Substrate integrated waveguide device and substrate integrated waveguide filter

A substrate-integrated waveguide and filter technology, applied in the field of communication, can solve the problems that cannot meet the requirements of microwave integrated circuits, and achieve the effect of reducing the volume

Active Publication Date: 2018-03-20
GUANGDONG MIKWAVE COMM TECH
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  • Abstract
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Problems solved by technology

[0004] Based on this, it is necessary to provide a small substrate integrated waveguide device and substrate integrated waveguide filter for the p

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  • Substrate integrated waveguide device and substrate integrated waveguide filter
  • Substrate integrated waveguide device and substrate integrated waveguide filter
  • Substrate integrated waveguide device and substrate integrated waveguide filter

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Embodiment Construction

[0018] In order to explain in detail the technical solutions of the substrate-integrated waveguide device and the substrate-integrated waveguide filter of the present invention, some related content will be introduced below.

[0019] The substrate-integrated waveguide is a new type of microwave transmission line, which uses metal vias to realize the field propagation mode of the waveguide on the dielectric substrate. SIW is widely used in wireless communication systems due to its advantages of high quality factor, large power capacity, easy processing and low cost. However, researchers have found that it still has shortcomings, that is, compared with other components in microwave circuits, the circuit layout The occupied area is larger. In order to reduce the size of the SIW filter while maintaining high performance, researchers have proposed some miniaturization methods. In order to reduce the size of the SIW filter while maintaining high performance. Researchers have propos...

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Abstract

The invention provides a substrate integrated waveguide device and a substrate integrated waveguide filter. The substrate integrated waveguide filter includes at least substrate integrated waveguide resonant cavity assemblies, a surface metal layer, a bottom surface metal layer and an intermediate metal layer, wherein single substrate integrated waveguide resonant cavity assembly includes a firstdielectric substrate layer, a second dielectric substrate layer and a metal layer; the metal layer is arranged between the first dielectric substrate layer and the second dielectric substrate layer; the metal layer is provided with a C type slit; the first dielectric substrate layer, the second dielectric substrate layer and the metal layer are each provided with metal through holes for preventingenergy leakage; the C type slit is coupled with the energy of the upper and lower layers; and the metal layer, the adjacent metal layer and the dielectric substrate layers between the metal layer andthe adjacent metal layer form a 1/2N mode substrate integrated waveguide structure. The whole substrate integrated waveguide filter utilizes the reasonable stacked multi-layer structure, and can reduce the volume of the integrated waveguide resonant cavity on the premise of guaranteeing that the substrate integrated waveguide performance is not changed, thus effectively solving the problem that the structural size of the metal waveguide is too large and is not easy to be integrated.

Description

technical field [0001] The invention relates to the technical field of communication, in particular to a substrate integrated waveguide device and a substrate integrated waveguide filter. Background technique [0002] Miniaturized, integrated, and high-performance bandpass filters are one of the essential modules of modern wireless communication systems. Because of the large loss and low power capacity of the microstrip filter, the structure size of the metal waveguide is too large, and it is not easy to integrate, so the substrate integrated waveguide technology has been widely valued. [0003] Substrate Integrated Waveguide (SIW) is widely used in wireless communication systems due to its advantages of high quality factor, large power capacity, easy processing and low cost, but it still has shortcomings, that is, compared with microwave circuits For other components, the occupied area of ​​the circuit layout is larger. Contents of the invention [0004] Based on this, ...

Claims

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Application Information

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IPC IPC(8): H01P3/18H01P1/208
CPCH01P1/208H01P3/18
Inventor 苏道一朱永忠
Owner GUANGDONG MIKWAVE COMM TECH
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