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Bonded assembly provided with an intermediate deformation layer with variable flexibility

An intermediate layer and bonding technology, applied in the connection of rods, connecting components, lamination, etc., can solve problems such as difficulty in implementation, uncertainty, and limited benefits

Active Publication Date: 2016-08-17
COLD PAD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in some configurations it is impractical to apply the additional amount of material and after adding the glue creates uncertainty in terms of exact performance near the edges
Additionally, the process is costly to implement and requires additional precautions during installation and / or production
Moreover, the benefits obtained are quite limited

Method used

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  • Bonded assembly provided with an intermediate deformation layer with variable flexibility
  • Bonded assembly provided with an intermediate deformation layer with variable flexibility
  • Bonded assembly provided with an intermediate deformation layer with variable flexibility

Examples

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Embodiment Construction

[0094] reference Figure 4A to Figure 4C These figures show examples of the glued assembly AC according to the present invention. The bonding assembly includes a first substrate S1 and a second substrate S2.

[0095] In the example shown, the first substrate S1 is a reinforcement element used to repair, protect and / or reinforce the structure including the second substrate S2. The reinforcement element may take the form of a plate superimposed on the structural wall, usually a plate made of metal, composite material, or any other material rigid enough to reinforce the structure.

[0096] The component AC includes an intermediate layer CID called "deformation" and a glue AD, which constitutes the unit E. The adhesive AD is arranged between the substrates S1 and S2, and it is intended to rigidly connect them together by means of the CID layer. The adhesive AD includes the bonding interface with the substrate S2 and the CID layer. The CID layer includes a first interface INT1 for rig...

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PUM

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Abstract

The invention concerns a bonded assembly designed, in particular, for assembling a substrate to a structure or indeed to reinforce a structure. The bonded assembly (AC) comprises at least: first (S1) and second (S2) substrates, an intermediate layer (CID) rigidly connected to the first substrate, and having flexibility that varies along the first substrate, the variable flexibility resulting from a variation in the thickness of at least one material of the intermediate layer, an adhesive (AD) between said intermediate layer and the second substrate.

Description

Technical field [0001] The present invention relates to the technology of implementing glued components. [0002] Its application fields are very wide. Among them, the use that can be mentioned is to connect a component to a substrate, especially a substrate that does not have an attached component at the beginning, or to strengthen a structure that needs to be more resistant to repair or prevent the structure defect. Background technique [0003] In the field of glued components, a glue can be used to connect at least two substrates. This is especially the case with solutions for strengthening structures, which are usually implemented by applying metal or composite reinforcement (first substrate) to the structure (second substrate) by means of an adhesive. The glue may be a resin, which is usually provided on the contact surface of the two substrates to provide mechanical retention between the two, thus forming a glued assembly. [0004] However, the glued components will experie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B7/12F16B11/00F16B7/02B32B5/14B32B3/26B32B33/00B32B7/022
CPCB32B5/142B32B7/12B32B3/263F16B11/006B32B2307/54B32B2307/546B32B2419/00B32B7/022B32B37/144
Inventor 金-菲利普·科特
Owner COLD PAD
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