Semiconductor chip production and processing equipment

Abstract

The invention relates to the technical field of semiconductor chip production, and particularly discloses semiconductor chip production and processing equipment which comprises a machine body, a workbench and a supporting plate, the workbench and the supporting plate are fixedly installed on the inner wall of the machine body, a placing table used for placing a wafer is fixedly installed at the top of the workbench, the supporting plate is located above the workbench, and an air cylinder is fixedly installed at the top of the workbench. The output end of the air cylinder penetrates through the supporting plate in a sliding mode and is fixedly provided with a driving plate, the bottom of the driving plate is provided with a rotary dispatching mechanism, a rail stripping mechanism and an annular cutting mechanism, and a follow-up ejection mechanism is arranged between the placing table and the driving plate. The whole process is completed in a full-automatic manner and is realized by utilizing the intermittent period of scheduling movement of the laser head, and the cutting time is not occupied, so that the stripping efficiency and the stripping quality are greatly improved, and the wafer production period does not need to be prolonged at the same time.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip production, and more specifically, to a semiconductor chip production and processing equipment. Background Art

[0002] Semiconductor chips are semiconductor devices cut from semiconductor wafers and packaged. Semiconductor wafers are usually made of high-purity single-crystal silicon, in the shape of round slices, and their surfaces are specially treated to facilitate subsequent circuit processing. In the semiconductor wafer processing process, larger original wafers are often laser cut into smaller round wafers to meet the size requirements of specific products.

[0003] Laser cutting technology has high precision and good edge quality, which can ensure that the cut circular wafer has very smooth edges and reduce defects in subsequent processing. Laser cutting is non-contact and will not cause mechanical stress or damage to the wafer surface. It is particularly suitable for processing thick wafers or other fragile materials.

[0004] At present, laser cutting of wafers is generally done by fixing the original wafer with an adsorption clamp, and then cutting the wafer by controlling the laser movement through a multi-axis slide. After the entire original wafer is cut, the cut wafer is ejected by an ejector for unloading. However, this processing method still has certain defects: First, after the wafer is cut, it is usually unloaded by a unified ejection method. However, since there is still a weak connection between the cut wafer and the original wafer after laser cutting (also called "bridge" or "microbridge"), all wafers are ejected at once by direct ejection. Since there is no light touch unloading link, the wafer may be subjected to excessive mechanical stress during the ejection process, resulting in cracking or warping, especially when processing thin wafers or applications with high edge quality requirements.

[0005] Secondly, the current ejection and discharging usually requires a separate drive system to control the movement of the ejector rod, which means that the ejection operation and the cutting operation are independent and cannot be controlled synchronously. The connection between the two needs to be improved. At the same time, the separate ejection drive system increases the complexity of the equipment and may lead to more maintenance requirements and failure points.

[0006] Thirdly, the current method of adjusting the laser head position through a multi-axis slide makes it difficult to ensure high precision of the cutting path and consistency of the cutting after continuous adjustment, which will affect the cutting accuracy to a certain extent. Summary of the invention

[0007] The present invention provides a semiconductor chip production and processing device, which solves the current technical problem that all wafers are ejected at once by directly ejecting them after wafer cutting, which may cause warping of wafer edges.

[0008] The present invention provides a semiconductor chip production and processing equipment, comprising a body, a workbench and a support plate fixedly installed on the inner wall of the body, a placement table for placing wafers fixedly installed on the top of the workbench, the support plate is located above the workbench and a cylinder is fixedly installed on the top of the workbench, the cylinder output end slides through the support plate and a drive plate is fixedly installed, a rotary scheduling mechanism, a rail stripping mechanism and an annular cutting mechanism are arranged at the bottom of the drive plate, a follow-up ejection mechanism is arranged between the placement table and the drive plate, the rotary scheduling mechanism comprises a scheduling component and a driving component for driving the scheduling component, the rail stripping mechanism comprises a stripping component and a control component for controlling the stripping component, and the follow-up ejection mechanism comprises an adsorption component and an ejection component.

[0009] The scheduling component includes a rotating shaft rotatably installed at the bottom of the driving plate and a scheduling plate fixedly installed at the bottom end of the rotating shaft. The stripping component includes a reset sleeve fixedly installed at the bottom of the scheduling plate through a reset spring, a reset rod is fixedly installed in the reset sleeve, and a stripping touch plate is fixedly installed at the bottom of the reset rod.

