric technology, which is applied in the fields of printed circuit manufacturing, printed circuit, printed circuit assembly of electric components, etc., can solve the problem of poor production yield of purely flexible areas, poor bonding force and easy delamination, Poor product reliability and other problems, to achieve the effect of enhanced product reliability, improved product reliability, and convenient operation

Active Publication Date: 2015-05-13
GCI SCI & TECH
View PDF4 Cites 17 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] 1. The above-mentioned process produces asymmetric structure double-sided rigid-flex board, and the pure flexible area circuit on the flexible layer cannot be produced or the yield rate is extremely low
[0011] 2. Poor product reliability
[0013] 1. In the pure flexible area, there are steps between the flexible layer and the rigid layer due to the hollowing out of the pure rubber adhesive sheet, resulting in poor exposure during the production of the flexible layer circuit, and defects such as open circuits, short circuits, and

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Asymmetric flex-rigid combined circuit board and preparation method thereof
  • Asymmetric flex-rigid combined circuit board and preparation method thereof
  • Asymmetric flex-rigid combined circuit board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050] The present application will be further elaborated below by way of examples.

[0051] A method for preparing an asymmetric rigid-flex circuit board, the asymmetric rigid-flex circuit board comprising a rigid board, a dielectric layer and a flexible board stacked in sequence, the preparation method comprising the following steps:

[0052] The production of the flexible board 10: the double-sided flexible board is etched, the copper layer 104 on one side is removed to expose the TPI layer 103 of the flexible board, and then the cover film 105 is pasted on the flexible area of ​​the TPI layer (such as figure 2 shown).

[0053] The flexible board is made of a double-sided flexible board etched into a single side, so that the TPI layer is in contact with the dielectric layer, and the PI layer 102 is prevented from directly contacting the dielectric layer, so that the bonding force of the circuit board is better and the reliability is higher. (PI surface is smooth, has no bon...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an asymmetric flex-rigid combined circuit board and a preparation method thereof. The preparation method comprises the steps of flexible plate production, rigid plate production, dielectric layer production, laminating and the like. According to the asymmetric flex-rigid combined circuit board prepared provided by the invention, the product yield can be effectively improved, and the product performance reliability can be enhanced; furthermore, the asymmetric flex-rigid combined circuit board is simple in flow and smart in design; in addition, the asymmetric flex-rigid combined circuit board can be prepared by commercial equipments and materials of the circuit board, the mass preparation can be carried out, and the integrity and appearance of the circuit can be improved greatly.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to an asymmetric rigid-flexible circuit board and a preparation method thereof. Background technique [0002] With the development of PCB (Printed Circuit Board, printed circuit board) in the direction of small size, light weight, three-dimensional installation and high connection reliability, rigid printed circuit boards and flexible printed circuit boards began to move towards rigid-flexible boards. Development, the rigid-flex board is one of the main growth points of the PCB industry in the future. The feature of ordinary rigid-flex boards is that the flexible area can be bent to achieve three-dimensional installation during subsequent assembly. [0003] The asymmetric double-sided rigid-flex circuit board is a rigid-flex circuit board with a simpler structure and lower cost evolved from the ordinary rigid-flex circuit board. The rigid-flexible board with this st...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/36
CPCH05K3/361
Inventor 吴传亮
Owner GCI SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap