Evaporator temperature equalizing and cooling plate

Abstract

The invention discloses an evaporator temperature equalizing and cooling plate belonging to the technical field of the evaporation cooling device. The invention is characterized in that an evaporator temperature equalizing and cooling plate comprises a cooling plate wall face, a seal frame arranged at outside periphery of the cooling plate wall face, and a working medium inlet and a working medium outlet arranged on the seal frame; the inner cavity of the cooling plate wall face is separated into multiple mutually communicated gas flow channels through reinforcing ribs; the gas flow channels are filled with working media; and capillary structures are arranged on the inner wall faces of the gas flow channels. According to the evaporator temperature equalizing and cooling plate of the invention, the problem that the working media in the existing evaporation cooling plate are distributed unevenly and the partial temperature is overhigh is solved; the problem that the temperature of the ordinary evaporation cooling plate is uneven is remarkably improved; and the flow resistance of the working media in the cooling plate is reduced.

Description

Technical field [0001] The invention belongs to the technical field of evaporative cooling devices, and specifically relates to an evaporator uniform temperature cold plate. Background technique [0002] With the development of society and the advancement of technology, the integration of electronic devices has become higher and higher, and the resulting heating power density has also become higher and higher, and the temperature requirements between some components of electronic devices are consistent. The heat dissipation technology puts the test. Evaporative heat dissipation technology has become an ideal product for heat dissipation of electronic equipment due to its high convection heat transfer coefficient during phase change, high latent heat of phase change, and constant evaporation temperature when determining the evaporation pressure. It is also an ideal product for heat dissipation of electronic equipment. . However, the current terminal equipment water-cooled plate ...

AI Technical Summary

Problems solved by technology

However, there are some problems in the water-cooled plate of the terminal equipment in the current evaporative heat dissipation system, which may easily cause problems such as uneven temperature of the cold plate and air blockage, which will have a major impact on the development of existing equipment. A new cold plate structure is urgently needed to solve the above problems.

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