Automatic silicon wafer distributing, conveying and positioning system

Abstract

The invention provides an automatic silicon wafer distributing, conveying and positioning system. The system comprises a mounting rack, a feeding and lifting mechanism, a silicon wafer distributing mechanism, a conveying mechanism and a self-centering mechanism, wherein the feeding and lifting mechanism is arranged on the mounting rack and is used for driving a silicon wafer box to upwards move, and a plurality of silicon wafers are overlapped in the silicon wafer box; the silicon wafer distributing mechanism is arranged at the rear side of the feeding and lifting mechanism, and the conveyingmechanism is arranged at the back of the silicon wafer distributing mechanism; and the self-centering mechanism is arranged at the upper part of one end of the conveying mechanism. According to the system, the feeding and lifting mechanism is arranged, and a silicon wafer overlapping area is formed on a silicon wafer bearing platform; a plurality of silicon wafers can be naturally overlapped in the silicon wafer overlapping area and move to the lower part of the silicon wafer distributing mechanism from bottom to top; the silicon wafer distributing mechanism is capable of automatically distributing the silicon wafers while being in contact with the silicon wafers; and meanwhile, the silicon wafers are continuously conveyed to a self-centering part for self-centering in an one-by-one mannerthrough the conveying mechanism; and the technical problems that a mode for manually positioning the silicon wafers is carried out in the prior art, the working efficiency is low, and both labor andmaterials are wasted, can be solved.

Description

technical field [0001] The invention relates to the technical field of monocrystalline silicon wafer production, in particular to a silicon wafer self-slicing transmission and positioning system. Background technique [0002] As a good conductive material, monocrystalline silicon wafers can be widely used in technical fields such as semiconductors and solar cells. In the later stages of the processing of single crystal silicon wafers, steps such as chamfering, grinding, corrosion, polishing and cleaning are generally required. Among them, chamfering refers to trimming the sharp edges of the cut wafers into circular arcs to prevent wafer edge cracking and lattice defects. , so it is a very important process step. [0003] However, the chamfering machine for monocrystalline silicon wafers in the prior art is more complicated to operate, generally only one workpiece can be processed at a time, the workpiece needs to be clamped frequently, and the processing efficiency is very ...

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides a self-slicing transfer positioning system for silicon wafers. By setting a loading and lifting mechanism and forming a silicon wafer stacking area on the silicon wafer carrier platform, several silicon wafers are naturally stacked in the silicon wafer stacking area. And move from bottom to top to the bottom of the slicing mechanism. The slicing mechanism contacts the silicon wafers to realize the automatic slicing of the silicon wafers. At the same time, the transmission mechanism continuously transfers them to the self-centering place one by one. Centering, to prepare for the subsequent production of silicon wafers to realize the orderly processing of multiple equipment, save the self-aligning steps before subsequent chamfering processing, improve the automation and production efficiency of silicon wafer processing, and solve the problems in the existing technology. Using the way of manual film placement, the work efficiency is low, and the waste of manpower and material resources is a big technical problem.

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