Rigid-flex printed circuit board and manufacturing method thereof

Abstract

The invention relates to a rigid-flex board and a manufacturing method thereof. A first covering film and a second covering film are respectively attached to the upper surface and the lower surface of a preset flexible area of a flexible board; a first flexible through window is formed in the position of the first prepreg in the preset flexible area, and a second flexible through window is formed in the position of the second prepreg in the preset flexible area; a first adhesive tape is pre-attached to the first rigid plate, a second adhesive tape is pre-attached to the second rigid plate, and the first adhesive tape and the second adhesive tape are milled; and sequentially laminating the first rigid plate, the first adhesive tape, the first prepreg, the first covering film, the flexible plate, the second covering film, the second prepreg, the second adhesive tape and the second rigid plate, arranging the first adhesive tape in the first flexible through window, arranging the second adhesive tape in the second flexible through window, and laminating to obtain the rigid-flexible combined plate. Compared with the prior art, the rigid-flex printed circuit board can be prevented from being attacked by liquid medicine and kept intact, the manufacturing reliability and the production efficiency of the rigid-flex printed circuit board are improved, and the production cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board manufacturing, and in particular to a rigid-flexible board and a manufacturing method thereof. Background Art

[0002] As electronic products develop towards miniaturization, portability and high reliability, rigid-flex boards are particularly suitable for today's electronic products that require light, thin, short and small features due to their bendability, foldability, size reduction, weight reduction and easy assembly. The market demand is growing. Rigid-flex boards are printed circuit boards that connect the hard board parts at both ends into a whole through a soft board, and have complete electrical properties. The flexible area of ​​the rigid-flex board is formed by removing the rigid area of ​​a specific layer of the rigid-flex board to expose the flexible area, and the process of removing a specific layer of the rigid board is called the uncovering process. At present, the uncovering of the rigid-flex board generally involves first opening a window in the inner dielectric layer, filling the window area with a PTFE (Poly tetra fluoro ethylene) gasket, and then pressing it together with the flexible board and the rigid board as a whole, and then uncovering it by controlling the depth of the milling groove. For rigid-flex boards with a rigid layer thickness of ≤0.3mm on the outside of the flexible layer, the flexible area is generally protected by PI (Polyimide) tape and made by the exposed method. This makes the flexible area vulnerable to the risk of being attacked by chemicals, leading to quality problems. Both of the above methods require manual pre-pasting of PTFE to fill the window area or affixing PI tape to protect the flexible area, which costs a lot of manpower and time, and has low alignment accuracy. It is also easy to contaminate and scratch the brown layer on the board surface, leading to quality risks.

[0003] Patent publication number CN108419381A discloses a method for making a rigid-flexible board, including the following steps: processing a second circuit layer on a flexible board according to preset requirements, and attaching a first covering film at the second circuit layer position corresponding to a preset flexible area; processing a third circuit layer on a rigid board, and attaching a second covering film at the third circuit layer position; opening a flexible through window at the first prepreg position; laminating the flexible board, the first prepreg, and the rigid board to obtain a prefabricated board; opening the cover on the rigid board to obtain a rigid-flexible board. However, this method only fills the window area to avoid indentations during lamination, and still requires manual lamination, has low alignment accuracy, and requires a lot of time and labor, and has low efficiency. Summary of the invention

[0004] The purpose of the present invention is to provide a rigid-flexible board and a method for manufacturing the same in order to overcome the defect of low manufacturing efficiency of the rigid-flexible board in the prior art, so as to prevent the rigid-flexible board from being attacked by chemicals and remain intact, improve the reliability and production efficiency of the rigid-flexible board manufacturing, and reduce the production cost.

[0005] The purpose of the present invention can be achieved by the following technical solutions:

[0006] In one aspect, the present invention provides a method for manufacturing a rigid-flexible board, comprising the following steps:

[0007] The first covering film and the second covering film are respectively attached to the upper surface and the lower surface of the flexible area preset in the flexible plate;

[0008] A first flexible through window is provided at a first prepreg position of the preset flexible zone, and a second flexible through window is provided at a second prepreg position of the preset flexible zone;

[0009] Pre-bonding a first adhesive tape on a first rigid plate, pre-bonding a second adhesive tape on a second rigid plate, and milling the first adhesive tape and the second adhesive tape to remove waste materials outside the area corresponding to the flexible zone;

[0010] According to preset requirements, the first rigid board, the first tape, the first semi-cured sheet, the first covering film, the flexible board, the second covering film, the second semi-cured sheet, the second tape, and the second rigid board are stacked in sequence, the first tape is arranged in the first flexible through-window, the second tape is arranged in the second flexible through-window, and they are pressed together to obtain a rigid-flexible composite board.

