Injection molding method for plastic encapsulated type IPM and plastic encapsulated type IPM

A plastic-encapsulated, injection-molded technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of product heat dissipation, influence on DBC board fixation, influence on product injection molding results, etc., and achieve the effect of improving heat dissipation and reliability

CN106313422AInactive Publication Date: 2017-01-11XIAN YONGDIAN ELECTRIC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2017-01-11
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses an injection molding method for a plastic encapsulated type IPM and the plastic encapsulated type IPM. The injection molding method comprises the following steps that firstly, the upper surface of a DBC substrate and the pin portion of lead frames are soldered and fixed together, a PCB and pins of the lead frames are soldered and fixed together, and assembly of the DBC substrate, the PCB and the lead frames is completed; secondly, the soldered lead frames are placed in an injection mold; thirdly, an upper mold body and a lower mold body of the injection mold are controlled to be assembled, an acting force is exerted on the upper surface of the DBC substrate through a plurality of elastic ejector pins, the elastic ejector pins are gradually compressed, and therefore the DBC substrate is tightly pressed; and fourthly, injection molding materials are injected into an injection molding area, and the copper layer on the back portion of the DBC substrate is made to be fully exposed. By the adoption of the injection molding method for the plastic encapsulated type IPM, the problem that materials overflow on the periphery of the copper layer of the DBC substrate after injection molding of the product can be effectively solved, it is guaranteed that the copper layer on the back face of the DBC substrate can be fully exposed outside the plastic encapsulating body after injection molding, and therefore the heat dissipating effect and the reliability of the product are improved.
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Description

technical field

[0001] The invention relates to the technical field of IPM injection molding, in particular to an injection molding fixing method for a DBC board in a plastic-encapsulated IPM, and a corresponding plastic-encapsulated IPM. Background technique

[0002] Plastic-encapsulated IPM (Intelligent Power Module, Intelligent Power Module) is a new type of control module that integrates the IGBT chip and its drive circuit, control circuit and overcurrent, undervoltage, short circuit, overheating and other protection circuits. It is a complex and advanced power module that can automatically realize complex protection functions such as overcurrent, undervoltage, short circuit and overheating, so it has intelligent features. At the same time, it has the advantages of low cost, miniaturization, high reliability, and easy use. It is widely used in frequency conversion home appliances, inverter power supplies, industrial control and other fields, and its social and economic b...

Examples

Embodiment Construction

[0031] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0032] Such as figure 1 Shown, the injection molding method for plastic-encapsulated IPM of the present invention, it comprises the steps:

[0033] S1. Solder and fix the upper surface of the DBC board and the pin part of the lead frame, and at the same time weld and fix the pins of the PCB board and the lead frame to complete the assembly of...