Formula of radiating fin material for computer mainboard

Abstract

The invention relates to a formula of a radiating fin material for a computer mainboard. The formula comprises silver, aluminum, copper, gold, lead, epoxy resin, silicone grease, polyvinyl alcohol, polyester, polyacrylonitrile, phenolic resin, amino plastics, silicate, graphite powder, carbon fibers, aminopropyltriethoxysilane, methyl triethoxy silane, fatty alcohol polyoxyethylene ether, alkyl phenol polyoxyethylene ether, polyvinyl alcohol, hydrophobically modified polyacrylate, fatty amine, polyamide, dimethyl glutarate, dimethyl adipate, xanthan gum and aluminium-magnesium silicate in parts by weight. A radiating fin manufactured by the radiating fin material formula provided by the invention can greatly enhance the effects of heat absorption, storage and evacuation of the radiating fin, so as to avoid the burning phenomenon of a circuit board.

Description

technical field

[0001] The invention relates to the technical field of computers, in particular to a heat sink material formula for a computer motherboard. Background technique

[0002] Computer (computer), commonly known as computer, is a modern electronic computing machine used for high-speed computing. It can perform numerical calculations, logical calculations, and also has storage and memory functions. It is a modern intelligent electronic device that can run according to the program and process massive data automatically and at high speed. Composed of hardware systems and software systems, computers without any software installed are called bare metal. It can be divided into five categories: supercomputers, industrial control computers, network computers, personal computers, and embedded computers. More advanced computers include biological computers, photonic computers, and quantum computers.

[0003] In the prior art, the workload of the computer involves various f...

Examples

Embodiment 1

[0012] A heat sink material formula for a computer motherboard, comprising: 0.035 parts of silver, 5.5 parts of aluminum, 4 parts of copper, 0.015 parts of gold, 0.25 parts of lead, 2 parts of epoxy resin, 2 parts of silicone grease, and polyvinyl alcohol according to the weight ratio 2 parts, 5 parts of polyester, 1 part of polyacrylonitrile, 8 parts of phenolic resin, 3 parts of aminoplast, 10 parts of silicate, 6 parts of graphite powder, 5 parts of carbon fiber, 2 parts of aminopropyltriethoxysilane, 3.8 parts of methyltriethoxysilane, 1.5 parts of fatty alcohol polyoxyethylene ether, 0.6 part of alkylphenol polyoxyethylene ether, 1 part of polyvinyl alcohol, 0.8 parts of hydrophobically modified polyacrylate, 2 parts of fatty amine, polyvinyl alcohol 1 part of amide, 4 parts of dimethyl glutarate, 0.3 part of dimethyl adipate, 12 parts of xanthan gum and 3 parts of magnesium aluminum silicate.

Embodiment 2

[0014] A heat sink material formula for a computer motherboard, comprising: 0.065 parts of silver, 8.5 parts of aluminum, 12 parts of copper, 0.035 parts of gold, 0.58 parts of lead, 4 parts of epoxy resin, 4 parts of silicone grease, and polyvinyl alcohol in proportion by weight 4 parts, 8 parts of polyester, 2 parts of polyacrylonitrile, 16 parts of phenolic resin, 6 parts of aminoplast, 12 parts of silicate, 12 parts of graphite powder, 10 parts of carbon fiber, 5 parts of aminopropyltriethoxysilane, 6.6 parts of methyltriethoxysilane, 4.4 parts of fatty alcohol polyoxyethylene ether, 1.2 parts of alkylphenol polyoxyethylene ether, 3 parts of polyvinyl alcohol, 1.6 parts of hydrophobically modified polyacrylate, 3 parts of fatty amine, polyvinyl alcohol 2 parts of amide, 8 parts of dimethyl glutarate, 1.2 parts of dimethyl adipate, 16 parts of xanthan gum and 5 parts of magnesium aluminum silicate.

Embodiment 3

[0016] A heat sink material formula for a computer motherboard, comprising: 0.045 parts of silver, 6.5 parts of aluminum, 8 parts of copper, 0.025 parts of gold, 0.45 parts of lead, 3 parts of epoxy resin, 3 parts of silicone grease, and polyvinyl alcohol according to the weight ratio 3 parts, 6 parts of polyester, 1.5 parts of polyacrylonitrile, 12 parts of phenolic resin, 5 parts of aminoplast, 11 parts of silicate, 9 parts of graphite powder, 7.5 parts of carbon fiber, 3.5 parts of aminopropyltriethoxysilane, 4.6 parts of methyltriethoxysilane, 2.8 parts of fatty alcohol polyoxyethylene ether, 0.9 parts of alkylphenol polyoxyethylene ether, 2 parts of polyvinyl alcohol, 1.2 parts of hydrophobically modified polyacrylate, 2.5 parts of fatty amine, polyvinyl alcohol 1.5 parts of amides, 6 parts of dimethyl glutarate, 0.75 parts of dimethyl adipate, 14 parts of xanthan gum and 4 parts of magnesium aluminum silicate.