[0011] Furthermore, the first adhesive tape is a single-sided polyimide tape, with its adhesive surface facing the first rigid board; the second adhesive tape is a single-sided polyimide tape, with its adhesive surface facing the second rigid board.

[0012] Furthermore, the first adhesive tape pre-laminated on the first rigid plate is a whole piece of adhesive tape, and the single side length of the first adhesive tape after milling is 0.1 to 1 mm smaller than the single side length of the flexible zone;

[0013] The second adhesive tape pre-laminated on the second rigid plate is a whole piece of adhesive tape, and the single side length of the second adhesive tape after milling is 0.1-1 mm smaller than the single side length of the flexible zone.

[0014] Furthermore, the single side length of the first flexible through window is 0.2 to 1 mm longer than the single side length of the flexible zone;

[0015] The single side length of the second flexible through window is 0.2-1 mm longer than the single side length of the flexible zone.

[0016] Furthermore, the first covering film and the second covering film are polyimide covering films.

[0017] Furthermore, the single side length of the first covering film is 0.3 to 1.0 mm longer than the single side length of the flexible zone;

[0018] The length of one side of the second covering film is 0.3 to 1.0 mm longer than that of one side of the flexible region.

[0019] Furthermore, the flexible plate and the first rigid plate are connected and bonded at locations other than the flexible area where they are in contact with each other via the first prepreg;

[0020] The flexible plate and the second rigid plate are connected and bonded together at locations other than the flexible area where they are in contact with each other via the second prepreg.

[0021] Furthermore, the first prepreg is a no-flow prepreg, and the second prepreg is a no-flow prepreg.

[0022] Furthermore, the first adhesive tape and the second adhesive tape are milled by laser milling, which can improve positioning accuracy and reduce errors caused by manual milling and manual bonding.

[0023] Furthermore, the first rigid board further includes a first circuit layer and a second circuit layer located on the upper surface and the lower surface thereof respectively, and the first circuit layer and the second circuit layer are structures inherent to the first rigid board.

[0024] The second rigid board further comprises a third circuit layer and a fourth circuit layer respectively located on the upper surface and the lower surface thereof, and the third circuit layer and the fourth circuit layer are structures inherent to the second rigid board;

[0025] The flexible board also includes a fifth circuit layer and a sixth circuit layer respectively located on the upper surface and the lower surface thereof, and the fifth circuit layer and the sixth circuit layer are the self-contained structures of the flexible board.

[0026] Furthermore, the thickness of the first rigid plate is 0.075-0.45 mm, and the thickness of the second rigid plate is 0.075-0.45 mm.

[0027] Furthermore, before the upper and lower surfaces of the flexible area preset in the flexible board are respectively bonded with the first covering film and the second covering film, the flexible board is cut to determine the size and thickness of the flexible board, and then the pattern is produced on the flexible board to determine the position, size and pattern of the flexible area.

[0028] Furthermore, after the rigid-flexible board is obtained by pressing, it also includes processing holes at preset positions of the rigid-flexible board, copper plating, outer layer pattern production, solder mask processing, surface treatment, electrical testing, and appearance processing, and then removing the first rigid board and the second rigid board at the corresponding positions of the flexible area to expose the flexible area, that is, uncovering, to obtain a rigid-flexible board product.

[0029] Furthermore, a plurality of holes are obtained by processing holes at preset positions of the rigid-flex board, and the holes do not pass through the flexible area.

[0030] Furthermore, the specific process of the copper plating is: using copper plating equipment to perform hole metallization on the rigid-flexible board.

[0031] Furthermore, the specific process of making the outer layer pattern is: using a laser direct imaging (LDI) device to transfer the image to the surface of the rigid-flexible board to form a pattern.

[0032] Furthermore, the specific process of the solder resist treatment is: applying solder resist to the area where the device does not need to be soldered to prevent damage or short circuit or open circuit abnormalities during subsequent use.