[0010] After the adsorption component fixes the wafer, the annular cutting mechanism cuts the wafer for the first time, and then the scheduling component drives the scheduling plate to rotate to move the annular cutting mechanism to the next position. When the annular cutting mechanism moves to the next cutting point, the control component controls the stripping touch plate to lightly touch the wafer at the previous cutting position to strip the material.

[0011] Furthermore, the annular cutting mechanism includes a ring rail assembly, which includes a circular plate fixedly installed at the bottom of the scheduling plate and a ring rail fixedly installed at the bottom of the circular plate. The bottom of the ring rail is slidably connected to an electric slider, and the bottom of the electric slider is fixedly installed with a laser head through an L-shaped sleeve.

[0012] Furthermore, the driving assembly includes a driving motor fixedly mounted on the top of the driving plate, the output end of the driving motor slides through the driving plate and is fixedly mounted with a convex plate, a groove wheel is fixedly mounted on the outer side of the rotating shaft, and a lever that slides with the groove wheel is fixedly mounted on the bottom of the convex plate.

[0013] Furthermore, the control component includes a plurality of L-shaped rods fixedly mounted on the bottom of the driving plate and distributed in a circle, a corrugated cam disk is commonly mounted between the plurality of L-shaped rods, a steel ball slidably connected to the corrugated cam disk is fixedly mounted on the top of the reset rod, and a limit sleeve disposed on the outer side of the rotating shaft is fixedly mounted on the inner side of the corrugated cam disk through a plurality of round rods.

[0014] Furthermore, the placing table is composed of two upper and lower cones, the diameter of the lower cone is larger than that of the upper cone, the adsorption assembly includes a vacuum chamber opened in the upper cone and a convex cover fixedly installed on the inner wall of the bottom of the vacuum chamber, an exhaust port connected to the convex cover is opened on the right side of the lower cone, the convex cover is connected to the vacuum chamber, and an adsorption port connected to the vacuum chamber is opened on the top of the upper cone. The adsorption port is provided in two groups distributed inside and outside the circle, the outer adsorption port is used to adsorb the outer edge of the wafer, and the inner adsorption port is used to adsorb the part of the wafer to be cut off.

[0015] Furthermore, the ejection assembly includes two slide grooves opened on the upper circular platform and symmetrically arranged on the left and right sides, and a pull plate slidably connected in the slide grooves. An ejection plate is installed between the left and right pull plates. A plurality of ejection rods distributed in a circle are fixedly installed on the top of the ejection plate, and the ejection rods cooperate with the suction port on the inner side.

[0016] Furthermore, a sealing plate is fixedly mounted on the top of the pull plate, and a sealing groove is provided on the top of the slide groove for sealing and sliding cooperation with the sealing plate.

[0017] Furthermore, the follow-up ejection mechanism also includes two pull ropes fixedly installed on the bottom of the driving plate and symmetrically arranged on the left and right sides, and the two pull ropes are fixedly connected to the left and right pull plates respectively.

[0018] Furthermore, four guide cylinders distributed in a square are fixedly installed on the top of the lower truncated table, four guide columns distributed in a square are fixedly installed on the bottom of the driving plate, the four guide columns are respectively slidably matched with the corresponding guide cylinders, and a number of limit rods that slide through the support plate and are distributed in a circle are fixedly installed on the top of the driving plate, and a limit ring is commonly installed on the top of the number of limit rods.

[0019] Furthermore, the scheduling component also includes three sliding rods fixedly installed on the top of the scheduling plate and distributed in a triangle, and a mounting sleeve fixedly sleeved on the outside of the round rod. A disc is commonly installed at the bottom of several mounting sleeves, and an annular groove is opened at the bottom of the disc for sliding connection with the sliding rod.

[0020] The beneficial effects of the present invention are: 1. In the present application, through the special waveform design of the steel ball and the waveform cam disk, while the scheduling plate rotates to schedule the laser head, the steel ball cooperates with the waveform cam disk to first drive the stripping touch plate to move up and away from the original wafer, and then drive the material contact plate to gradually move down close to the first cut wafer, and rotate toward the cut wafer. When the steel ball reaches the next trough, the stripping touch plate lightly touches the cut wafer and applies slight pressure to help the cut wafer to completely fall off the original wafer, thereby realizing the automatic completion of the light touch stripping operation of the previous wafer when cutting the next wafer. The entire process is fully automated and is achieved by utilizing the intermittent period of the laser head scheduling movement, without occupying the cutting time, thereby greatly improving the stripping efficiency and quality without extending the wafer production cycle.

[0021] 2. In the present application, the cut wafer is first separated from the original wafer by lightly touching the stripping touch plate, which can pre-break the weak connection points between the wafers and reduce the resistance of the ejector rod during ejection, which not only improves the ejection efficiency, but also reduces the thrust required by the ejector rod. At the same time, after the light touch separation, the wafer has been partially separated from other wafers or supporting structures, and the ejector rod can apply force more evenly during ejection, ensuring that all wafers can be ejected smoothly, and avoiding the problem of direct ejection causing warping or damage to the wafer edge, thereby greatly improving the unloading efficiency.

[0022] 3. In this application, with the coordinated action of the waveform cam plate and the steel ball, the stripping contact plate completes the stripping action while the laser head just moves to the next cutting position to prepare for the next cutting. Therefore, the efficient synchronous operation between the laser head and the stripping contact plate greatly shortens the time of each cutting and stripping cycle, greatly improving production efficiency.

[0023] 4. In this application, intermittent rotation is achieved through the cooperation of the groove wheel and the lever, with each rotation of 60° to ensure that the laser head can accurately reach the next cutting position, thereby avoiding the cumulative error that may be caused by continuous rotation scheduling, and thus greatly improving the overall cutting accuracy.

[0024] 5. In this application, the process of light touch stripping is gradual, ensuring that each cut wafer will not be subjected to excessive mechanical stress during the initial separation, thereby protecting the integrity and surface quality of the wafer and avoiding direct application of excessive force that may cause the wafer to break or warp. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a three-dimensional structural schematic diagram of the present invention.

[0026] Figure 2 It is a schematic diagram of the internal three-dimensional structure of the machine body of the present invention.

[0027] Figure 3 It is a schematic diagram of the three-dimensional structure of the rail-type stripping mechanism, the annular cutting mechanism, the follower ejection mechanism and the driving plate part of the present invention.

[0028] Figure 4 It is a schematic diagram of the three-dimensional structure of the adsorption port, vacuum chamber, guide column, guide cylinder and placement table of the present invention.

[0029] Figure 5 The present invention Figure 4 A partial enlarged view of part A.

[0030] Figure 6 It is a three-dimensional structural schematic diagram of the rotary dispatching mechanism, laser head, reset spring, reset sleeve and stripping touch plate of the present invention.

[0031] Figure 7 It is a schematic diagram of the three-dimensional structure of the driving motor, convex plate, shifting rod, groove wheel and rotating shaft part of the present invention.

[0032] Figure 8 It is a schematic diagram of the three-dimensional structure of the L-shaped rod, the wave-shaped cam disc, the limit sleeve, the dispatching plate and the circular plate part of the present invention.

[0033] Fig. 9 It is a schematic diagram of the three-dimensional structure of the dispatching plate, circular plate, ring rail, electric slider and laser head part of the present invention.

[0034] In the figure: 1, machine body; 2, workbench; 3, support plate; 4, cylinder; 5, drive plate; 6, rotary dispatching mechanism; 7, rail stripping mechanism; 8, ring cutting mechanism; 9, follow-up ejection mechanism; 10, placement table; 11, guide column; 12, guide cylinder; 13, limit rod; 14, limit ring; 601, dispatching assembly; 602, drive assembly; 6011, rotating shaft; 6012, dispatching plate; 6013, slide rod; 6014, disc; 6015, annular groove; 6016, mounting sleeve; 6021, drive motor; 6022, groove wheel; 6023, convex plate; 6024, lever; 701, stripping assembly; 702, control assembly; 7011, reset Spring; 7012, reset sleeve; 7013, reset rod; 7014, stripping contact plate; 7021, limit sleeve; 7022, wave cam plate; 7023, steel ball; 7024, L-shaped rod; 801, laser head; 802, ring rail assembly; 8021, round plate; 8022, ring rail; 8023, electric slider; 8024, L-shaped sleeve; 901, adsorption assembly; 902, ejection assembly; 903, pull rope; 9011, vacuum chamber; 9012, convex cover; 9013, exhaust port; 9014, adsorption port; 9021, slide groove; 9022, pull plate; 9023, ejection rod; 9024, sealing plate; 9025, sealing groove; 9026, ejection plate. DETAILED DESCRIPTION

[0035] The subject matter described herein will now be discussed with reference to example embodiments. It should be understood that the discussion of these embodiments is to enable those skilled in the art to better understand and implement the subject matter described herein. The functions and arrangements of the elements discussed may be changed without departing from the scope of protection of the present specification. Various examples may omit, replace or add various processes or components as needed. In addition, the features described relative to some examples may also be combined in other examples.

[0036] See also Figure 1 , Figure 2 and Figure 6In this embodiment, a semiconductor chip production and processing equipment is proposed, including a body 1, a workbench 2 and a support plate 3 fixedly installed on the inner wall of the body 1, a placement table 10 for placing wafers is fixedly installed on the top of the workbench 2, the support plate 3 is located above the workbench 2 and a cylinder 4 is fixedly installed on the top of the workbench 2, the output end of the cylinder 4 slides through the support plate 3 and is fixedly installed with a driving plate 5, a rotating scheduling mechanism 6, a rail stripping mechanism 7 and a ring cutting mechanism 8 are arranged at the bottom of the driving plate 5, a follow-up ejection mechanism 9 is arranged between the placement table 10 and the driving plate 5, the rotating scheduling mechanism 6 includes a scheduling component 601 and a driving component 602 for driving the scheduling component 601, the rail stripping mechanism 7 includes a stripping component 701 and a control component 702 for controlling the stripping component 701, and the follow-up ejection mechanism 9 includes an adsorption component 901 and an ejection component 902.

[0037] See also Figure 1 , Figure 2 , Figure 4 and Figure 5 The placing table 10 is composed of two upper and lower truncated cones, the diameter of the lower truncated cone is larger than that of the upper truncated cone, the adsorption component 901 includes a vacuum chamber 9011 opened in the upper truncated cone and a convex cover 9012 fixedly installed on the inner wall of the bottom of the vacuum chamber 9011, and an air suction port 9013 connected to the convex cover 9012 is opened on the right side of the lower truncated cone, and the air suction port 9013 is connected to an external air pump, and the convex cover 9012 is connected to the vacuum chamber 9011. A suction port 9014 connected to the vacuum chamber 9011 is opened on the top of the upper truncated cone, and the suction port 9014 is opened in two groups distributed inside and outside the circumference, the outer suction port 9014 is used to adsorb the outer edge of the wafer, and the inner suction port 9014 is used to adsorb the part of the wafer to be cut off, and in the initial state (before cutting), the ejection component 902 blocks the inner suction port 9014.

[0038] During specific use, first start the cylinder 4 so that the output end of the cylinder 4 pushes the drive plate 5 to move downward a short distance to make the ejection assembly 902 fall and be pulled out from the inner suction port 9014, then place the cut original wafer on the top of the placement table 10, and evacuate the air in the vacuum chamber 9011 through an external air pump, and adsorb and fix the original wafer through the inner and outer suction ports 9014.

[0039] See also Figure 2 , Figure 3 , Figure 6 , Figure 7 and Fig. 9The scheduling component 601 includes a rotating shaft 6011 rotatably mounted on the bottom of the driving plate 5 and a scheduling plate 6012 fixedly mounted on the bottom end of the rotating shaft 6011. The annular cutting mechanism 8 includes a ring rail component 802. The ring rail component 802 includes a circular plate 8021 fixedly mounted on the bottom of the scheduling plate 6012 and a ring rail 8022 fixedly mounted on the bottom of the circular plate 8021. The bottom of the ring rail 8022 is slidably connected with an electric slider 8023. The bottom of the electric slider 8023 is fixedly mounted with a laser head 801 through an L-shaped sleeve 8024.

[0040] See also Figure 2 , Figure 3 , Figure 6 and Figure 7 The scheduling component 601 also includes three slide bars 6013 and a plurality of mounting sleeves 6016 fixedly mounted on the top of the scheduling plate 6012 and distributed in a triangular shape. A disc 6014 is commonly mounted on the bottom of the plurality of mounting sleeves 6016. An annular groove 6015 slidably connected to the slide bars 6013 is provided at the bottom of the disc 6014.

[0041] See also Figure 2 , Figure 3 , Figure 6 and Figure 7 The driving assembly 602 includes a driving motor 6021 fixedly mounted on the top of the driving plate 5, the output end of the driving motor 6021 slides through the driving plate 5 and is fixedly mounted with a convex plate 6023, a groove wheel 6022 is fixedly mounted on the outer side of the rotating shaft 6011, and a lever 6024 that slides with the groove wheel 6022 is fixedly mounted on the bottom of the convex plate 6023.

[0042] When in use, after fixing the original wafer, the output end of the control cylinder 4 is continued to push, driving the driving plate 5 to continue to move downward, thereby continuing to drive the laser head 801 to move downward. When the laser head 801 moves downward to the cutting point, the electric slider 8023 is controlled to circle the ring track 8022 for laser cutting (the cut wafer has not fallen off from the original wafer at this time, but is still weakly connected). After the cutting is completed, the drive motor 6021 is started, and the output shaft of the drive motor 6021 rotates to drive the convex plate 6023 to rotate, thereby driving the lever 6024 to move the groove wheel 6022, drives the groove wheel 6022 to rotate 60°, thereby driving the scheduling plate 6012 to rotate 60° through the rotating shaft 6011, and then the laser head 801 can be adjusted to the next cutting position, and the groove wheel 6022 and the lever 6024 cooperate to achieve intermittent rotation, each rotation of 60°, to ensure that the laser head 801 can accurately reach the next cutting position, thereby avoiding the cumulative error that may be caused by continuous rotation scheduling, and thus greatly improving the overall cutting accuracy, and continue to repeat the above operation after cutting the wafer again to achieve cutting of the entire original wafer.

[0043] See also Figure 3 , Figure 6 , Figure 7 , Figure 8 and Fig. 9 The stripping assembly 701 includes a reset sleeve 7012 fixedly installed on the bottom of the scheduling plate 6012 through a reset spring 7011, a reset rod 7013 is fixedly installed in the reset sleeve 7012, and a stripping touch plate 7014 is fixedly installed on the bottom of the reset rod 7013. With the rotating shaft 6011 as the center, the angle between the circular plate 8021 and the stripping touch plate 7014 is 60°.

[0044] See also Figure 6 , Figure 7 , Figure 8 and Fig. 9 The control component 702 includes a plurality of L-shaped rods 7024 fixedly mounted on the bottom of the driving plate 5 and distributed in a circle, a wave cam disc 7022 is installed between the plurality of L-shaped rods 7024, a steel ball 7023 slidably connected to the wave cam disc 7022 is fixedly mounted on the top of the reset rod 7013, a limit sleeve 7021 rotatably mounted on the outer side of the rotating shaft 6011 is fixedly mounted on the inner side of the wave cam disc 7022 through a plurality of round rods, and a mounting sleeve 6016 is fixedly mounted on the outer side of the round rod. The bottom of the wave cam disc 7022 is wave-shaped, and the crest of the entire wave is farthest from the placement table 10, and the trough is closest to the placement table 10. In the initial state (before cutting), the steel ball 7023 is located at the trough position. During the initial cutting, the stripping touch plate 7014 lightly touches the original wafer when the laser head 801 cuts (at this time, since the original wafer has not been cut yet, the stripping touch plate 7014 only has the effect of pressing the material).

[0045] When in use, while the scheduling plate 6012 rotates 60° to adjust the laser head 801, the steel ball 7023 will slide along the bottom of the wave cam plate 7022. During this process, the steel ball 7023 first slides from the current trough position to the next wave peak. At this time, the steel ball 7023 pushes the reset rod 7013 upward, so that the reset rod 7013 and the stripping contact plate 7014 move up and separate from the original wafer. Then, as the scheduling plate 6012 continues to rotate, the steel ball 7023 moves from The wave crest slides to the next wave valley. At this time, the reset rod 7013 and the stripping touch plate 7014 gradually move down, close to the first cut wafer, and rotate towards the cut wafer. When the steel ball 7023 reaches the next wave valley, the stripping touch plate 7014 touches the cut wafer lightly and applies slight pressure to help the cut wafer completely fall off from the original wafer to achieve the stripping effect. The light touch stripping process is gradual, ensuring that each cut wafer will not be subjected to excessive mechanical stress during the initial separation. This protects the integrity and surface quality of the wafer and avoids wafer breakage or warping caused by direct application of excessive force. During the 60° rotation of the scheduling plate 6012, the synergistic effect of the wave cam plate 7022 and the steel ball 7023 enables the stripping touch plate 7014 to accurately complete the stripping action. At the same time, the laser head 801 is also ready for the next cutting. Therefore, the efficient synchronous operation between the laser head 801 and the stripping touch plate 7014 greatly shortens the time of each cutting and stripping cycle, greatly improving production efficiency. After the wafer is cut off again, the above operation is repeated to achieve cutting of the entire original wafer and automatic light touch stripping. After completing the last cut of the original wafer, the scheduling plate 6012 is continued to be controlled to rotate 60°, so that the stripping touch plate 7014 lightly touches and strips the last cut wafer, but the laser head 801 does not work after the last rotation (because at this time the laser head 801 rotates to the initial cutting position, where the wafer has been cut and stripping is completed).

[0046] It should be noted that the design of the waveform cam disc 7022 can be adjusted according to different cutting requirements and is suitable for a variety of cutting modes and complex cutting paths. By adjusting the shape and spacing of the waveform, it can flexibly cope with wafers of different sizes and shapes.

[0047] See also Figure 2 , Figure 3 , Figure 4 and Figure 5 The ejection assembly 902 includes two slide grooves 9021 opened on the upper circular platform and symmetrically arranged on the left and right sides, and a pull plate 9022 slidably connected in the slide grooves 9021. An ejection plate 9026 is installed between the left and right pull plates 9022. A plurality of ejection rods 9023 distributed in a circle are fixedly installed on the top of the ejection plate 9026. The ejection rods 9023 cooperate with the suction port 9014 on the inner side.

[0048] See also Figure 2 , Figure 3 , Figure 4 and Figure 5 A sealing plate 9024 is fixedly installed on the top of the pull plate 9022, and a sealing groove 9025 that is sealingly and slidingly matched with the sealing plate 9024 is opened on the top of the slide groove 9021.

[0049] See also Figure 2 , Figure 3 , Figure 4 and Figure 5 The follow-up ejection mechanism 9 also includes two pull ropes 903 fixedly installed at the bottom of the driving plate 5 and symmetrically arranged on the left and right sides. The two pull ropes 903 are fixedly connected to the left and right pull plates 9022 respectively.

[0050] During specific use, the output end of the cylinder 4 pushes the drive plate 5 downward a short distance to cause the ejection assembly 902 to fall and be pulled out from the inner suction port 9014. During this process, the pull rope 903 is initially in a stretched state. When the ejection plate 9026 falls on the top of the convex cover 9012, the drive plate 5 continues to move downward and the pull rope 903 will gradually relax. Then, during the entire cutting operation, the drive plate 5 does not rise or fall, and the pull rope 903 is always in a relaxed state.

[0051] When the cutting operation of the entire original wafer is completed, the output end of the control cylinder 4 contracts, driving the driving plate 5 to move upward. As the driving plate 5 moves upward, the laser head 801 and the stripping contact plate 7014 move upward to reset. At the same time, the pull rope 903 is gradually pulled from a relaxed state to a stretched state. Then the driving plate 5 continues to move, which will drive the pull rope 903 to pull the pull plate 9022 upward. As the pull plate 9022 moves upward, the ejection plate 9026 will be driven to move upward synchronously, thereby driving the ejection plates 9026 on the top of the ejection plate 9026 to move upward and insert into the corresponding inner suction port 9014. Finally, as the driving plate 5 continues to move and completes the reset, the ejection rod 9023 will eject the wafer that has completed stripping for unloading.

[0052] When the cutting operation of the entire original wafer is completed, the output end of the control cylinder 4 contracts, driving the driving plate 5 to move upward. As the driving plate 5 moves upward, the laser head 801 and the stripping contact plate 7014 move upward to reset. At the same time, as the driving plate 5 rises, the pull rope 903 is subjected to tension again, and the pull rope 903 is gradually straightened from a relaxed state. When the pull rope 903 is straightened and the driving plate 5 continues to move upward, the pull rope 903 pulls the pull plate 9022 to move upward, and the pull plate 9022 drives the ejection plate 9026 to move upward synchronously. As the ejection plate 9026 moves upward, the ejection rod 9023 is inserted into the corresponding inner suction port 9014. Finally, as the driving plate 5 continues to move and completes the reset, the ejection rod 9023 will strip the wafer. The finished wafer is ejected to realize the unloading operation. The upward movement of the ejector rod 9023 not only helps the wafer to be completely separated from the adhesive film, but also ensures the safe collection of the wafer. The cut wafer is first separated from the original wafer by lightly touching the stripping touch plate 7014, which can break the weak connection points between the wafers in advance and reduce the resistance of the ejector rod 9023 during ejection. This not only improves the ejection efficiency, but also reduces the thrust required by the ejector rod 9023. At the same time, after the light touch separation, the wafer has been partially separated from other wafers or supporting structures. The ejector rod 9023 can apply force more evenly during ejection, ensuring that all wafers can be ejected smoothly, and avoiding the problem of wafer edge warping or damage caused by direct ejection, thereby greatly improving the unloading efficiency.

[0053] See also Figure 3 and Figure 4 Four square-distributed guide cylinders 12 are fixedly installed on the top of the lower truncated table, and four square-distributed guide columns 11 are fixedly installed on the bottom of the driving plate 5. The four guide columns 11 are slidably matched with the corresponding guide cylinders 12 respectively. A plurality of limit rods 13 that slide through the support plate 3 and are distributed in a circle are fixedly installed on the top of the driving plate 5, and a limit ring 14 is commonly installed on the top of the plurality of limit rods 13.

[0054] During specific use, when the driving plate 5 moves downward to the cutting position, the guide column 11 will slide along the guide cylinder 12. Under the action of the guide cylinder 12 and the guide column 11, the driving plate 5 can be guided to keep the coaxiality of the driving plate 5 and the placement table 10 consistent. At the same time, when the driving plate 5 moves downward, the limit rod 13 can limit the driving plate 5, thereby preventing the laser head 801 and the stripping touch plate 7014 from offset during operation, thereby greatly improving the cutting accuracy.

[0055] Finally, it should be noted that: Obviously, the above embodiments are only examples for clearly explaining the present invention, and are not intended to limit the implementation methods. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from this are still within the scope of protection of the present invention.

Claims

1. A semiconductor chip production and processing equipment, characterized in that: include: A machine body (1), a workbench (2) and a support plate (3) fixedly mounted on the inner wall of the machine body (1); a placement table (10) for placing wafers is fixedly mounted on the top of the workbench (2); the support plate (3) is located above the workbench (2) and a cylinder (4) is fixedly mounted on the top of the workbench (2); the output end of the cylinder (4) slides through the support plate (3) and is fixedly mounted with a drive plate (5); a rotary scheduling mechanism (6), a rail stripping mechanism (7) and a ring cutting mechanism (8) are arranged at the bottom of the drive plate (5); a follow-up ejection mechanism (9) is arranged between the placement table (10) and the drive plate (5); the rotary scheduling mechanism (6) comprises a scheduling component (601) and a driving component (602) for driving the scheduling component (601); the rail stripping mechanism (7) comprises a stripping component (701) and a control component (702) for controlling the stripping component (701); and the follow-up ejection mechanism (9) comprises an adsorption component (901) and an ejection component (902); The scheduling component (601) comprises a rotating shaft (6011) rotatably mounted at the bottom of the driving plate (5) and a scheduling plate (6012) fixedly mounted at the bottom of the rotating shaft (6011); the stripping component (701) comprises a reset sleeve (7012) fixedly mounted at the bottom of the scheduling plate (6012) via a reset spring (7011); a reset rod (7013) is fixedly mounted in the reset sleeve (7012); and a stripping touch plate (7014) is fixedly mounted at the bottom of the reset rod (7013); After the adsorption component (901) fixes the wafer, the annular cutting mechanism (8) performs the initial cutting of the wafer, and then the scheduling component (601) drives the scheduling plate (6012) to rotate and move the annular cutting mechanism (8) to the next position. When the annular cutting mechanism (8) moves to the next cutting point, the control component (702) controls the stripping touch plate (7014) to lightly touch the wafer at the previous cutting position to strip the wafer.

2. The semiconductor chip production and processing equipment according to claim 1, characterized in that: The annular cutting mechanism (8) comprises an annular rail assembly (802), the annular rail assembly (802) comprising a circular plate (8021) fixedly mounted on the bottom of the scheduling plate (6012) and an annular rail (8022) fixedly mounted on the bottom of the circular plate (8021), the bottom of the annular rail (8022) being slidably connected to an electric slider (8023), and the bottom of the electric slider (8023) being fixedly mounted with a laser head (801) via an L-shaped sleeve (8024).

3. The semiconductor chip production and processing equipment according to claim 1, characterized in that: The driving assembly (602) comprises a driving motor (6021) fixedly mounted on the top of the driving plate (5); the output end of the driving motor (6021) slides through the driving plate (5) and is fixedly mounted with a convex plate (6023); a groove wheel (6022) is fixedly mounted on the outer side of the rotating shaft (6011); and a lever (6024) that slidably cooperates with the groove wheel (6022) is fixedly mounted on the bottom of the convex plate (6023).

4. The semiconductor chip production and processing equipment according to claim 1, characterized in that: The control assembly (702) comprises a plurality of L-shaped rods (7024) fixedly mounted on the bottom of the driving plate (5) and distributed in a circumferential manner, a wave-shaped cam disc (7022) being mounted between the plurality of L-shaped rods (7024), a steel ball (7023 slidably connected to the wave-shaped cam disc (7022) being fixedly mounted on the top of the reset rod (7013), and a limit sleeve (7021) rotatingly mounted on the outside of the rotating shaft (6011) being fixedly mounted on the inner side of the wave-shaped cam disc (7022) via a plurality of round rods.

5. The semiconductor chip production and processing equipment according to claim 1, characterized in that: The placement table (10) is composed of two upper and lower truncated cones, the diameter of the lower truncated cone is larger than that of the upper truncated cone, the adsorption component (901) comprises a vacuum chamber (9011) opened in the upper truncated cone and a convex cover (9012) fixedly installed on the inner wall of the bottom of the vacuum chamber (9011), the right side of the lower truncated cone is provided with an exhaust port (9013) connected to the convex cover (9012), the convex cover (9012) is connected to the vacuum chamber (9011), the top of the upper truncated cone is provided with an adsorption port (9014) connected to the vacuum chamber (9011), the adsorption port (9014) is provided with two groups distributed inside and outside the circumference, the outer adsorption port (9014) is used to adsorb the outer edge of the wafer, and the inner adsorption port (9014) is used to adsorb the part of the wafer to be cut off.

6. The semiconductor chip production and processing equipment according to claim 5, characterized in that: The ejection assembly (902) comprises two slide grooves (9021) opened on the upper truncated platform and symmetrically arranged on the left and right sides, and a pull plate (9022) slidably connected to the slide grooves (9021); an ejection plate (9026) is installed between the left and right pull plates (9022); a plurality of ejection rods (9023) distributed in a circumference are fixedly installed on the top of the ejection plate (9026); the ejection rods (9023) cooperate with the suction port (9014) on the inner side.

7. The semiconductor chip production and processing equipment according to claim 6, characterized in that: A sealing plate (9024) is fixedly mounted on the top of the pull plate (9022), and a sealing groove (9025) is provided on the top of the slide groove (9021) for sealing and sliding cooperation with the sealing plate (9024).

8. The semiconductor chip production and processing equipment according to claim 6, characterized in that: The follow-up ejection mechanism (9) further comprises two pull ropes (903) fixedly mounted on the bottom of the driving plate (5) and symmetrically arranged on the left and right sides, and the two pull ropes (903) are respectively fixedly connected to the left and right pull plates (9022).

9. The semiconductor chip production and processing equipment according to claim 5, characterized in that: Four square-distributed guide cylinders (12) are fixedly mounted on the top of the lower truncated table, four square-distributed guide columns (11) are fixedly mounted on the bottom of the driving plate (5), the four guide columns (11) are slidably matched with corresponding guide cylinders (12), and a plurality of limit rods (13) that slide through the support plate (3) and are distributed in a circumference are fixedly mounted on the top of the driving plate (5), and a limit ring (14) is commonly mounted on the top ends of the plurality of limit rods (13).

10. The semiconductor chip production and processing equipment according to claim 4, characterized in that: The dispatching assembly (601) further comprises three sliding rods (6013) fixedly mounted on the top of the dispatching plate (6012) and distributed in a triangular shape, and a mounting sleeve (6016) fixedly mounted on the outside of the round rod, a circular disc (6014) being mounted on the bottom of the plurality of mounting sleeves (6016), and an annular groove (6015) being slidably connected to the sliding rod (6013) being formed on the bottom of the circular disc (6014).

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