Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Silicon wafer separation mechanism

A silicon wafer, body technology, applied in conveyor objects, sustainable manufacturing/processing, electrical components, etc., can solve the problems of low slicing efficiency and discontinuity, and achieve the effect of high slicing efficiency

Inactive Publication Date: 2016-04-06
SUZHOU BOYANG ENERGY EQUIP
View PDF11 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention patent application with the publication number CN103681968A discloses an automatic wafer inserting machine, which uses a suction cup to grab silicon wafers for splitting and inserting. There is a problem of low fragmentation efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Silicon wafer separation mechanism
  • Silicon wafer separation mechanism
  • Silicon wafer separation mechanism

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0023] Embodiment: A kind of silicon wafer slicing mechanism

[0024] See attached Figure 1~5 As shown, a silicon chip slicing mechanism includes a silicon chip slicing mechanism body 1, and the silicon chip slicing mechanism body 1 is provided with two parallel and spaced conveyor belts 2 downwards. The silicon chip slicing mechanism The main body 1 is provided with an air hole 3 facing the conveyor belt 2 , and the air hole 3 communicates with an air extraction device (not shown in the figure) through a pipeline; the front end of the conveyor belt 2 in the conveying direction is provided with a roller 4 .

[0025] A preferred embodiment is: the conveyor belt 2 is a synchronous belt.

[0026] A preferred embodiment is: the synchronous belt is sheathed on the driving wheel and the driven wheel, and the driving wheel is in transmission connection with the driving device.

[0027] A preferred embodiment is: the driving device is a driving motor, and the output shaft of the dr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A silicon wafer separation mechanism comprises a silicon wafer separation mechanism body. Two parallel conveyor belts arranged in a spaced manner are arranged on the silicon wafer separation mechanism body downwards. Air holes are formed in the silicon wafer separation mechanism body towards the conveyor belts and communicated with air suction devices through pipelines. Idler wheels are arranged at the front ends of the conveyor belts in the conveying direction. The air suction devices and the conveyor belts are adopted for combined action, so that stacked silicon wafers are separated, and the silicon wafer separation mechanism has the advantage of being high in wafer separation efficiency.

Description

technical field [0001] The invention relates to a silicon chip slicing mechanism, which belongs to the field of auxiliary equipment for preparing solar cells. Background technique [0002] Since the beginning of the 21st century, global energy consumption has risen sharply, and traditional fossil energy has been increasingly exhausted. Energy issues and environmental issues have gradually become two major issues of global concern. Under the pressure of sustainable development, major countries have listed the solar photovoltaic industry as the focus of the development and utilization of renewable energy. With my country becoming the second largest economy in the world, in October 2013, China's oil imports in October reached 6.3 million barrels per day, surpassing the 6.24 million barrels per day of the United States, replacing the United States as the world's largest net oil importer for the first time. In 2013, China's foreign dependence on oil and natural gas reached 58.1%...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/90H01L31/18
CPCB65G47/90H01L31/1876Y02P70/50
Inventor 邱文良
Owner SUZHOU BOYANG ENERGY EQUIP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com