[0033] Furthermore, the specific process of the surface treatment is: surface treatment is performed by chemical deposition or spraying.

[0034] Furthermore, the specific process of the electrical test is: electrical performance testing to prevent defective products with short circuits or open circuits from flowing out.

[0035] Furthermore, the specific process of the appearance processing is: using a gong machine to gong and mill the waste area of ​​the rigid-flexible composite board to obtain a finished rigid-flexible composite board.

[0036] On the other hand, the present invention further provides a rigid-flexible board, which is manufactured by the above-mentioned method for manufacturing a rigid-flexible board.

[0037] Compared with the prior art, the present invention has the following advantages:

[0038] (1) The present invention attaches a first tape to a first rigid board, attaches a second tape to a second rigid board, mills the first tape and the second tape, leaves the tape at a position corresponding to the flexible area, removes excess frame waste, and does not need to open windows on the first rigid board and the second rigid board. During the production process, the flexible area can be prevented from leaking out, and the first covering film and the second covering film on the surface can be prevented from being attacked by chemicals and remain intact, especially for a rigid-flexible board with a thickness of ≤0.3 mm for the first rigid board and the second rigid board on the outside of the flexible board.

[0039] (2) The present invention does not require opening windows on the first rigid plate and the second rigid plate, thereby reducing the process of manually laminating PTFE gaskets or PI tapes to fill the window areas, avoiding scratches or contamination on the first rigid plate and the second rigid plate due to errors in manual lamination, reducing quality risks, improving reliability, and also improving production efficiency and positioning accuracy.

[0040] (3) The present invention attaches the first adhesive tape to the first rigid board, attaches the second adhesive tape to the second rigid board, and combines the first rigid board, the flexible board, and the second rigid board by pressing, rather than attaching the first adhesive tape and the second adhesive tape to the first covering film and the second covering film. This can avoid the situation in which the first adhesive tape and the first covering film, and the second adhesive tape and the second covering film are tightly attached during the subsequent uncovering process, thereby facilitating the smooth progress of the uncovering process.

[0041] (4) The present invention can avoid leakage of the flexible area during the production process by attaching the first tape to the first rigid board and the second tape to the second rigid board, thereby preventing the first covering film and the second covering film on the surface from being attacked by the medicine and remaining intact. The first rigid board and the second rigid board can be used directly without setting a semi-cured sheet between the first rigid board and the first circuit layer and the second circuit layer, and without setting a semi-cured sheet between the second rigid board and the third circuit layer and the fourth circuit layer, thereby reducing the production steps of the first rigid board and the second rigid board, reducing raw materials, reducing production costs and time costs, and greatly improving the production efficiency of the first rigid board and the second rigid board. In particular, for rigid-flexible boards with ≤6 layers, fine-tuning the stacking and preferably using the overlay method can save the semi-cured sheet used for interlayer bonding and reduce production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 The schematic diagram of the stacking of the rigid-flex board shown in Example 1;

[0043] Figure 2 It is a schematic diagram of pre-bonding the first adhesive tape to the first rigid plate shown in Example 1;

[0044] Figure 3 It is a schematic diagram of pre-bonding the second adhesive tape to the second rigid plate shown in Example 1;

[0045] Figure 4 is a schematic diagram of the flexible board shown in Example 1;

[0046] Figure 5 This is a schematic diagram of a finished rigid-flex board shown in Example 1;

[0047] Figure 6 This is a production flow chart of the rigid-flexible board product shown in Example 1.

[0048] Description of the markings in the figure:

[0049] 10-first rigid board, 101-first adhesive tape, 102-first circuit layer, 103-second circuit layer;

[0050] 20-second rigid board, 201-second adhesive tape, 202-third circuit layer, 203-fourth circuit layer;

[0051] 30-first prepreg, 301-first flexible through window;

[0052] 40-a second prepreg, 401-a second flexible through window;

[0053] 50-flexible board, 501-flexible area, 502-fifth circuit layer, 503-sixth circuit layer;

[0054] 60-a first covering film;

[0055] 70- second covering film;

[0056] 80-Hole. DETAILED DESCRIPTION

[0057] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments are implemented based on the technical solution of the present invention, and detailed implementation methods and specific operation processes are given, but the protection scope of the present invention is not limited to the following embodiments. In the following embodiments or embodiments, if there is no special description of the functional components or structures, it means that they are all conventional components or conventional structures used in the art to achieve the corresponding functions.

[0058] It should be noted that in the description of the present invention, the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0059] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0060] Example 1

[0061] A method for manufacturing a rigid-flexible board, such as Figures 1 to 6 As shown, the following steps are included:

[0062] S1, cutting the flexible plate 50 to determine the size and thickness of the flexible plate 50;

[0063] S2, making a circuit pattern on the flexible board 50, and determining the position, size and pattern of the flexible area 501;

[0064] S3, attaching the first cover film 60 and the second cover film 70 to the upper surface and the lower surface of the flexible area 501 respectively;

[0065] S4, opening a first flexible through window 301 at the first prepreg 30 position of the preset flexible zone 501, and opening a second flexible through window 401 at the second prepreg 40 position of the preset flexible zone 501;

[0066] S5, pre-bonding the first adhesive tape 101 on the first rigid board 10, pre-bonding the second adhesive tape 201 on the second rigid board 20, milling the first adhesive tape 101 and the second adhesive tape 201, and removing the waste outside the area corresponding to the flexible area 501, such as Figures 1 to 3 As shown;

[0067] S6, according to the preset requirements, the first rigid board 10, the first tape 101, the first prepreg 30, the first cover film 60, the flexible board 50, the second cover film 70, the second prepreg 40, the second tape 201, and the second rigid board 20 are stacked in sequence, so that the first tape 101 is arranged in the first flexible through window 301, and the second tape 201 is arranged in the second flexible through window 401, and pressed together to obtain a rigid-flexible composite board, such as Figure 1 As shown;

[0068] S7, processing holes at the preset positions of the rigid-flexible board, copper plating, outer layer pattern production, solder mask processing, surface treatment, electrical testing, and appearance processing, and then removing the first rigid board 10 and the second rigid board 20 at the corresponding position of the flexible area 501 to expose the flexible area 501, that is, uncovering, to obtain a rigid-flexible board product, such as Figure 5 shown.

[0069] In this embodiment, the first tape 101 is a single-sided polyimide tape, with its adhesive surface facing the first rigid board 10 ; the second tape 201 is a single-sided polyimide tape, with its adhesive surface facing the second rigid board 20 .

[0070] In this embodiment, the first adhesive tape 101 pre-laminated on the first rigid plate 10 is a whole piece of adhesive tape, and the single side length of the first adhesive tape 101 after milling is 0.3 mm smaller than the single side length of the flexible area 501, and can also be other sizes within 0.1 to 1 mm;

[0071] The second adhesive tape 201 pre-laminated on the second rigid plate 20 is a whole piece of adhesive tape, and the single side length of the second adhesive tape 201 after milling is 0.3 mm smaller than the single side length of the flexible area 501, and can also be other sizes within 0.1-1 mm.

[0072] In this embodiment, the single side length of the first flexible through window 301 is 0.3 mm longer than the single side length of the flexible area 501, and may also be other sizes within 0.2 to 1 mm;

[0073] The single side length of the second flexible through window 401 is 0.3 mm longer than the single side length of the flexible area 501 , and may also be other sizes within the range of 0.2 to 1 mm.

[0074] In this embodiment, the first cover film 60 and the second cover film 70 are polyimide cover films.

[0075] In this embodiment, the length of a single side of the first covering film 60 is 0.5 mm longer than that of a single side of the flexible area 501, and may also be other sizes within the range of 0.3 to 1.0 mm;

[0076] The length of a single side of the second covering film 70 is 0.5 mm longer than that of a single side of the flexible area 501 , and may also be other sizes within a range of 0.3 to 1.0 mm.

[0077] In this embodiment, the flexible board 50 and the first rigid board 10 are connected and bonded at locations other than the flexible area 501 where the flexible board 50 and the first rigid board 10 are in contact with each other through the first prepreg 30 ;

[0078] The flexible board 50 and the second rigid board 20 are connected and bonded together at locations other than the flexible area 501 where the flexible board 50 and the second rigid board 20 are in contact with each other through the second prepreg 40 .

[0079] In this embodiment, the first prepreg 30 is a no-flow prepreg, and the second prepreg 40 is a no-flow prepreg.

