Joint loan method based on cloud monitoring and a related device

A cloud monitoring and loan technology, applied in the loan field, can solve the problems of customers unable to obtain loan funds in time, single method, unable to meet customer loan needs, etc.

Pending Publication Date: 2019-05-24
PING AN TECH (SHENZHEN) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

When a customer applies for a loan from a certain loan company, if the loan amount applied by the customer exceeds the current loan amount of the certain loan company, the customer

Method used

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  • Joint loan method based on cloud monitoring and a related device
  • Joint loan method based on cloud monitoring and a related device
  • Joint loan method based on cloud monitoring and a related device

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Embodiment Construction

[0023] In order to make those skilled in the art better understand the solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only The embodiments are part of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the scope of protection of the present application.

[0024] Each of them will be described in detail below.

[0025] The terms "first", "second", "third" and "fourth" in the description and claims of the present application and the drawings are used to distinguish different objects, rather than to describe a specific order . Furthermore, the terms "comprising" and "having" an...

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PUM

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Abstract

The invention discloses a joint loan method based on cloud monitoring and a related device, applied to a cloud server. The method comprises the following steps: receiving a first signaling from a first loan company server, wherein the first signaling is used for requesting to select loan companies except the first loan company to carry out joint loan on the client; wherein the first signal carriesfirst basic information of a first loan company, the first signal is sent by a server of the first loan company under a set condition, and the set condition comprises determining that the first loanamount is greater than the current allowable loan amount of the first loan company; sending a second signaling to the electronic device of the client; receiving target loan basic information fed backby the electronic equipment for the second signaling; determining N second loan companies based on the target loan basic information and/or the first basic information; And notifying M second loan companies in the N second loan companies and the bank to carry out joint loan. By adopting the embodiment of the invention, the joint loan modes can be enriched, and the loan requirements of customers are met.

Description

technical field [0001] The present application relates to the field of loan technology, and in particular, to a combined loan method and related devices based on cloud monitoring. Background technique [0002] A joint loan is provided by at least two institutions (such as banks, loan companies, etc.) together to provide loans to customers (such as individuals, businesses, etc.). Due to regulatory requirements, the state has strict restrictions on the lending qualifications of each loan company, for example, it cannot exceed several times the registered capital of the loan company. When a customer applies for a loan to a loan company, if the loan amount applied by the customer exceeds the current loan limit of the loan company, the customer will not be able to obtain loan funds in time. It can be seen that the existing joint loan method is relatively simple, and in some cases, it cannot meet the loan needs of customers. SUMMARY OF THE INVENTION [0003] The embodiments of...

Claims

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Application Information

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IPC IPC(8): G06Q40/02
Inventor 李芳云
Owner PING AN TECH (SHENZHEN) CO LTD
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