Silicon wafer separation mechanism

A silicon wafer, body technology, applied in conveyor objects, sustainable manufacturing/processing, electrical components, etc., can solve the problems of low slicing efficiency and discontinuity, and achieve the effect of high slicing efficiency

Inactive Publication Date: 2016-04-06
SUZHOU BOYANG ENERGY EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The invention patent application with the publication number CN103681968A discloses an automatic wafer inserting machine, which uses a suction cup to grab silicon wafers for splitting and inserting. There is a problem of low fragmentation efficiency

Method used

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  • Silicon wafer separation mechanism
  • Silicon wafer separation mechanism
  • Silicon wafer separation mechanism

Examples

Experimental program
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Embodiment

[0023] Embodiment: A kind of silicon wafer slicing mechanism

[0024] See attached Figure 1~5 As shown, a silicon chip slicing mechanism includes a silicon chip slicing mechanism body 1, and the silicon chip slicing mechanism body 1 is provided with two parallel and spaced conveyor belts 2 downwards. The silicon chip slicing mechanism The main body 1 is provided with an air hole 3 facing the conveyor belt 2 , and the air hole 3 communicates with an air extraction device (not shown in the figure) through a pipeline; the front end of the conveyor belt 2 in the conveying direction is provided with a roller 4 .

[0025] A preferred embodiment is: the conveyor belt 2 is a synchronous belt.

[0026] A preferred embodiment is: the synchronous belt is sheathed on the driving wheel and the driven wheel, and the driving wheel is in transmission connection with the driving device.

[0027] A preferred embodiment is: the driving device is a driving motor, and the output shaft of the dr...

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PUM

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Abstract

A silicon wafer separation mechanism comprises a silicon wafer separation mechanism body. Two parallel conveyor belts arranged in a spaced manner are arranged on the silicon wafer separation mechanism body downwards. Air holes are formed in the silicon wafer separation mechanism body towards the conveyor belts and communicated with air suction devices through pipelines. Idler wheels are arranged at the front ends of the conveyor belts in the conveying direction. The air suction devices and the conveyor belts are adopted for combined action, so that stacked silicon wafers are separated, and the silicon wafer separation mechanism has the advantage of being high in wafer separation efficiency.

Description

technical field [0001] The invention relates to a silicon chip slicing mechanism, which belongs to the field of auxiliary equipment for preparing solar cells. Background technique [0002] Since the beginning of the 21st century, global energy consumption has risen sharply, and traditional fossil energy has been increasingly exhausted. Energy issues and environmental issues have gradually become two major issues of global concern. Under the pressure of sustainable development, major countries have listed the solar photovoltaic industry as the focus of the development and utilization of renewable energy. With my country becoming the second largest economy in the world, in October 2013, China's oil imports in October reached 6.3 million barrels per day, surpassing the 6.24 million barrels per day of the United States, replacing the United States as the world's largest net oil importer for the first time. In 2013, China's foreign dependence on oil and natural gas reached 58.1%...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/90H01L31/18
CPCB65G47/90H01L31/1876Y02P70/50
Inventor 邱文良
Owner SUZHOU BOYANG ENERGY EQUIP
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