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A device for slicing silicon wafers

A technology of silicon wafers and driving devices, applied in the direction of sustainable manufacturing/processing, electrical components, climate sustainability, etc., can solve the problems of discontinuity and low slicing efficiency, and achieve the effect of small damage and high slicing efficiency

Active Publication Date: 2018-08-31
江苏博阳智能装备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention patent application with the publication number CN103681968A discloses an automatic wafer inserting machine, which uses a suction cup to grab silicon wafers for splitting and inserting. There is a problem of low fragmentation efficiency

Method used

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  • A device for slicing silicon wafers
  • A device for slicing silicon wafers
  • A device for slicing silicon wafers

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0026] Embodiment: A kind of silicon wafer slicing device

[0027] See attached Figure 1~6 As shown, the silicon wafer slicing device includes a slicing mechanism 10 and a feed chute.

[0028] Slicing mechanism, including silicon chip slicing mechanism body 1, this silicon chip slicing mechanism body 1 is provided with two parallel and spaced apart slicing conveyer belts 2 downwards, and described silicon chip slicing mechanism body 1 faces the described The fragmented conveyor belt 2 is provided with an air hole 3, and the air hole 3 communicates with an air extraction device (not shown in the figure) through a pipeline;

[0029] A preferred embodiment is: the piece conveyor belt 2 is a synchronous belt.

[0030] A preferred embodiment is: the synchronous belt is sheathed on the driving wheel and the driven wheel, and the driving wheel is in transmission connection with the driving device.

[0031] A preferred embodiment is: the driving device is a driving motor, and the ...

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PUM

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Abstract

A silicon wafer slicing apparatus is disclosed. The silicon wafer slicing apparatus comprises a slicing mechanism and a material supply slot, wherein the slicing mechanism comprises a silicon wafer slicing mechanism body; the silicon wafer slicing mechanism body is provided with two parallel and spaced slicing conveying belts downwardly; air holes are formed, facing to the slicing conveying belts, of the silicon wafer slicing mechanism body; the air holes are communicated with an air extractor through pipelines; rolling wheels are arranged at the front ends of the slicing conveying belts in the conveying directions; the material supply slot comprises a material supply slot body and a water pump; an overflow opening is formed in the material supply slot body; the overflow opening is communicated with a liquid storage slot through a pipeline; a bearing and supporting platform for bearing stacked silicon wafers is arranged in the material supply slot body; and the bearing and supporting platform is arranged corresponding to the slicing conveying belts. When the silicon wafer slicing apparatus is used for slicing, the silicon wafer slicing apparatus has the advantages of high slicing efficiency and low damage to the silicon wafers.

Description

technical field [0001] The invention relates to a silicon chip slicing device, which belongs to the field of auxiliary equipment for preparing solar cells. Background technique [0002] Since the beginning of the 21st century, global energy consumption has risen sharply, and traditional fossil energy has been increasingly exhausted. Energy issues and environmental issues have gradually become two major issues of global concern. Under the pressure of sustainable development, major countries have listed the solar photovoltaic industry as the focus of the development and utilization of renewable energy. With my country becoming the second largest economy in the world, in October 2013, China's oil imports in October reached 6.3 million barrels per day, surpassing the 6.24 million barrels per day of the United States, replacing the United States as the world's largest net oil importer for the first time. In 2013, China's foreign dependence on oil and natural gas reached 58.1% an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L31/18
CPCH01L21/67271H01L31/1876Y02P70/50
Inventor 邱文良
Owner 江苏博阳智能装备有限公司
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