A special-shaped heat conduction cable with mounting fins
A technology for installing fins and special shapes, which is applied in the field of space heat conduction in aerospace technology to achieve the effects of reducing weight, reducing thermal resistance and reducing thermal resistance.
Active Publication Date: 2018-09-14
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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Problems solved by technology
[0004] In order to solve the problems existing in the prior art, the present invention provides a special-shaped heat conduction cable with mounting fins, which mainly solves the problem that the components cannot be mounted on a plane or the thermal resistance between the components and the heat conduction cable is large, and the heating parts of the components Irregular heat dissipation requirements, to realize the design of heat conduction installation interface for components with a specific structure
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[0017] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments.
[0018] A special-shaped heat conduction cable with mounting fins, the heat conduction cable includes: a head wrapping a heat dissipation device, a copper braid 2 and a mounting tape 3; both ends of the copper braid 2 are respectively fixed to wrap the head of a heat dissipation device and the installation tape 3; The head and the copper braid 2 are welded into a whole under vacuum conditions, and the mounting belt 3 is installed on the cold source. Wrap the head of the heat dissipation device and / or mount the fins 5 on the mounting strip. Mounting holes 6 are arranged on the fins 5 . The head wrapping the heat dissipation device has a thermal conductive filler to enhance heat transfer. The structure of the head wrapping the heat dissipation device is rectangular, circular or other irregular shapes. Both the head wrapping the cooling device ...
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A special-shaped heat conduction cable with mounting fins relates to the space heat conduction field of aerospace technology, which mainly solves the heat dissipation requirements that the components cannot be installed on a plane or the thermal resistance between the components and the heat conduction cable is large, and the structure of the heating part of the components is irregular. Realize the design of heat conduction installation interface for components with a specific structure. The heat conduction cable includes: a head wrapping the heat dissipation device, a copper braid and a mounting belt; both ends of the copper braid are respectively fixed to wrap the head of the heat dissipation device and the installation belt; the installation belt is installed on the cold source. The invention can design the corresponding head structure according to the shape of the connection part of the heat dissipation device; the invention does not require a mounting bracket and reduces the weight of the product itself. The weight of the thermal cables is also reduced. The cost of launching aerospace products is high, and this product can greatly reduce the cost of launching while achieving effective heat dissipation.
Description
technical field [0001] The invention relates to the space heat conduction field of aerospace technology, in particular to a special-shaped heat conduction cable with fins installed. Background technique [0002] As the power of spacecraft continues to increase, the requirements for heat dissipation also increase accordingly. Among them, the power consumption of components is gradually increasing, and the demand for heat dissipation is increasing. Especially for components with small mass and high calorific value, the temperature rises rapidly. Designing high-emissivity coatings and installing radiators can no longer meet their heat dissipation needs. [0003] Installing thermal cables is an effective way to achieve rapid heat dissipation of high-power devices. However, due to the limitation of the head structure of the thermal cables, currently the thermal cables can only be installed on the flat part of the heat sink. For devices without a mounting plane (for example, the ...
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IPC IPC(8): H05K7/20
CPCH05K7/20409
Inventor 刘春龙郭亮吴清文韩康胡日查张旭升黄勇杨献伟毛阿龙
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI