Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

39results about How to "Improve sharding efficiency" patented technology

Automatic silicon wafer distributing, conveying and positioning system

The invention provides an automatic silicon wafer distributing, conveying and positioning system. The system comprises a mounting rack, a feeding and lifting mechanism, a silicon wafer distributing mechanism, a conveying mechanism and a self-centering mechanism, wherein the feeding and lifting mechanism is arranged on the mounting rack and is used for driving a silicon wafer box to upwards move, and a plurality of silicon wafers are overlapped in the silicon wafer box; the silicon wafer distributing mechanism is arranged at the rear side of the feeding and lifting mechanism, and the conveyingmechanism is arranged at the back of the silicon wafer distributing mechanism; and the self-centering mechanism is arranged at the upper part of one end of the conveying mechanism. According to the system, the feeding and lifting mechanism is arranged, and a silicon wafer overlapping area is formed on a silicon wafer bearing platform; a plurality of silicon wafers can be naturally overlapped in the silicon wafer overlapping area and move to the lower part of the silicon wafer distributing mechanism from bottom to top; the silicon wafer distributing mechanism is capable of automatically distributing the silicon wafers while being in contact with the silicon wafers; and meanwhile, the silicon wafers are continuously conveyed to a self-centering part for self-centering in an one-by-one mannerthrough the conveying mechanism; and the technical problems that a mode for manually positioning the silicon wafers is carried out in the prior art, the working efficiency is low, and both labor andmaterials are wasted, can be solved.
Owner:浙江中晶新材料研究有限公司

Degumming device and method of cut silicon rod

The invention discloses a degumming device and method of a cut silicon rod. The device comprises a cleaning unit and a degumming and splicing unit, wherein a spray assembly is arranged on the cleaningunit; the degumming and splicing unit is arranged downstream the cleaning unit, a heating assembly and hot water are arranged in the degumming and splicing unit, a bearing assembly is arranged abovethe degumming and splicing unit, the bearing assembly comprises a push plate and a protecting plate which are arranged at an interval, the push plate and the protecting plate are arranged on both endsof the cut silicon rod in the length direction of the cut silicon rod, the protecting plate can move in the length direction of the cut silicon rod, the protecting plate comprises a protecting platepart and a separating part which are connected, an opening which penetrates in the length direction of the cut silicon rod is formed in the protecting plate part, a sucking disc which is connected with a mechanical arm makes contact with the end of the cut silicon rod through the opening, the separating part is arranged on the upper end of one end, which is close to the push plate, of the protecting plate part, a containing clearance is formed between the separating part and the protecting plate part, the degumming and splicing unit further comprises an atomizing spray assembly, and the atomizing spray assembly is arranged above the containing clearance.
Owner:XUZHOU XINJING SEMICON TECH CO LTD +1

Battery piece separating equipment

The invention discloses battery piece separating equipment. The battery piece separating equipment comprises a first carrying device, a piece separating device, a second carrying device, a piece separating conveying device, a detecting device, a third carrying device and a discharging device; the piece separating device comprises a scribing laser, a piece splitting laser, light splitting mechanisms and a battery piece bearing mechanism, the scribing laser and the piece splitting laser correspond to the light splitting mechanisms correspondingly, laser emitted by the scribing laser is divided into two scribing laser beams through the corresponding light splitting mechanism, and the piece splitting laser is divided into two piece splitting laser beams through the corresponding light splitting mechanism; the first carrying device carries battery pieces to the battery piece bearing mechanism; the second carrying device carries the battery pieces obtained after splitting on the battery piece bearing mechanism to the piece separating conveying device; the detecting device is used for detecting the battery pieces on the piece separating conveying device; and the third carrying device carries the battery pieces on the piece separating conveying device to the discharging device. According to the technical scheme, the battery piece separating efficiency can be effectively improved.
Owner:WUXI AUTOWELL TECH

Chamfering processing equipment for full-automatic silicon wafer and processing technic thereof

The invention provides chamfering processing equipment for a full-automatic silicon wafer and a processing technic thereof; the full-automatic processing equipment for silicon wafer chamfering can realize single slicing and self-centering of piled silicon wafers by a slicing loading device and a transmission self-centering device; afterwards, the silicon wafers finishing the self-centering are grabbed by a grabbing device and the wafers placed on a chamfering device are realized under the movement of a silicon wafer transferring device; after the chamfering of the silicon wafer is realized onthe chamfering device, an automatic taking device can collect the silicon wafer in a silicon wafer collection box after taking the wafers; a processing method of one transferring mechanism matching with a plurality of sets of chamfering equipment is realized; human resource is saved; the technical problem that the chamfering equipment does not realize complete full automatic and has low working efficiency is solved; the processing technic for the full-automatic silicon wafer realizes quick single slicing and self-centering of the silicon wafer by using a silicon wafer slicing process and a silicon wafer locating process; and the silicon wafer can be transported to a plurality sets of chamfering equipment to conduct chamfering processing by using the silicon wafer transportation and siliconwafer placing.
Owner:浙江中晶新材料研究有限公司

