Heat preservation plate based on organic materials

A technology of organic materials and thermal insulation boards, applied in thermal insulation, building components, applications, etc., can solve problems such as unsatisfactory sound absorption effect, short service life and poor mechanical strength of thermal insulation boards

Inactive Publication Date: 2018-07-10
天津百代欣贸机电设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The sound absorption effect of the traditional heat insulation board is not ideal, and because it is only one layer of foam plastic board, the mechanical strength is very poor and the service life is very short

Method used

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  • Heat preservation plate based on organic materials
  • Heat preservation plate based on organic materials

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Experimental program
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Embodiment Construction

[0016] In order to better understand the present invention, the present invention will be further described below in conjunction with specific embodiments and accompanying drawings.

[0017] Such as Figure 1-2 As shown, a thermal insulation board based on organic materials includes an upper cover plate 1 , a middle plate 4 and a lower cover plate 5 . The lower end surface of the upper cover plate 1 and the edge position of the upper end surface of the lower cover plate 5 are provided with a ring of connecting protrusions, and the edge positions of the upper end surface and the lower end surface of the middle plate 4 are respectively provided with a ring of connecting grooves. The upper cover plate 1 and the lower cover plate 5 are plugged and fixed to the middle plate 4 respectively. The upper cover plate 1 and the lower cover plate 5 are designed to be plugged and fixed with the middle plate 4 respectively, so that the insulation board based on organic materials has a detac...

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PUM

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Abstract

The invention provides a heat preservation plate based on organic materials. The heat preservation plate comprises an upper cover plate body, a middle plate body and a lower cover plate body. A circleof connecting bulge is arranged in each of the edge positions of the lower end face of the upper cover plate body and the upper end face of the lower cover plate; a circular connecting groove is formed in each of the edge positions of the upper end face and the lower end face of the middle plate body; the upper cover plate body and the lower cover plate body are fixed to the middle plate in an inserted-connection mode; the upper cover plate body and the lower cover plate body are reinforced plates; and a plurality of circular mounting holes evenly distributed in a linear array mode are formedin the middle plate and filled with heat insulation blocks made of foam plastic, and the middle plate is made of thermoplastic polyurethane engineering materials. The heat preservation plate has thebeneficial effects that the design has multiple advantages of being detachable, high strength, high heat insulation, high sound absorption capability and the like, and accordingly the heat preservation plate has the functions of heat preservation and noise reduction through combination.

Description

technical field [0001] The invention relates to the technical field of organic material products, in particular to a thermal insulation board based on organic materials. Background technique [0002] With the continuous development of the economy, people's working and living conditions are also being improved accordingly, and people's requirements for living and working environments are getting higher and higher, especially for noise indicators. A relatively quiet living and working environment makes it easier for people to devote themselves to life and work without being distracted by noisy sounds. Therefore, a quiet environment is easier to improve the quality of life and work efficiency. The traditional noise reduction method is to install sound-absorbing panels in the walls of houses or workshops. In traditional building materials, no sound-absorbing panels are specially added, but only the relatively low-cost heat-insulating panels, that is, foam plastics, are used to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04B1/90B32B27/40B32B3/08B32B3/24B32B27/06B32B33/00
CPCE04B1/90B32B3/085B32B3/266B32B27/06B32B27/40B32B33/00B32B2250/40B32B2266/0228B32B2307/102B32B2307/304B32B2607/00
Inventor 周丽峰
Owner 天津百代欣贸机电设备有限公司
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