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An intelligent dispensing equipment for electronic components

A dispensing technology for electronic components and components, which is applied to the device and coating of the surface coating liquid, which can solve the problems that easily affect the accuracy of dispensing and the quality of electronic components, so as to prevent mispointing and realize adjustment Effect

Active Publication Date: 2022-05-24
徐曼
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide an intelligent dispensing equipment for electronic components with convenient and quick dispensing, high dispensing accuracy and reduced manual labor intensity, which can solve the manual dispensing method proposed in the above background technology. Factors easily affect the accuracy of dispensing, thus affecting the quality of electronic components

Method used

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  • An intelligent dispensing equipment for electronic components
  • An intelligent dispensing equipment for electronic components
  • An intelligent dispensing equipment for electronic components

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Embodiment Construction

[0065] All features disclosed in this invention, or steps in all methods or processes disclosed, may be combined in any way except mutually exclusive features and / or steps.

[0066] Any feature disclosed in this disclosure (including any accompanying claims, abstract and drawings), unless expressly recited, may be replaced by other equivalents or serving a similar purpose. That is, unless expressly stated otherwise, each feature is but one example of a series of equivalent or similar features.

[0067] The following will be combined with the appendix in the embodiment of the present invention Figure 1 to Figure 11 The technical solutions in the novel embodiments are clearly and completely described, and obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts s...

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Abstract

The invention relates to a dispensing device, in particular to an intelligent dispensing device for electronic components. The invention discloses an electronic component intelligent dispensing device which is convenient and fast for dispensing glue, has high precision of dispensing glue and reduces manual labor intensity. An intelligent dispensing device for electronic components, comprising: a support frame and a baffle, three support frames are arranged at intervals between the lower parts of the baffles on both sides; a transmission mechanism, a transmission mechanism is provided between the two baffles; a dispensing mechanism , There is a glue dispensing mechanism between the upper and middle parts of the two baffles; a glue dispensing element, a glue dispensing element is arranged on the glue dispensing mechanism; a glue feeding mechanism, a glue feeding mechanism is arranged between the glue dispensing mechanism and the glue dispensing element. In the present invention, the output shaft of the deceleration motor drives the first rotating shaft to rotate, thereby driving the transmission component to transmit, and then drives the second rotating shaft to rotate, and the transmission component can transmit the electronic components to achieve the effect of transmitting the electronic components.

Description

technical field [0001] The invention relates to a glue dispensing device, in particular to an intelligent glue dispensing device for electronic components. Background technique [0002] With the continuous development of society, the application of electronic components is becoming more and more extensive. During the processing and production of electronic components, it is necessary to implement a dispensing process for electronic components, so that the electronic components can be fixed, insulated and moisture-proof. , The manual dispensing method is generally used. This method easily affects the accuracy of dispensing due to human factors, thereby affecting the quality of electronic components. [0003] Patent application CN210411369U, publication date 20200428, discloses a glue dispensing device for electronic components, including a base, the top of the base is connected with a groove, and the interior of the groove is connected with a card slot, and the base is provid...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C5/02B05C11/10B05C13/02
CPCB05C5/0208B05C11/1018B05C11/1002B05C13/02
Inventor 尚小雪
Owner 徐曼
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