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Dry ice sublimation cooling spray chamber device

A technology for cooling spray and spray cavity, which is used in household refrigeration devices, lighting and heating equipment, household appliances, etc., can solve the problems of inability to achieve the thermal insulation effect of dry ice spray cooling system, inapplicability, etc., to improve spray cooling efficiency and save consumption. , reduce the effect of heat transfer

Active Publication Date: 2021-12-03
NORTH CHINA UNIV OF WATER RESOURCES & ELECTRIC POWER
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the above-mentioned technical scheme is not applicable to the dry ice spray cooling technology, and cannot achieve the thermal insulation effect of the dry ice spray cooling system

Method used

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  • Dry ice sublimation cooling spray chamber device
  • Dry ice sublimation cooling spray chamber device
  • Dry ice sublimation cooling spray chamber device

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Embodiment Construction

[0030] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0031] Such as Figure 1 to Figure 3 As shown, a dry ice sublimation cooling spray chamber device in this embodiment is composed of a dry ice spray chamber 2 and a thermal insulation shell 1 nested inside and outside. The surface level is tightly bonded.

[0032] The thermal insulation shell 1 is provided with a circular entrance, and the thermal insulation shell is provided with a nozzle tube 101 extending downward at the circular entrance. The cone-like outer contour; the dry ice nozzle enters the dry ice spray chamber through the circular inlet and the nozzle channel, the diameter of the nozzle channel is slightly larger than the diameter of the dry ice noz...

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Abstract

The invention discloses a dry ice sublimation cooling spray chamber device. The dry ice sublimation cooling spray chamber device is formed by combining a dry ice spray chamber and a heat preservation shell in an inner-outer nesting mode. A nozzle pipe extending downwards is arranged at the inlet of the heat preservation shell, and a nozzle passage is formed in the inner diameter position of the nozzle pipe. The dry ice spray chamber sleeves the nozzle pipe through a through hole, a backflow gap is reserved between the through hole and the nozzle pipe, and a flow dividing structure is arranged at the backflow gap. Gaps are reserved between the top and the side part of the dry ice spray chamber and the heat preservation shell, and an outlet annular passage is formed in the gaps. An outlet communicating with the outlet annular passage is formed in the bottom of the heat preservation shell. A downward flow guide seat is arranged at the top of the dry ice spray chamber, a conical inner passage is formed in the flow guide seat, and the conical inner passage and the cone-like outer contour of the nozzle pipe form a divergent backflow passage. A gap is also reserved between the flow guide seat and the top of the dry ice spray chamber, and the gap communicates with the dry ice spray chamber to form a backflow annular passage. According to the dry ice sublimation cooling spray chamber device, the dry ice spray cooling efficiency can be improved, and the dry ice consumption is reduced.

Description

technical field [0001] The invention relates to the technical field of dry ice phase change spray cooling, in particular to a dry ice sublimation cooling spray chamber device. Background technique [0002] With the needs of computer, communication, military, aerospace and civilian markets, electronic technology has developed rapidly. The packaging density of electronic devices continues to increase, and its heat flux continues to increase. Electronic products continue to develop in the direction of miniaturization, with higher power and smaller dimensions. These development trends of electronic products make the problem of overheating of electronic equipment more and more prominent. The overheating of electronic equipment is one of the main reasons for the failure of electronic products, which seriously limits the improvement of the performance and reliability of electronic products, and also reduces the working life of the equipment. Therefore, the temperature rise in ele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25D3/12
CPCF25D3/12
Inventor 王为术徐维晖任坤朋李运泽牛靖尊姚紫琨岳晓明尚梦源翟禹鑫
Owner NORTH CHINA UNIV OF WATER RESOURCES & ELECTRIC POWER
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