Circuit structure and control method thereof

Abstract

The invention provides a circuit structure and a control method thereof. The circuit structure comprises an electric connection module which comprises N electric connection structures, and two ends of each electric connection structure are respectively connected with a first switch unit and a second switch unit; the first circuit module is used for controlling on or off of the first switch unit according to the voltage change of the first side of the electric connection structure; the second circuit module is used for controlling the on or off of the second switch unit according to the voltage change of the second side of the electric connection structure; when the first switch unit and the second switch unit are in the on state at the same time, data are transmitted from the first switch unit to the second switch unit, or data are transmitted from the second switch unit to the first switch unit. Therefore, the electric connection structure can realize two-way transmission of data, and the performance of an electric device adopting the circuit structure, such as a semiconductor device, is improved.

Description

technical field [0001] The present disclosure relates to the technical field of semiconductors, and in particular to a circuit structure and a control method thereof. Background technique [0002] In the circuit structure, the electrical connection between each device unit is realized through an electrical connection structure. For example, in a stacked memory device, the electrical connection between semiconductor chips of each layer is usually realized through a through silicon via (Through Silicon Via, TSV). [0003] It is difficult to bidirectionally transmit data through the through-silicon vias between the semiconductor chips electrically connected through the through-silicon vias, which limits the performance of the stacked memory device. Contents of the invention [0004] The following is an overview of the subject matter described in detail in this disclosure. This summary is not intended to limit the scope of the claims. [0005] The disclosure provides a circu...

AI Technical Summary

Problems solved by technology

[0003] It is difficult to bidirectionally transmit data through silicon vias between semiconductor chips that are electrically connected through silicon vias, which limits the performance of stacked memory devices.

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