[0017] In the actual operation process, the cooling fins ma...

technical field

[0001] The invention relates to the technical field of computers, in particular to a heat sink material formula for a computer motherboard. Background technique

[0002] Computer (computer), commonly known as computer, is a modern electronic computing machine used for high-speed computing. It can perform numerical calculations, logical calculations, and also has storage and memory functions. It is a modern intelligent electronic device that can run according to the program and process massive data automatically and at high speed. Composed of hardware systems and software systems, computers without any software installed are called bare metal. It can be divided into five categories: supercomputers, industrial control computers, network computers, personal computers, and embedded computers. More advanced computers include biological computers, photonic computers, and quantum computers.

[0003] In the prior art, the workload of the computer involves various f...

Examples

Embodiment 1

[0012] A heat sink material formula for a computer motherboard, comprising: 0.035 parts of silver, 5.5 parts of aluminum, 4 parts of copper, 0.015 parts of gold, 0.25 parts of lead, 2 parts of epoxy resin, 2 parts of silicone grease, and polyvinyl alcohol according to the weight ratio 2 parts, 5 parts of polyester, 1 part of polyacrylonitrile, 8 parts of phenolic resin, 3 parts of aminoplast, 10 parts of silicate, 6 parts of graphite powder, 5 parts of carbon fiber, 2 parts of aminopropyltriethoxysilane, 3.8 parts of methyltriethoxysilane, 1.5 parts of fatty alcohol polyoxyethylene ether, 0.6 part of alkylphenol polyoxyethylene ether, 1 part of polyvinyl alcohol, 0.8 parts of hydrophobically modified polyacrylate, 2 parts of fatty amine, polyvinyl alcohol 1 part of amide, 4 parts of dimethyl glutarate, 0.3 part of dimethyl adipate, 12 parts of xanthan gum and 3 parts of magnesium aluminum silicate.

Embodiment 2

[0014] A heat sink material formula for a computer motherboard, comprising: 0.065 parts of silver, 8.5 parts of aluminum, 12 parts of copper, 0.035 parts of gold, 0.58 parts of lead, 4 parts of epoxy resin, 4 parts of silicone grease, and polyvinyl alcohol in proportion by weight 4 parts, 8 parts of polyester, 2 parts of polyacrylonitrile, 16 parts of phenolic resin, 6 parts of aminoplast, 12 parts of silicate, 12 parts of graphite powder, 10 parts of carbon fiber, 5 parts of aminopropyltriethoxysilane, 6.6 parts of methyltriethoxysilane, 4.4 parts of fatty alcohol polyoxyethylene ether, 1.2 parts of alkylphenol polyoxyethylene ether, 3 parts of polyvinyl alcohol, 1.6 parts of hydrophobically modified polyacrylate, 3 parts of fatty amine, polyvinyl alcohol 2 parts of amide, 8 parts of dimethyl glutarate, 1.2 parts of dimethyl adipate, 16 parts of xanthan gum and 5 parts of magnesium aluminum silicate.

Embodiment 3

[0016] A heat sink material formula for a computer motherboard, comprising: 0.045 parts of silver, 6.5 parts of aluminum, 8 parts of copper, 0.025 parts of gold, 0.45 parts of lead, 3 parts of epoxy resin, 3 parts of silicone grease, and polyvinyl alcohol according to the weight ratio 3 parts, 6 parts of polyester, 1.5 parts of polyacrylonitrile, 12 parts of phenolic resin, 5 parts of aminoplast, 11 parts of silicate, 9 parts of graphite powder, 7.5 parts of carbon fiber, 3.5 parts of aminopropyltriethoxysilane, 4.6 parts of methyltriethoxysilane, 2.8 parts of fatty alcohol polyoxyethylene ether, 0.9 parts of alkylphenol polyoxyethylene ether, 2 parts of polyvinyl alcohol, 1.2 parts of hydrophobically modified polyacrylate, 2.5 parts of fatty amine, polyvinyl alcohol 1.5 parts of amides, 6 parts of dimethyl glutarate, 0.75 parts of dimethyl adipate, 14 parts of xanthan gum and 4 parts of magnesium aluminum silicate.

[0017] In the actual operation process, the cooling fins ma...