Silicon chip separating device
A technology of silicon wafers and driving devices, applied in the directions of transportation and packaging, conveyor objects, sustainable manufacturing/processing, etc., can solve the problems of discontinuity and low slicing efficiency, and achieve the effect of small damage and high slicing efficiency.
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[0027] Embodiment: Silicon Wafer Slicing Device
[0028] See attached Figure 1~6 As shown, the silicon wafer slicing device includes a slicing mechanism 10 and a feed chute.
[0029] Slicing mechanism 10 comprises silicon chip slicing mechanism body 1, and this silicon chip slicing mechanism body 1 is provided with two parallel and spaced apart slicing conveyor belts 2 downwards, and described silicon chip slicing mechanism body 1 faces the The piece conveyor belt 2 is provided with an air extraction hole 3, which communicates with an air extraction device (not shown in the figure) through a pipeline, and the air extraction device may be a vacuum air extraction device. The front end of the silicon chip slicing mechanism body 1 corresponding to the conveying direction of the slicing conveyor belt 2 is provided with a roller 4; The air hole 7 is communicated with the blowing device (not shown in the figure) through the pipeline 9 . The blowing device can be, for example, a b...
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