Chamfering processing equipment for full-automatic silicon wafer and processing technic thereof

Abstract

The invention provides chamfering processing equipment for a full-automatic silicon wafer and a processing technic thereof; the full-automatic processing equipment for silicon wafer chamfering can realize single slicing and self-centering of piled silicon wafers by a slicing loading device and a transmission self-centering device; afterwards, the silicon wafers finishing the self-centering are grabbed by a grabbing device and the wafers placed on a chamfering device are realized under the movement of a silicon wafer transferring device; after the chamfering of the silicon wafer is realized onthe chamfering device, an automatic taking device can collect the silicon wafer in a silicon wafer collection box after taking the wafers; a processing method of one transferring mechanism matching with a plurality of sets of chamfering equipment is realized; human resource is saved; the technical problem that the chamfering equipment does not realize complete full automatic and has low working efficiency is solved; the processing technic for the full-automatic silicon wafer realizes quick single slicing and self-centering of the silicon wafer by using a silicon wafer slicing process and a silicon wafer locating process; and the silicon wafer can be transported to a plurality sets of chamfering equipment to conduct chamfering processing by using the silicon wafer transportation and siliconwafer placing.

Description

technical field [0001] The invention relates to the technical field of monocrystalline silicon wafer production, in particular to a fully automatic silicon wafer chamfering processing equipment and a processing technology thereof. Background technique [0002] As a good conductive material, monocrystalline silicon wafers can be widely used in technical fields such as semiconductors and solar cells. In the later stages of the processing of single crystal silicon wafers, steps such as chamfering, grinding, corrosion, polishing and cleaning are generally required. Among them, chamfering refers to trimming the sharp edges of the cut wafers into circular arcs to prevent wafer edge cracking and lattice defects. , so it is a very important process step. [0003] However, the chamfering machine for monocrystalline silicon wafers in the prior art is more complicated to operate, generally only one workpiece can be processed at a time, the workpiece needs to be clamped frequently, and...

AI Technical Summary

Problems solved by technology

[0005] However, the above-mentioned patents have not fully realized the full automation of the chamfering of single crystal silicon wafers. The chamfering of silicon wafers requires manual placement of silicon wafers on the processing table, which still requires manual operation, which is time-consuming and laborious, and there is only one Chamfering station, low work efficiency

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