[0080] In this embodiment, the first tape 101 and the second tape 201 are milled by laser milling, which can improve positioning accuracy and reduce the errors of manual milling and manual lamination. The process of manually laminating PTFE gaskets or PI tapes to fill the window area is reduced, and scratches or contamination on the first rigid board and the second rigid board caused by errors in manual lamination is avoided, quality risks are reduced, reliability is improved, and production efficiency and alignment accuracy are also improved.

[0081] In this embodiment, the first rigid board 10 further includes a first circuit layer 102 and a second circuit layer 103 located on the upper surface and the lower surface thereof respectively. The first circuit layer 102 and the second circuit layer 103 are structures inherent to the first rigid board 10 .

[0082] The second rigid board 20 further includes a third circuit layer 202 and a fourth circuit layer 203 located on the upper surface and the lower surface thereof respectively, and the third circuit layer 202 and the fourth circuit layer 203 are structures inherent to the second rigid board 20;

[0083] The flexible board 50 further includes a fifth circuit layer 502 and a sixth circuit layer 503 located on the upper surface and the lower surface thereof respectively. The fifth circuit layer 502 and the sixth circuit layer 503 are self-contained structures of the flexible board 50 .

[0084] In this embodiment, the thickness of the first rigid board 10 is 0.20 mm, and the thickness of the second rigid board 20 is 0.20 mm.

[0085] In this embodiment, a plurality of holes 80 are obtained by drilling holes at preset positions of the rigid-flex board, and the holes 80 do not pass through the flexible area 501. Conventional technical means of those skilled in the art are used.

[0086] In this embodiment, the specific process of the copper electroplating is: using electroplating equipment to metallize the holes of the rigid-flexible board, which adopts conventional technical means of those skilled in the art.

[0087] In this embodiment, the specific process of producing the outer layer pattern is: using LDI equipment to transfer the image to the surface of the rigid-flex board to form the pattern, which adopts conventional technical means of those skilled in the art.

[0088] In this embodiment, the specific process of the solder resist treatment is: solder resist is applied to the area where the device does not need to be soldered to prevent damage or short circuit or open circuit abnormalities during subsequent use. It adopts conventional technical means of those skilled in the art.

[0089] In this embodiment, the specific process of the surface treatment is: surface treatment is performed by chemical deposition or spraying, which adopts conventional technical means of those skilled in the art.

[0090] Furthermore, the specific process of the electrical test is: electrical performance test to prevent defective products with short circuit or open circuit from flowing out. It adopts conventional technical means of those skilled in the art.

[0091] In this embodiment, the specific process of the shape treatment is: using a gong machine to gong the waste area of ​​the rigid-flexible board to obtain a finished rigid-flexible board. It adopts conventional technical means of those skilled in the art.

[0092] In this embodiment, the rigid-flexible composite board manufactured by the manufacturing method includes a first rigid board 10, a first adhesive tape 101, a first semi-cured sheet 30, a first covering film 60, a flexible area 501, a second covering film 70, a second semi-cured sheet 40, a second adhesive tape 201, and a second rigid board 20. The flexible board 50 outside the flexible area 501 is connected to the first rigid board 10 through the first semi-cured sheet 30, and is connected to the second rigid board 20 through the second semi-cured sheet 40. The first semi-cured sheet 30 is provided with a first flexible through window 301 at a position corresponding to the flexible area 501, and the second semi-cured sheet 40 is provided with a second flexible through window 401 at a position corresponding to the flexible area 501. When bonding, the first adhesive tape 101 is arranged in the first flexible through window 301, and the second adhesive tape 201 is arranged in the second flexible through window 401. There is no need to open windows on the first rigid plate and the second rigid plate, which can prevent the flexible area from leaking out during the production process, and prevent the first covering film and the second covering film on the surface from being attacked by the liquid medicine and remain intact. It can avoid the situation where the first adhesive tape and the first covering film, and the second adhesive tape and the second covering film are closely attached to each other during the subsequent uncovering process, which is conducive to the smooth progress of the uncovering process. The production steps of the first rigid plate and the second rigid plate are reduced, the raw materials are reduced, the production cost and time cost are reduced, and the production efficiency of the first rigid plate and the second rigid plate is greatly improved.

