Silicon wafer separator

Abstract

The present invention relates to a silicon wafer separator. The silicon wafer separator comprises a working platform, a clamping mechanism, a side-end sucking disc and a top-end sucking disc. The working plane of the working platform is provided with a silicon wafer basket bearing area configured to bear a silicon wafer basket, the clamping mechanism is located at the upper portion of the workingplane of the working platform, the side-end sucking disc is located at one side of the silicon wafer basket bearing area on the working platform, the top-end sucking disc is located at the upper portion of the silicon wafer basket bearing area on the working platform, and the side-end sucking disc and the top-end sucking disc are inserted into the silicon wafer basket respectively through the sideend and the top end of the silicon wafer basket when being operated. The silicon wafer separator does not need to take out a silicon wafer in the silicon wafer basket in advance, can separate the silicon wafers sucked together in the silicon wafer basket and employs the cooperation sucking effect of the side-end sucking disc and the top-end sucking disc to improve the wafer separation efficiency,reduce the probability of generation of fragments and subfissure of the silicon wafers in the wafer separation process and achieve whole-process automatic operation of the wafer separation of the silicon wafers with no need for manual processing.

Description

technical field [0001] The invention relates to the technical field of silicon wafer processing, in particular to a silicon wafer slicer. Background technique [0002] During the process of single-sided texturing of silicon wafers in the black silicon tank machine, the two silicon wafers located in the same basket tooth of the silicon wafer flower basket will be attracted together due to the tension of the liquid, and the surface textured silicon wafers will be completed. After the wafers come out of the black silicon tank machine, the silicon wafers in the silicon wafer flower basket need to be separated before they can enter the texture cleaning chain machine for surface cleaning, drying, subsequent inspection and packaging of the silicon wafers. At present, the artificial slicing method is adopted for silicon wafer slicing. Not only is the slicing efficiency low, it is easy to cause fragments and cracks, and the acid-base solution mixed in silicon wafers will also cause h...

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to provide a silicon wafer slicing machine for the problems of low efficiency, unstable quality and easy health damage caused by manual slicing of silicon wafers.

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