Epoxy adhesive with low-temperature rapid curing

A fast curing, epoxy glue technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of insufficient adhesion, intolerance to boiling, low curing rate, etc., to achieve super strong adhesion, The effect of super strong resistance to double 85 ability

Inactive Publication Date: 2019-08-30
上海本诺电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the defects of the above-mentioned existing adhesives that require high temperature baking or low curing rate, insufficient adhesion, not resistant to water boiling, and not suitable for use as adhesives for camera modules of mobile phones and other equipment, and provide A low-temperature fast-curing epoxy glue

Method used

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  • Epoxy adhesive with low-temperature rapid curing
  • Epoxy adhesive with low-temperature rapid curing
  • Epoxy adhesive with low-temperature rapid curing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～5

[0028] Examples 1 to 5 respectively relate to a low-temperature fast-curing epoxy glue; the composition and dosage thereof are shown in Table 1, respectively.

[0029] Prepare the low-temperature fast-curing epoxy glue according to the ratio in Table 1. First, add the composition in Table 1 in order except the filler, mix, three-roll grinding, and make the base, then add filler and toner as needed, mix, and three-roll Grinding, mixing and degassing, you can get low-temperature fast-curing epoxy glue.

example 1

[0031] Bisphenol A epoxy resin CDY-28 15 Toughener PB3600 10 Polymercaptan QE-340M 15 coupling agent A-187 0.2 Accelerator CN-24 1.2 filler TS720 2.5 Toner F5RK 0.2

example 2

[0033] Bisphenol F epoxy resin EP-830 15 Toughener MX154 12 Polymercaptan EH-310 15 coupling agent A-187 0.2 Accelerator DMP-30 1.2 filler R812 2.5 Toner F5RK 0.2

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PUM

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Abstract

The invention discloses an epoxy adhesive with low-temperature rapid curing. The epoxy adhesive comprises the following components in parts by weight: 30-40 parts of an epoxy resin, 20-30 parts of a toughening agent, 20-30 parts of a thiol curing agent and 5-10 parts of an aid. Thiol is selected, the problem of stability in an operation period is finally solved through PE1 of Showa Denko, by adjusting amounts of the thiol and a promoter, problems that curing is implemented at a velocity of 95 DEG C/3 minutes and the curing rate is less than 95% can be solved, the primary adhesiveness is greater than 30MPa, and the retention rate of the adhesiveness is 50% in 16 hours of water boiling at 121 DEG C in a sealed manner.

Description

technical field [0001] The invention belongs to the technical field of adhesives, in particular to a low-temperature fast-curing epoxy glue. Background technique [0002] With the rapid development of the mobile phone industry in recent years, the camera function of the mobile phone will directly affect the use effect of the mobile phone. Therefore, higher requirements are put forward for the adhesive used in the camera module, and high temperature baking can easily cause damage to the components of the camera module, and the general mercaptan system has problems such as short operation period and low curing rate. Insufficient adhesion, and not resistant to boiling and other problems. Therefore, there is a need for a low-temperature fast curing and a stable operating period. [0003] Chinese patent CN201710399657 discloses a high-humidity-resistant low-temperature curing epoxy adhesive, which has moisture resistance. Before curing, the glue can be stored in a high-humidity...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C08G59/66
CPCC08G59/66C09J11/04C09J163/00C08K7/26
Inventor 杨颖州
Owner 上海本诺电子材料有限公司
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