Thermal interface material and semiconductor device incorporating the same
a technology of thermal interface material and semiconductor device, which is applied in the direction of semiconductor device, metal-working apparatus, basic electric elements, etc., can solve the problems of base oil bleeding from the thermal interface material, thermal interface material tends to gradually harden, and loses flexibility
Inactive Publication Date: 2007-07-05
HON HAI PRECISION IND CO LTD
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Benefits of technology
The present invention is about a material used to transfer heat from electronic components. The material is made up of an organopolysiloxane, a compound that contains Si—H groups, and fillers made of aluminum and zinc oxide. The material is used in semiconductor devices to improve heat dissipation. The technical effect of this invention is to improve the thermal performance of electronic components and reduce the risk of overheating.
Problems solved by technology
However, the contact surfaces between the heat dissipating apparatus and the electronic component are rough and therefore are separated from each other by a layer of interstitial air no mater how precisely the heat dissipating apparatus and the electronic component are brought into contact.
However, the base oil may bleed from the thermal interface material when exposed to heat for a long period of time.
The thermal interface material therefore tends to gradually harden, finally losing flexibility so that it peels off from the contact surfaces between the heat dissipating apparatus and the electronic component.
This results in the thermal interface material undesirably increasing its thermal resistance and the heat dissipating apparatus accordingly decreasing its heat dissipation efficiency over time.
The operational temperatures of the electronic components are undesirably increased, which leads to deterioration in their performance.
Method used
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[0008]Referring to FIG. 1, an electronic device 10 includes a heat source 12 disposed on a circuit board 11, a heat-dissipating component 13 for dissipating heat generated by the heat source 12, and a thermal interface material 14 filled in spaces formed between the heat source 12 and the heat-dissipating component 13. The heat source 12 is an electronic component, such as a central processing unit (CPU) of a computer, which needs to be cooled. The heat-dissipating component 13 is a heat sink, which includes a base 131 and a plurality of fins 133 disposed on the base 131. The heat-dissipating component 13 is attached to the circuit board 11 via a resilient fixing member 15, which provides a resilient force for clamping the heat dissipation component 13 and the circuit board 11 together. The base 131 of the heat-dissipating component 13 is sandwiched between the fixing member 15 and the circuit board 11, and is urged downwardly towards the heat source 12 on the circuit board 11 via t...
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Abstract
A semiconductor device (10) includes a heat source (12), a heat-dissipating component (13) for dissipating heat generated by the heat source, and thermal interface material (14) filled in spaces formed between the heat source and the heat-dissipating component. The thermal interface material includes 100 parts by weight of alkenyl groups-containing organopolysiloxane, and Si—H groups-containing compound selected from the group consisting of organo-hydrogenpolysiloxane and polyorganohydrogensiloxane, and 800 to 1200 parts by weight of fillers consisting of aluminum powder having a mean particle size of 0.1 to 1 um and zinc oxide powder having a mean particle size of 1 to 5 um in a weight ratio of from 1 / 1 to 10 / 1 .
Description
FIELD OF THE INVENTION[0001]The present invention relates to a thermal interface material which is interposable between a heat-generating electronic component and a heat dissipating component, and it also relates to a semiconductor device using the thermal interface material.DESCRIPTION OF RELATED ART[0002]With the fast development of the electronics industry, advanced electronic components such as CPUs (central processing units) are being made with ever faster operating speeds. During operation of the advanced electronic components, much heat is generated. In order to ensure good performance and reliability of the electronic components, their operational temperature must be kept within a suitable range. Generally, a heat dissipating apparatus such as a heat sink or a heat spreader is attached to a surface of the electronic component, so that the heat is transferred from the electronic component to ambient air via the heat dissipating apparatus. However, the contact surfaces between...
Claims
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IPC IPC(8): C22C1/05B22F1/10
CPCB22F1/0059H01L23/3737H01L2224/73253H01L2224/16H01L23/42B22F1/10
InventorCHENG, CHING-TAICHENG, NIEN-TIEN
OwnerHON HAI PRECISION IND CO LTD