A kind of antenna unit and electronic equipment

A technology of antenna unit and electronic equipment, which is applied in the field of communication, can solve the problems of not being able to meet multi-band or broadband, millimeter-wave antenna AiP module narrow bandwidth, etc., and achieve the effect of improving wireless experience

CN110649370BActive Publication Date: 2022-02-01VIVO MOBILE COMM CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2022-02-01

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Abstract

The invention provides an antenna unit and electronic equipment, and relates to the technical field of communication. The antenna unit includes: a metal plate, the metal plate is provided with a first groove; the bottom of the first groove is provided with a second groove; a feeding probe, the feeding probe is arranged on the Outside the second groove, and the feeding probe passes through the metal plate outside the second groove into the first groove; the coupling feeder arranged in the first groove , the feeding probe is connected to the coupling feeder. In the embodiment of the present invention, by setting the feeding probe outside the second groove, the feeding probe enters the first groove through the metal plate outside the second groove, and is set in the second groove Coupling feeder, the feeding probe is connected to the coupling feeder, and the metal plate is used as a part of the antenna unit, which can avoid the influence of the metal plate on the performance of the antenna, thereby improving the user's wireless experience in multiple frequency bands when roaming around the world.
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Description

technical field

[0001] The invention relates to the technical field of communication, in particular to an antenna unit and electronic equipment. Background technique

[0002] At present, the millimeter-wave antenna-in-package antenna (AiP, Antenna in package) module has a large number of layers, generally 8-12 layers, and at the same time, the laminated structure is more complicated, and the punching types of multi-layer board connections are more and more complicated, which greatly The process difficulty and production consistency of mass production of AiP modules have been increased; moreover, the bandwidth of AiP modules is narrow, and the current dual-band solution can only cover n260 (37.0-40.0GHz) and n261 (27.5-28.35GHz) frequency bands. Can not meet the design of multi-band or broadband, affect the user's mobile roaming experience; and, AiP module is generally printed circuit board (PCB, Printed Circuit Board) processing technology or integrated circuit (IC, Intergar...

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0026] At present, with the development of 5G (fifth generation mobile communication), the design of millimeter wave antennas is gradually introduced to some small electronic devices, such as mobile phones, tablets, laptops, etc., so the overall competitive size of the system is maintained. In this case, the effective radiation space allocated to each antenna is reduced, which in turn degrades antenna performance and degrades user wireless experience. ...