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Silicon Wafer Slicing Mechanism

A silicon chip and body technology, applied in the field of auxiliary equipment for the preparation of solar cells, can solve the problems of low slicing efficiency and discontinuity, and achieve high slicing efficiency

Active Publication Date: 2018-03-13
江苏博阳智能装备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The invention patent application with the publication number CN103681968A discloses an automatic wafer inserting machine, which uses a suction cup to grab silicon wafers for splitting and inserting. There is a problem of low fragmentation efficiency

Method used

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  • Silicon Wafer Slicing Mechanism
  • Silicon Wafer Slicing Mechanism
  • Silicon Wafer Slicing Mechanism

Examples

Experimental program
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Embodiment

[0024] Embodiment: silicon wafer slicing mechanism

[0025] See attached Figure 1-5 As shown, the silicon chip slicing mechanism includes a silicon chip slicing mechanism body 1, and the silicon chip slicing mechanism body 1 is provided with two parallel and spaced conveyor belts 2 downwards. The silicon chip slicing mechanism body 1 A suction hole 3 is provided toward the conveyor belt 2, and the suction hole 3 communicates with a suction device (not shown in the figure) through a pipeline, and the suction device may be a vacuum suction device. The front end of the silicon chip splitting mechanism body 1 corresponding to the conveying direction of the conveyor belt 2 is provided with a roller 4; The air blowing hole 7 communicates with a blowing device (not shown in the figure) through a pipeline 9 . The blowing device can be, for example, a blower.

[0026] A preferred embodiment is: the conveyor belt is a synchronous belt.

[0027] A preferred embodiment is: the synchr...

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PUM

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Abstract

A silicon chip separating mechanism comprises a silicon chip separating mechanism body, wherein two parallel conveying belts are arranged below the silicon chip separating mechanism body at an interval; air extraction holes facing the conveying belts are formed in the silicon chip separating mechanism body, and are communicated with an air extraction device through pipelines; rollers are arranged on the silicon chip separating mechanism body and correspond to the front ends of the conveying directions of the conveying belts; and an air blowing hole facing the conveying belts is formed in the silicon chip separating mechanism body, and is communicated with an air blowing device. According to the invention, the air extraction device, the air blowing device and the conveying belts work together to separate stacked silicon chips, so that the silicon chip separating mechanism is high in chip separating efficiency.

Description

technical field [0001] The invention relates to a silicon chip slicing mechanism, which belongs to the field of auxiliary equipment for preparing solar cells. Background technique [0002] Since the beginning of the 21st century, global energy consumption has risen sharply, and traditional fossil energy has been increasingly exhausted. Energy issues and environmental issues have gradually become two major issues of global concern. Under the pressure of sustainable development, major countries have listed the solar photovoltaic industry as the focus of the development and utilization of renewable energy. With my country becoming the second largest economy in the world, in October 2013, China's oil imports in October reached 6.3 million barrels per day, surpassing the 6.24 million barrels per day of the United States, replacing the United States as the world's largest net oil importer for the first time. In 2013, China's foreign dependence on oil and natural gas reached 58.1%...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L31/18
CPCH01L21/67271H01L31/1876Y02P70/50
Inventor 邱文良
Owner 江苏博阳智能装备有限公司
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