Silicon wafer separator

A slicing machine, silicon wafer technology, applied in sustainable manufacturing/processing, electrical components, climate sustainability, etc. Sharding efficiency, the effect of realizing full automation, reducing the probability of fragmentation and cracking

Pending Publication Date: 2018-09-14
YANGZHOU XIEXIN PHOTOVOLTAIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to provide a silicon wafer slicing machine for the problems of low efficiency, unstable quality and easy health damage caused by manual slicing of silicon wafers.

Method used

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Embodiment Construction

[0019] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0020] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as...

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Abstract

The present invention relates to a silicon wafer separator. The silicon wafer separator comprises a working platform, a clamping mechanism, a side-end sucking disc and a top-end sucking disc. The working plane of the working platform is provided with a silicon wafer basket bearing area configured to bear a silicon wafer basket, the clamping mechanism is located at the upper portion of the workingplane of the working platform, the side-end sucking disc is located at one side of the silicon wafer basket bearing area on the working platform, the top-end sucking disc is located at the upper portion of the silicon wafer basket bearing area on the working platform, and the side-end sucking disc and the top-end sucking disc are inserted into the silicon wafer basket respectively through the sideend and the top end of the silicon wafer basket when being operated. The silicon wafer separator does not need to take out a silicon wafer in the silicon wafer basket in advance, can separate the silicon wafers sucked together in the silicon wafer basket and employs the cooperation sucking effect of the side-end sucking disc and the top-end sucking disc to improve the wafer separation efficiency,reduce the probability of generation of fragments and subfissure of the silicon wafers in the wafer separation process and achieve whole-process automatic operation of the wafer separation of the silicon wafers with no need for manual processing.

Description

technical field [0001] The invention relates to the technical field of silicon wafer processing, in particular to a silicon wafer slicer. Background technique [0002] During the process of single-sided texturing of silicon wafers in the black silicon tank machine, the two silicon wafers located in the same basket tooth of the silicon wafer flower basket will be attracted together due to the tension of the liquid, and the surface textured silicon wafers will be completed. After the wafers come out of the black silicon tank machine, the silicon wafers in the silicon wafer flower basket need to be separated before they can enter the texture cleaning chain machine for surface cleaning, drying, subsequent inspection and packaging of the silicon wafers. At present, the artificial slicing method is adopted for silicon wafer slicing. Not only is the slicing efficiency low, it is easy to cause fragments and cracks, and the acid-base solution mixed in silicon wafers will also cause h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/18
CPCH01L31/18Y02P70/50
Inventor 张喜唐亮季威
Owner YANGZHOU XIEXIN PHOTOVOLTAIC TECH
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