Silicon wafer separator

The present invention relates to a silicon wafer separator. The silicon wafer separator comprises a working platform, a clamping mechanism, a side-end sucking disc and a top-end sucking disc. The working plane of the working platform is provided with a silicon wafer basket bearing area configured to bear a silicon wafer basket, the clamping mechanism is located at the upper portion of the workingplane of the working platform, the side-end sucking disc is located at one side of the silicon wafer basket bearing area on the working platform, the top-end sucking disc is located at the upper portion of the silicon wafer basket bearing area on the working platform, and the side-end sucking disc and the top-end sucking disc are inserted into the silicon wafer basket respectively through the sideend and the top end of the silicon wafer basket when being operated. The silicon wafer separator does not need to take out a silicon wafer in the silicon wafer basket in advance, can separate the silicon wafers sucked together in the silicon wafer basket and employs the cooperation sucking effect of the side-end sucking disc and the top-end sucking disc to improve the wafer separation efficiency,reduce the probability of generation of fragments and subfissure of the silicon wafers in the wafer separation process and achieve whole-process automatic operation of the wafer separation of the silicon wafers with no need for manual processing.
Owner:YANGZHOU XIEXIN PHOTOVOLTAIC TECH

Midair piece breaking-off mechanism and corresponding piece separation material-collecting station

The invention provides a midair piece breaking-off mechanism. The midair piece breaking-off mechanism automatically separates a plurality of cut cell pieces from the two sides towards a center piece area, so that the piece separation efficiency is high, and the pipe separation yield is high. The midair piece breaking-off mechanism comprises a piece breaking-off upper plate. A piece breaking-off frame is arranged under the piece breaking-off upper plate. The piece breaking-off frame comprises two side plates. A lifting air cylinder is fixedly installed on the piece breaking-off upper plate. A lower piston rod of the lifting air cylinder is fixedly connected with the piece breaking-off frame. N breaking-off plates are arranged between the lower ends of the two side plates of the piece breaking-off frame, wherein N is a natural number larger than 1. The number of the breaking-off plates and the number of cell pieces needing to be separated are identical. The N breaking-off plates in the non-work state are spliced into a combined plane in the width direction. The two ends, in the length direction, of each breaking-off plate are connected to the corresponding side plate positions through rotating shaft mechanisms correspondingly. The piece breaking-off frame is fixedly provided with M piece breaking-off air cylinders, wherein M is a natural number. A lower piston rod of each piece breaking-off cylinder is connected with a corresponding horizontal connection rod.
Owner:SUZHOU AUTOWAY SYST

Silicon Wafer Slicing Device

A silicon chip separating device comprises a silicon chip separating mechanism and a feeding trough. The silicon chip separating mechanism comprises a silicon chip separating mechanism body. Two separated silicon chip conveyor belts which are parallelly and separately arranged are configured below the silicon chip separating mechanism body. The silicon chip separating mechanism body is provided with an exhausting holes which face the separated silicon chip conveyor belts. The air exhausting holes are communicated with an air exhausting device through pipeline. The silicon chip separating mechanism body is provided with rollers at positions which correspond with the front end of the conveying direction of the separated silicon chip conveyor belts. The silicon chip separating mechanism body is provided with air blowing holes of which the air blowing direction face the separated silicon chip conveyor belts. The air blowing holes are communicated with an air blower through pipeline. The feeding trough comprises a feeding trough body and a water pump. The feeding trough body is provided with an overflow opening. The overflow opening is communicated with a liquid storage trough through pipeline. The feeding trough body is internally provided with a supporting platform for placing stacked silicon chips. The supporting platform is transmissibly connected with the driving part of a vertical movement driving device. The silicon chip separating device has advantages of high silicon chip separating efficiency and small silicon chip damage in silicon chip separation.
Owner:SUZHOU BOYANG ENERGY EQUIP

A kind of bamboo slicing device

ActiveCN107696193BAchieve the purpose of shardingImprove uniformityCane mechanical workingElectric machineryEngineering
The invention discloses a bamboo slicing device. According to the bamboo slicing device, in the internal of a bamboo pipe, thin sheets at a bamboo joint are cut up through rotating of a plurality of cutting blades first, and a plurality of dividing blades are cooperated to slice the bamboo into equal-sections. The device is characterized in that a connecting sleeve is arranged on the middle of oneside of a motor fixing plate, the motor fixing plate is of a circular plate-shaped structure, and a plurality of through holes are formed in the motor fixing plate; a plurality of through holes are formed in the connecting sleeve and communicates with the through holes in the motor fixing plate in a one-to-one correspondence mode, and the through holes in the connecting sleeve are provided with wider inlets and narrower outlets; a fixing ring is connected with the motor fixing plate through a plurality of connecting rods, each connecting rod is of a fishhook shape, and the distances between every two adjacent connecting rods are equal; a grinding piece is arranged on the inner side of the fixing ring, and a driving motor is arranged on the other side of the motor fixing plate; and a guideplate is arranged on the motor fixing plate, the guide plate is annular, the inner side of the guide plate is attached to the outer side of the driving motor, and the thickness of the guide plate isgradually increased from one end to the other end.
Owner:湖南通达竹业科技有限公司

Glass slide separating device for glass stacking

The invention discloses a glass slide separating device for glass stacking, which comprises a mounting base; cushion blocks are adjacently mounted on the mounting base at equal intervals; a fixed seat is arranged on one side of the mounting base and a limiting seat is arranged on the other side of the mounting base; a pushing cylinder is mounted on one side, far away from the limiting seat, of the mounting base; and a guide rail plate is transversely arranged below the mounting base. The cushion blocks are close to one side of a glass material groove after overturning; a suction cup head is attached to glass sheets, and the suction cup head tightly sucks the glass sheets after vacuumizing, a certain gap is formed between a first glass sheet and the next glass sheet which are arranged, so that the suction cup head can pull the glass sheets into a glass placing clamping groove conveniently, the sheet separation function is achieved conveniently after glass stacking, manual sheet separation is not needed, the automatic glass sheet separation technology is adopted, the glass sheet separation efficiency is improved, safety and efficiency are higher, and scratches caused by adhesion of the glass sheets after cleaning and friction generated during relative movement are solved.
Owner:东莞市科靖自动化设备有限公司

Silicon wafer separating device

The invention discloses a silicon wafer separating device. The device comprises a rack, a first conveying device and a second conveying device are arranged on the rack, the first conveying device comprises a pair of conveying belts, a first suction cup device and a second suction cup device are arranged above and below the first conveying device respectively, the first suction cup device comprises a lifting air cylinder and a suction cup, an image sensor and a thickness sensor are arranged above the first conveying device, and a translation air cylinder for driving the lifting air cylinder to move back and forth between the first conveying device and the second conveying device is arranged above the first conveying device. According to the silicon wafer separating device, an n surface and a p surface are distinguished through the image sensor, whether wafers are adhered or not is detected through the thickness sensor, the adhered wafers are separated through the suction cup devices arranged along a vertical direction, so that the silicon wafers with the p surface facing upwards and the silicon wafers with the n surface facing upwards are conveyed along the two conveying devices, wafer separation is fast, the automation level is high, wafer separation efficiency is improved, labor is saved, and the wafer rejection rate is reduced.
Owner:ZHANGJIAGANG DECHANG AUTOMATIC CO LTD

Silicon chip separating device

A silicon chip separating device comprises a silicon chip separating mechanism and a feeding trough. The silicon chip separating mechanism comprises a silicon chip separating mechanism body. Two separated silicon chip conveyor belts which are parallelly and separately arranged are configured below the silicon chip separating mechanism body. The silicon chip separating mechanism body is provided with an exhausting holes which face the separated silicon chip conveyor belts. The air exhausting holes are communicated with an air exhausting device through pipeline. The silicon chip separating mechanism body is provided with rollers at positions which correspond with the front end of the conveying direction of the separated silicon chip conveyor belts. The silicon chip separating mechanism body is provided with air blowing holes of which the air blowing direction face the separated silicon chip conveyor belts. The air blowing holes are communicated with an air blower through pipeline. The feeding trough comprises a feeding trough body and a water pump. The feeding trough body is provided with an overflow opening. The overflow opening is communicated with a liquid storage trough through pipeline. The feeding trough body is internally provided with a supporting platform for placing stacked silicon chips. The supporting platform is transmissibly connected with the driving part of a vertical movement driving device. The silicon chip separating device has advantages of high silicon chip separating efficiency and small silicon chip damage in silicon chip separation.
Owner:SUZHOU BOYANG ENERGY EQUIP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products