Silicon wafer transportation packaging box

A packaging box and silicon wafer technology, applied in the direction of transportation and packaging, packaging, containers to prevent mechanical damage, etc., can solve the problems of increasing production costs, a large number of fragments, etc., to achieve the effects of avoiding collisions, reducing fragmentation rates, and complete solutions

Inactive Publication Date: 2016-03-30
WUXI PRITEN TRANSMISSION MACHINERY
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This packaging method is simple and easy, but a lot of debris will be generated during the stacking and handling process, which increases the production cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Silicon wafer transportation packaging box
  • Silicon wafer transportation packaging box

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0015] In order to achieve the above object, the silicon wafer transport packaging box is realized by the following technical scheme: the silicon wafer transport packaging box includes a box body 1, a spacer 2, a storage slot 3 and a card slot 4, and the box body 1 Divided into 6 to 12 storage slots 3 by the spacer 2, a card slot 4 is installed on the top side wall of the storage slot 3; the card slot 4 is composed of two spherical beads; the specifications of the spacer 2 are the same; The specifications of the storage tank 3 are the same; the box body 1 is a cylinder; the height of the spacer 2 is the same as that of the box body 1; the specifications of the two spherical beads in the card slot 4 are the same; the two spherical beads in the card ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a silicon wafer transportation packaging box. The silicon wafer transportation packaging box comprises a box body (1), partition pieces (2), storage grooves (3) and clamping grooves (4). The box body (1) is divided into the 6-12 storage grooves (3) by the partition pieces (2). The clamping grooves (4) are installed in the side walls of the tops of the storage grooves (3). Each clamping groove (4) is composed of two spherical bead bodies. The partition pieces (2) are of the same specification. The storage grooves (3) are of the same specification. According to the silicon wafer transportation packaging box, through the arrangement of shock-resistant layers, collision between the storage layers and silicon wafers can be effectively avoided, and the breakage rate of the silicon wafers in the transferring process can be effectively decreased. The silicon wafer transportation packaging box has high promotional value in the technical field of manufacturing of silicon wafer containers.

Description

technical field [0001] The invention relates to the technical field of silicon chip container manufacturing, in particular to a silicon chip transport packaging box. Background technique [0002] Chips made of silicon wafers are known as "magic operators" with amazing computing power. No matter how complicated the math problem, physics problem or engineering problem is, and no matter how much calculation workload is, as long as the staff tell it the problem through the computer keyboard, and issue the ideas and instructions to solve the problem, the computer can solve the problem in a very short time I will tell you the answer. In this way, problems that would take years or decades to calculate manually may be solved by a computer in minutes. Even for some problems that human beings cannot calculate the results, the computer can quickly tell you the answer. [0003] In the production process of silicon wafers for solar cells, silicon wafers need to be packaged and transpo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B65D81/02B65D85/86B65D25/04
CPCB65D81/02B65D25/04H05K13/0084
Inventor 杨国兴
Owner WUXI PRITEN TRANSMISSION MACHINERY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap