Method for combining components made of different materials
Inactive Publication Date: 2006-06-15
HON HAI PRECISION IND CO LTD
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
[0006] A method for combining two combining surfaces of two components together, includes the following steps: a) surface treating the combining surfaces to reduce roughness thereof; b) placing the two components within a heating apparatus with the treated combining surfaces contacting with each other, wherein a force is applied to the components to push them against each other; c) heating the components by the heating apparatus with a predetermined temperature which is maintained for a predetermined period of time to cause atoms near the contacting interface of the two components to diffuse to each other to form a layer of alloy at the interface of the two components to thereby combine the two components together; d) cooling the combined two components and taking the combined two components out of the heating apparatus.
Problems solved by technology
During operation of many contemporary electronic devices such as central processing units (CPUs), large amounts of heat are produced.
Thus, conventional heat sinks made by extruding Al cannot meet heat dissipating requirement of contemporary CPUs which are performing tasks faster and faster and thus generating more and more heat.
Furthermore, it is difficult to control twisting force of the screws to cause the two components to be tightly combined together without damaging the two components.
The component made of Cu is pressed into and therefore interferentially received in the hole of the component made of Al.
However, the component made of Al is prone to be scraped by the component made of Cu at the hole in the pressing process, which may increase the thermal resistance between the two components.
Method used
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Embodiment Construction
[0012]FIG. 1 shows a process of a method for combining components in accordance with one embodiment of the present invention. In this embodiment, two components are used. One component is made of copper (Cu) or Cu alloy, and the other component is made of aluminum (Al) or Al alloy. Each component has a combining surface which is predetermined to connect with the other component. The method comprises the following steps:
[0013] a) surface treating the combining surfaces of the two components to reduce surface roughness thereof. In this embodiment, the surface treatment employs firstly electrolyzing or chemically polishing the combining surfaces; then removing oil or dirt on the combining surfaces by cleaning the combining surfaces with alcohol or acetone; finally removing oxidized layers on the combining surfaces by supersonic vibration to the combining surfaces;
[0014] b) placing the two treated components within an oven (not shown) with the combining surfaces thereof contacting to ...
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Abstract
A method for combining two components together includes the following steps: a) surface treating the two components; b) placing them within a heating apparatus while they contact with each other, a force being applied to the two components to push then against each other on the contacting surfaces thereof; c) heating the two components to a predetermined temperature which is hold for a predetermined period time to cause the two components to diffuse at the contacting interface to thereby combine the two components together; d) cooling the combined two components and taking them out of the heating apparatus.
Description
FIELD OF THE INVENTION [0001] The present invention relates generally to a method for combining components made of different materials, and more particularly to a method for combining components made of different metals. DESCRIPTION OF RELATED ART [0002] Advances in microelectronics technology have resulted in electronic devices which process signals and data at unprecedented high speeds. During operation of many contemporary electronic devices such as central processing units (CPUs), large amounts of heat are produced. The heat must be efficiently removed, to prevent the system from becoming unstable or being damaged. Heat sinks are frequently used for dissipating heat from these electronic devices. [0003] Typical heat sinks are often integrally made by extruding aluminum (Al). However, Al has a relative low heat conductivity, i.e., 735 KJ / (M.H.K) compared with copper (Cu), i.e., 1386 KJ / (M.H.K). Thus, conventional heat sinks made by extruding Al cannot meet heat dissipating requir...
Claims
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Login to View More IPC IPC(8): C22F1/00C22F1/04C22F1/08
CPCC22F1/00C22F1/04C22F1/08
InventorHONG, CHU-WANLO, CHANG-TINGFANG, YI-CHYNGWU, JUNG-YUANLIN, YEU-LIHZHANG, PENG-PENG
OwnerHON HAI PRECISION IND CO LTD