Shielding cover, circuit board assembly and electronic equipment

A technology of shielding cover and circuit board, which is applied in the direction of electrical components, magnetic field/electric field shielding, etc., and can solve problems such as cover collapse and shielding cover reliability threat

Active Publication Date: 2021-12-03
HONOR DEVICE CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, on the circuit board where the components are densely packed and the space is

Method used

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  • Shielding cover, circuit board assembly and electronic equipment
  • Shielding cover, circuit board assembly and electronic equipment
  • Shielding cover, circuit board assembly and electronic equipment

Examples

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[0053] The terminology used in the embodiments of the present application is only used to explain the specific embodiments of the present application, not intended to limit the application.

[0054] In order to improve the sensitivity, anti-interference and other performance of electronic devices, interference, etc., often require shielding of sensitive signals or interference sources. The shield can shield the effect of the external electromagnetic wave on the circuit in the shield, and can avoid the electromagnetic wave exterior radiation generated in the shield.

[0055] Taking the mobile phone as an example, a shield cover is typically provided on the board in the phone, the shield is hooded to cover the components inside the board to avoid interference from other components inside the mobile phone.

[0056] figure 1 A structural diagram of setting a shield on a circuit board; figure 2 A schematic structural diagram of setting a shield on a circuit board in the circuit board....

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Abstract

The invention provides a shielding cover, a circuit board assembly and electronic equipment. The shielding cover comprises a cover body, wherein the cover body and a circuit board jointly enclose a shielding region, and at least part of components on the circuit board are covered in the shielding region. The components located in the cover body comprise a first device, the first device has a step face facing the cover body, a reinforcing part is arranged in the region, corresponding to the step face of the first device, of the cover body, at least part of the structure of the reinforcing part is located in the region, right facing the step face, of the cover body, the space formed above the step face of the first device is utilized, the reinforcing part is additionally arranged to increase the strength of the cover body, the surrounding region of the part corresponding to the step surface on the cover body is prevented from collapsing, and the stability and reliability of the shielding cover are improved. Moreover, the distance between the first device and the adjacent components is kept unchanged or the increase of the distance between the first device and the adjacent component is reduced, so that the circuit board can keep a densely arranged layout structure, the component layout area of the circuit board is saved, and the space utilization rate of the circuit board is improved.

Description

technical field [0001] The present application relates to the technical field of electromagnetic shielding, in particular to a shielding cover, a circuit board assembly and electronic equipment. Background technique [0002] Currently, terminal devices such as mobile phones, tablet computers, notebook computers, and personal digital assistants (Personal Digital Assistant, PDA) are generally provided with shielding covers for shielding electromagnetic wave signals. [0003] Taking the circuit board as an example, the shielding cover erected on the circuit board includes a support frame and a cover body. The support frame is fixed on the circuit board. The components on the circuit board are located in the area surrounded by the support frame. The cover body is connected to the support frame. Externally, the enclosure completely wraps the components inside to form a complete shielding structure. [0004] However, in areas where components are densely packed and the space is c...

Claims

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Application Information

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IPC IPC(8): H05K9/00
CPCH05K9/0024H05K9/0032H05K9/0035
Inventor 高久亮张翼鹤
Owner HONOR DEVICE CO LTD
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