[0093] Although the present invention has been described in detail above by means of general description, specific implementation methods and tests, it is obvious to those skilled in the art that some modifications or improvements may be made to the present invention. Therefore, these modifications or improvements made without departing from the spirit of the present invention all fall within the scope of protection claimed by the present invention.

Claims

1. A method for manufacturing a rigid-flexible board, characterized in that: The following steps are involved: A first covering film (60) and a second covering film (70) are respectively attached to the upper surface and the lower surface of a preset flexible area (501) of the flexible plate (50); A first flexible through window (301) is provided at the position of the first prepreg (30) in the preset flexible zone (501), and a second flexible through window (401) is provided at the position of the second prepreg (40) in the preset flexible zone (501); Pre-bonding a first adhesive tape (101) on a first rigid plate (10), pre-bonding a second adhesive tape (201) on a second rigid plate (20), milling the first adhesive tape (101) and the second adhesive tape (201), and removing waste materials outside the area corresponding to the flexible area (501); According to preset requirements, the first rigid board (10), the first adhesive tape (101), the first semi-cured sheet (30), the first covering film (60), the flexible board (50), the second covering film (70), the second semi-cured sheet (40), the second adhesive tape (201), and the second rigid board (20) are stacked in sequence, the first adhesive tape (101) is arranged in the first flexible through window (301), and the second adhesive tape (201) is arranged in the second flexible through window (401), and the rigid-flexible board is obtained by pressing together.

2. The method for manufacturing a rigid-flexible board according to claim 1, characterized in that: The first adhesive tape (101) is a single-sided polyimide adhesive tape, with its adhesive surface facing the first rigid plate (10); the second adhesive tape (201) is a single-sided polyimide adhesive tape, with its adhesive surface facing the second rigid plate (20).

3. The method for manufacturing a rigid-flexible board according to claim 1, characterized in that: The first adhesive tape (101) pre-laminated on the first rigid plate (10) is a whole piece of adhesive tape, and the length of a single side of the first adhesive tape (101) after milling is 0.1 to 1 mm smaller than the length of a single side of the flexible area (501); The second adhesive tape (201) pre-laminated on the second rigid plate (20) is a whole piece of adhesive tape, and the single side length of the second adhesive tape (201) after milling is 0.1 to 1 mm smaller than the single side length of the flexible area (501).

4. The method for manufacturing a rigid-flexible board according to claim 1, characterized in that: The single side length of the first flexible through window (301) is 0.2 to 1 mm longer than the single side length of the flexible area (501); The single side length of the second flexible through window (401) is 0.2 to 1 mm longer than the single side length of the flexible area (501).

5. The method for manufacturing a rigid-flexible board according to claim 1, characterized in that: The first covering film (60) and the second covering film (70) are polyimide covering films.

6. The method for manufacturing a rigid-flexible board according to claim 1, characterized in that: The length of a single side of the first covering film (60) is 0.3 to 1.0 mm longer than the length of a single side of the flexible area (501); The length of a single side of the second covering film (70) is 0.3 to 1.0 mm longer than the length of a single side of the flexible region (501).

7. The method for manufacturing a rigid-flexible board according to claim 1, characterized in that: The first rigid board (10) further comprises a first circuit layer (102) and a second circuit layer (103) respectively located on the upper surface and the lower surface thereof; The second rigid board (20) further comprises a third circuit layer (202) and a fourth circuit layer (203) respectively located on the upper surface and the lower surface thereof; The flexible board (50) further comprises a fifth circuit layer (502) and a sixth circuit layer (503) respectively located on the upper surface and the lower surface thereof.

8. The method for manufacturing a rigid-flexible board according to claim 7, characterized in that: The thickness of the first rigid plate (10) is 0.075-0.45 mm, and the thickness of the second rigid plate (20) is 0.075-0.45 mm.

9. The method for manufacturing a rigid-flexible board according to claim 1, characterized in that: After the rigid-flexible board is obtained by pressing, the method further includes processing opening holes at preset positions of the rigid-flexible board, copper plating, outer layer pattern production, solder mask processing, surface treatment, electrical testing, and appearance treatment, and then removing the first rigid board (10) and the second rigid board (20) at positions corresponding to the flexible area (501) to expose the flexible area (501) to obtain a rigid-flexible board product.

10. A rigid-flex board, characterized in that: The rigid-flexible board is manufactured by the method for manufacturing a rigid-flexible board according to any one of claims 1 to 9.

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