A gold wire-free Schottky diode and its manufacturing method

A Schottky diode and gold wire technology, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of easy contact between gold wires and difficult welding of gold wires, etc., to improve waterproof performance, The effect of improving the heat dissipation capacity and prolonging the service life

Active Publication Date: 2022-06-07
先之科半导体科技(东莞)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the above problems, the present invention provides a Schottky diode free of gold wires and a manufacturing method thereof, without welding gold wires, which solves the problems that the gold wires are difficult to weld and the gold wires are easy to contact each other

Method used

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  • A gold wire-free Schottky diode and its manufacturing method
  • A gold wire-free Schottky diode and its manufacturing method
  • A gold wire-free Schottky diode and its manufacturing method

Examples

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Embodiment 1

[0035] like Figure 1-5 shown:

[0036] A gold wire-free Schottky diode, comprising an insulating package 1, a Schottky chip 2, a first pin 3, an auxiliary conductive sheet 4, and a second pin 5, and the Schottky chip 2 is located in the insulating package 1 Internally, the lower end of the Schottky chip 2 is electrically connected to the first pin 3, and the upper end of the Schottky chip 2 is electrically connected to the auxiliary conductive sheet 4;

[0037] The second pin 5 is fixed at the bottom of the insulating package 1, and the number of the second pin 5 is 4;

[0038] The insulating package 1 is provided with through holes in the same number as the second pins 5, the through holes are located on one side of the auxiliary conductive sheet 4, each through hole is filled with conductive resin 6, the auxiliary conductive sheet 4 is connected to the second lead Electrical connection is achieved between 5 through conductive resin 6 .

[0039] Preferably, the auxiliary ...

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PUM

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Abstract

The invention provides a gold wire-free Schottky diode, comprising an insulating package shell, a Schottky chip, a first pin, an auxiliary conductive sheet, and a second pin, and the Schottky chip is located in the insulating package Inside the shell, the lower end of the Schottky chip is electrically connected to the first pin, and the upper end of the Schottky chip is electrically connected to the auxiliary conductive sheet; the second pin is fixed on the insulating package The bottom of the shell; the insulating packaging shell is provided with through holes consistent with the number of the second pins, the through holes are located on one side of the auxiliary conductive sheet, each of the through holes is filled with conductive resin, The electrical connection between the auxiliary conductive sheet and the second pin is realized through the conductive resin. The Schottky diode and the manufacturing method thereof of the present invention do not need to weld gold wires, and solve the problems that the gold wires are difficult to weld and the gold wires are easy to contact each other.

Description

technical field [0001] The invention relates to the technical field of Schottky diodes, in particular to a gold wire-free Schottky diode and a manufacturing method thereof. Background technique [0002] For a Schottky diode with multiple pins, the Schottky chip is usually connected to the pins by gold wire bonding. With this Schottky diode structure, the following problems will occur: ① Due to the size of the Schottky chip Small, the gold wire is difficult to weld, the welding efficiency is low, and the equipment cost is high; ② the gold wires are easy to contact during the packaging process, resulting in a short circuit. SUMMARY OF THE INVENTION [0003] In view of the above problems, the present invention provides a gold wire-free Schottky diode and a manufacturing method thereof, which does not require welding gold wires, and solves the problems of difficult welding of gold wires and easy mutual contact between gold wires. [0004] To achieve the above object, the pres...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/495H01L23/31H01L23/49H01L23/367
CPCH01L23/3107H01L23/49H01L23/49548H01L23/3672H01L2224/32245H01L2924/181H01L2224/33181H01L2924/00012
Inventor 焦庆
Owner 先之科半导体科技(东莞)有限公司
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