Heat exchanger, refrigeration cycle device, and air conditioning device

A technology of heat exchangers and refrigerants, applied in heat exchange equipment, refrigeration and liquefaction, refrigerators, etc., can solve problems such as performance degradation and achieve good efficiency

Pending Publication Date: 2020-11-03
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the grooves of the heat transfer pipes in Patent Document 1 described above are not shaped to correspond to the flow paths of the heat transfer pipes.
Therefore, when heat exchangers are installed at a high density, there is a possibility of performance degradation

Method used

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  • Heat exchanger, refrigeration cycle device, and air conditioning device
  • Heat exchanger, refrigeration cycle device, and air conditioning device
  • Heat exchanger, refrigeration cycle device, and air conditioning device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0020]

[0021] figure 1 It is a schematic diagram showing the structure of the heat exchanger 1 according to Embodiment 1 of the present invention. exist figure 1 Among them, the heat exchanger 1 is a fin-and-tube heat exchanger including a plurality of heat exchanger bodies 10 and flow pipes 20 . As will be described later, heat exchange between the refrigerant passing through the heat transfer tubes 12 and the air passing between the plurality of fins 11 is performed in the heat exchanger main body 10 with respect to the refrigerant flowing in from the heat exchanger inlet 1A. The heat-exchanged refrigerant flows out from the heat exchanger outlet 1B. The flow pipe 20 is a pipe that connects the plurality of heat exchanger bodies 10 and serves as a refrigerant flow path. The channel pipe 20 is a pipe having a plurality of branches, such as a single pipe, a T-shaped pipe, or a bulge three-way pipe.

[0022] figure 2 It is a schematic diagram showing the structure of ...

Embodiment approach 2

[0033]

[0034] Embodiment 2 will be described focusing on points different from heat transfer pipe 12 of Embodiment 1. FIG. The heat transfer pipe 12 of the second embodiment basically has the same structure as the heat transfer pipe 12 described in the first embodiment, and has a plurality of spiral grooves 14 on the inner surface. Here, in Embodiment 1, there is no particular mention about the groove height h of the groove 14 . In the heat transfer pipe 12 according to Embodiment 2, the groove height h of the groove 14 on the inner surface is h≧0.06mm when L≦10m, and 0.06mm10m.

[0035]

[0036] Figure 7 It is a graph showing the correlation between the groove height h of the heat transfer pipe 12 and the performance inside the heat transfer pipe 12 according to Embodiment 2 of the present invention. exist Figure 7 In , the performance of the heat pipe 12 is represented by the heat transfer rate αi in the pipe. When the amount of refrigerant flowing through the he...

Embodiment approach 3

[0041] Figure 9 It is a figure which shows the structure of the refrigeration cycle apparatus concerning Embodiment 3 of this invention. Here, as an example of a refrigeration cycle device, an air conditioner 50 for cooling and heating a target space will be described. The air conditioner performs each process of evaporating, compressing, condensing, and expanding the refrigerant, and circulates the refrigerant while changing its phase from liquid to gas, and from gas to liquid, and transfers heat to the refrigerant, thereby cooling the air in the target space. adjust.

[0042] Figure 9 The air conditioner 50 has an outdoor unit (outdoor unit) 200 and an indoor unit (indoor unit) 100 . Furthermore, the compressor 210, the four-way valve 220, the heat source side heat exchanger 230, and the expansion device 240 included in the outdoor unit 200, and the load side heat exchanger 110 included in the indoor unit 100 pass through the gas refrigerant piping 300 and the liquid re...

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Abstract

This heat exchanger comprises a heat exchanger body having: a heat transmission pipe through which a fluid passes and which has a groove formed in the inner surface thereof, the groove being a recessspirally extending in the direction of the pipe axis; and a fin that is in contact with the heat transmission pipe to promote heat exchange of the fluid. If a flow path length L, which is the length of the heat transmission pipe, from the heat exchanger inlet to the heat exchanger outlet between which the fluid flows, is not greater than 10 m, the lead angle theta formed between the pipe axis andthe groove satisfies 25 degrees<=theta<=45 degrees, and if the flow path length L is greater than 10 m, the lead angle theta satisfies 5 degrees<=theta<25 degrees.

Description

technical field [0001] The present invention relates to a heat exchanger for exchanging heat, a refrigeration cycle device and an air conditioner. In particular, it relates to a heat exchanger having a heat transfer tube in which grooves are formed on the inner surface of the tube. Background technique [0002] Conventionally, in heat exchangers used in refrigeration cycle devices such as refrigerators, air conditioners, and heat pumps, a plurality of fins arranged at predetermined intervals are generally arranged so as to penetrate through holes provided in each fin. A heat pipe with grooves formed on the inner surface. The heat transfer tube is a part of the refrigerant circuit of the refrigeration cycle device, and fluid such as refrigerant flows inside. Hereinafter, the case where the refrigerant is a fluid will be described. [0003] And, the refrigerant flowing through such heat transfer tubes undergoes a phase change (condensation or evaporation) by heat exchange w...

Claims

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Application Information

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IPC IPC(8): F25B39/00F28D1/04F28F1/40F28F13/02
CPCF28F1/40F25B39/02F25B39/04F28D1/0477F28F1/32F28F1/06F28D2021/0061
Inventor宇贺神裕树
OwnerMITSUBISHI ELECTRIC CORP