Fragmenting system for laminated PCB and segmenting method of fragmenting system

A technology of pressing plates and suction plates, which is applied in the field of slicing systems, can solve the problems of heavy workload and low efficiency, and achieve the effect of high slicing efficiency and satisfying slicing requirements.

Inactive Publication Date: 2018-03-06
捷惠机械(惠州)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, there are still some defects in most of the existing PCB board manufacturing processes, such as: after the PCB boards are laminated, the large-sized laminated boards need to be divided into small-sized laminated boards according to requirements, and this process of dividing boards is usually handled manually , not only heavy workload, but also low efficiency

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  • Fragmenting system for laminated PCB and segmenting method of fragmenting system
  • Fragmenting system for laminated PCB and segmenting method of fragmenting system

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Embodiment Construction

[0017] The present invention will be further described below in conjunction with the accompanying drawings and the embodiments, and the entire contents of the configurations shown in the following embodiments are not limited to those necessary for the solution of the invention described in the claims.

[0018] See 1 and figure 2 , a slicing system for PCB laminated boards, which has a conveying correction device 1, a lateral cutting positioning device 2, a lateral cutting device 3, a lateral cutting discharge device 4, and a cutting suction plate moving device arranged in sequence along the lateral direction. The planting device 5 and the transplanting and discharging device 6, the longitudinal cutting positioning device 7, the longitudinal cutting device 8 and the longitudinal cutting and discharging device 9 arranged in sequence along the longitudinal direction, and the conveying correction device 1 has a rotation correction mechanism 1- 1. The cutting suction plate transpl...

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Abstract

The invention relates to a fragmenting system for a laminated PCB and a segmenting method of the fragmenting system. The fragmenting system is provided with a conveying correction device, a transversecutting positioning device, a transverse cutting device, a transverse cutting discharge device and a cutting suction plate transplanting device which are sequentially arranged in the transverse direction, as well as a transplanting discharge device, a longitudinal cutting positioning device, a longitudinal cutting device and a longitudinal cutting discharge device which are sequentially arrangedin the longitudinal direction, wherein the cutting suction plate transplanting device and the transplanting discharge device are perpendicular and mutually spliced. The segmenting system with high degree of automation is adopted to perform positioning correction, transverse positioning cutting, transplanting and longitudinal positioning cutting on the laminated PCB, and manual processing is not needed, so that the segmenting efficiency is higher, and the segmenting requirement of the laminated PCB is completely satisfied.

Description

technical field [0001] The invention relates to a slicing system and a slicing method of a PCB pressing board. Background technique [0002] In the past ten years, the PCB board manufacturing industry has developed rapidly, and its total output value and total output both rank first in the world. PCB boards have developed from single-layer boards to double-sided boards, multi-layer boards, and flexible boards, and continue to develop in the direction of high precision, high density, and high reliability, continuously reducing volume, reducing costs, and improving performance, making PCB boards in the future. In the process of product development, it still maintains a strong vitality. [0003] However, there are still some defects in most of the existing PCB board manufacturing processes, such as: after the PCB boards are laminated, the large-sized laminated boards need to be divided into small-sized laminated boards according to requirements, and this process of dividing bo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26D11/00B26D7/01
CPCB26D11/00B26D7/015
Inventor 王洲强
Owner 捷惠机械(惠州)有限公司
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