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Method and device for detecting memory chip installation

A memory chip and detection device technology, applied in the direction of measuring devices, measuring electricity, measuring electrical variables, etc., can solve the problems of memory chip damage, failure to find memory chip installation errors in time, and achieve the effect of avoiding accidental damage

Active Publication Date: 2022-04-26
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] This application provides a method and device for detecting the installation of a memory chip, the purpose of which is to solve the problem of accidental damage to the memory chip due to the inability to detect the installation error of the memory chip in time

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  • Method and device for detecting memory chip installation
  • Method and device for detecting memory chip installation
  • Method and device for detecting memory chip installation

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Embodiment Construction

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0035] Such as figure 1 As shown, it is a schematic structural diagram of a memory chip mounting detection device provided in the embodiment of the present application, and the device includes:

[0036] A current monitoring chip 100 , a hysteresis comparator 200 and a processing chip 300 .

[0037] Wherein, the input end of the current monitoring chip 100 is connected to the power supply end of the memory chip, and the output end is connected to the input end of the hysteresis comp...

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Abstract

This application provides a method and device for detecting the installation of a memory chip. When the memory chip is powered on, the current monitoring chip obtains the output current of the power supply terminal of the memory chip, converts the output current into a first level signal, and converts the first level signal to a hysteretic comparator. The hysteresis comparator compares the voltage value of the first level signal with a preset first threshold and a preset second threshold respectively, and sends the compared second level signal to the processing chip. Wherein, the preset first threshold is smaller than the preset second threshold, and the second level signal includes a high level signal or a low level signal. The processing chip determines the installation condition of the memory chip according to the second level signal. In this application, when the memory chip is powered on, the current monitoring chip and the hysteresis comparator are used to judge whether the output current of the memory chip is abnormal. The chip was accidentally damaged due to incorrect installation.

Description

technical field [0001] The present application relates to the technical field of electronic circuits, in particular to a method and device for detecting the installation of a memory chip. Background technique [0002] During the production and development process of the server, it is necessary to test and debug the flash memory chip in the server. When testing and debugging the memory chip, it is necessary to install the memory chip on the base of the memory chip. Since the pins of the memory chip are symmetrically distributed in double columns, the debugger may install the memory chip upside down on the base of the memory chip, causing the memory Chip installation error. If the memory chip is installed incorrectly, it will cause the memory chip to work abnormally and affect the use of the server. If the installation error of the memory chip is not discovered in time, the memory chip will heat up and burn out due to abnormal operation. [0003] Therefore, there is an urge...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R19/165G01R31/28
CPCG01R19/16571G01R31/2896
Inventor 胡广建
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD