An oven air guide structure

Abstract

The present invention relates to an oven air guide structure, comprising a fan, an air guide plate and a top plate, an air flow channel is formed between the air guide plate and the top plate, the air flow channel has an air inlet and an air outlet, the fan is arranged at the air inlet, a heat insulation board is arranged in the air flow channel, the projection of the heat insulation board on the air guide plate overlaps with the installation position of the power board on the air guide plate or the periphery of the projection is located at the periphery of the installation position, a gap is left between the heat insulation board and the above-mentioned installation position to communicate with the air outlet of the fan, a spacing is formed between the heat insulation board and the top plate, and the air outlet of the above-mentioned fan can pass through the gap between the heat insulation board and the top plate to the air outlet after entering the air flow channel. Compared with the prior art, the present invention can increase the thermal resistance between the top plate and the installation position, that is, increase the thermal resistance between the top plate and the power board, and reduce the heat transferred to the power board.

Description

Technical Field

[0001] The invention relates to the field of ovens, and in particular to an oven air guide structure. Background Art

[0002] The air guide system of the oven is generally arranged at the top of the oven, including a fan, an air guide plate and a top plate. The air guide plate and the top plate form an air flow channel. The fan is arranged at the air inlet of the air flow channel, and the air outlet of the air flow channel is connected to the outside world. The air outlet of the air vent of the oven enters the air flow channel through the air holes provided on the top plate, and the air outlet of the fan takes away the heat discharged from the air vent through the air flow channel. In addition, a power board is installed on the top of the air guide plate, and the air outlet of the fan dissipates the heat for the power board through the air flow channel to prevent the power board from being damaged by heat. It can be seen that the main purpose of setting up the air guide system in the oven is to cool the air guide plate, thereby protecting the power board installed on the air guide plate and preventing the power board from being damaged by heat.

[0003] The heat dissipation function of the existing air guide system is mainly achieved through the fan. The fan needs to work continuously for a long time during the entire operation of the oven: (1) The fan continues to work during the baking and cooking process; (2) After the baking and cooking is completed, the fan still needs to continue to work for a period of time because the temperature of the inner pot cavity is still very high. The heat dissipation efficiency of the traditional oven air guide system is proportional to the power of the fan, that is, the higher the power of the fan and the greater the air output, the higher the heat dissipation efficiency of the air guide system, which leads to energy consumption and noise problems in the oven. In order to fundamentally solve this problem, the present invention improves the air guide structure of the oven on the basis of the prior art. Summary of the invention

[0004] The first technical problem to be solved by the present invention is to provide an oven air guide structure which can effectively reduce the influence of heat transfer on the power board in view of the prior art.

[0005] The second technical problem to be solved by the present invention is to provide an oven air guide structure with good heat dissipation effect on the power board in view of the prior art.

[0006] The technical solution adopted by the present invention to solve the above-mentioned technical problems is: an oven air guide structure, comprising a fan, an air guide plate and a top plate, the air guide plate and the top plate forming an air flow channel, the air flow channel having an air inlet and an air outlet, the fan being arranged at the air inlet, and characterized in that a heat insulation board is arranged in the air flow channel, the projection of the heat insulation board on the air guide plate overlaps with the installation position of the power board on the air guide plate or the periphery of the projection is located at the periphery of the installation position, a gap communicating with the air flow channel is left between the heat insulation board and the air guide plate, a spacing is formed between the heat insulation board and the top plate, and the air outlet of the above-mentioned fan can enter the air flow channel and can pass to the air outlet along the space between the heat insulation board and the top plate.

[0007] As a preference, the front end of the heat insulation board abuts against the air guide plate, and the rear end is spaced from the air guide plate, so that the cold air blown out by the fan can better enter the gap between the heat insulation board and the installation position, and after entering the gap, the flow speed of the cold air will be reduced because the front end of the heat insulation board abuts against the air guide plate, so that the power board can be better cooled.

[0008] Furthermore, preferably, the ratio of the distance between the rear end of the heat insulation board and the air guide plate to the height of the air flow channel at this point is 0.3 to 0.45. Thus, on the basis of ensuring the heat dissipation of the heat insulation board, more air intake can pass through the channel below the heat insulation board to the air outlet, thereby taking away the heat transferred by the high-temperature components, and further reducing the impact of heat transfer on the power board.

[0009] As a priority, partition blocks are respectively provided between the left and right ends of the heat insulation board and the corresponding positions of the air guide plate, so that a relatively independent space can be isolated in the air flow channel, that is, only the cold air blown by the fan can enter the gap between the heat insulation board and the air guide plate, which can further reduce the influence of heat transfer on the power board.

[0010] Furthermore, preferably, the front end surface of each of the partition blocks is rounded, so as to reduce the resistance of the front end of the partition block to the airflow, ensure good airflow permeability, and allow the airflow to enter the gap between the heat insulation board and the air guide plate more smoothly.

[0011] In order to improve the heat dissipation effect of the power board, small holes are opened on the insulation board that pass through the upper and lower layers. On the one hand, the hot air flow on the upper layer of the insulation board can flow to the lower layer of the insulation board through the small holes and guide the air outlet through the air outlet of the fan. On the other hand, the cold air on the upper layer of the insulation board can enter the small holes, thereby further reducing the flow rate of the cold air and further extending the residence time of the cold air under the installation position, thereby further improving the heat dissipation effect of the power board.

[0012] Furthermore, preferably, the passage of the small hole is inclined. This can make the hot air entering the small hole better mixed with the airflow under the heat insulation board when entering the bottom of the heat insulation board from the small hole, and can further extend the residence time of the cold air under the installation position, and can make the heat insulation board obtain better heat insulation effect.

[0013] Furthermore, preferably, the angle between the extension direction of the small hole channel and the vertical direction is 45° to 75°.

[0014] In order to achieve better cooling and heat-insulating effects on the heat-insulating plate, preferably, the small holes are multiple and arranged in an array on the heat-insulating plate, and the staggered arrangement of small holes in different rows can achieve better cooling and heat-insulating effects.

[0015] Furthermore, preferably, the array formed by the small holes is an equal row spacing array arranged at equal row spacings along the length direction of the insulation board, or is a variable row spacing array in which the row spacing increases from front to back along the length direction of the insulation board, and the variable coefficient of the variable row spacing array is greater than 1 and less than 1.2.

[0016] In order to further improve the thermal insulation and cooling effect of the power board, the air guide plate at the installation position is raised upward, which can increase the distance between the power board and the high-temperature components and allow more cold air to enter the gap between the installation position and the insulation plate, thereby further improving the cooling effect.

[0017] Compared with the prior art, the advantages of the present invention are: the top plate of the oven is located above the inner pot, so the heat of the high-temperature inner pot will be transferred to the top plate. In addition, the air outlet of the air vent generally enters the air guide structure through the air vents opened on the top plate. It can be seen that the top plate is the main heat transfer source affecting the power board in the air guide structure. In the present invention, a heat insulation board is arranged in the air flow channel, and the projection of the heat insulation board on the air guide plate overlaps with the installation position of the power board on the air guide plate or the periphery of the projection is located at the periphery of the installation position, so as to increase the thermal resistance between the top plate and the installation position, that is, increase the thermal resistance between the top plate and the power board, and reduce the heat transferred to the power board. At the same time, a gap is left between the heat insulation board and the above-mentioned installation position, and the gap is connected to the air outlet of the fan, and the air outlet of the fan can still dissipate the heat generated by the power board itself. It can be seen that on the basis of the present invention, without increasing the power of the fan, or even reducing the power of the fan, a good heat dissipation effect can be achieved on the power board, thereby significantly reducing energy consumption and reducing operating noise. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of the structure of the air guide structure in Embodiment 1 of the present invention;

[0019] Figure 2 for Figure 1 A schematic diagram of the structure in another direction;

[0020] Figure 3 for Figure 2 Cross-sectional view along AA direction;

[0021] Figure 4 It is a schematic diagram of the partial structure of the air guide structure in Example 1 of the present invention;

[0022] Figure 5 for Figure 4 A schematic diagram of the structure in another direction;

[0023] Figure 6 It is a structural decomposition diagram of a local structure in Example 1 of the present invention;

[0024] Figure 7This is a schematic diagram of the structure of the heat insulation board in Example 1 of the present invention;

[0025] Figure 8 is a cross-sectional view of the heat insulation board in Example 1 of the present invention;

[0026] Fig. 9 Schematic diagram of the structure of the heat insulation board in Example 2 of the present invention. DETAILED DESCRIPTION

[0027] The present invention is further described in detail below with reference to the accompanying drawings.

[0028] Embodiment 1:

[0029] like Figures 1 to 8 As shown, an oven air guide structure includes a fan 2, an air guide plate 3 and a top plate 1. The air guide plate 3 and the top plate 1 form an air flow channel 4, and the air flow channel 4 has an air inlet 41 and an air outlet 42. The fan 2 is arranged at the air inlet 41. The top plate 1 is located above the inner pot of the oven, so the heat of the high-temperature inner pot will be transferred to the top plate 1, and the top plate 1 is provided with an air hole 11 for the outlet air of the oven air vent 7 to enter the air flow channel 4. It can be seen that the top plate 1 is the main heat transfer source affecting the power board in the air guide structure.

[0030] Furthermore, a heat insulation board 5 is provided in the air flow channel 4. The projection of the heat insulation board 5 on the air guide plate 3 overlaps with the mounting position 31 of the power board (not shown) on the air guide plate 3 or the periphery of the projection is located at the periphery of the mounting position 31, so as to increase the thermal resistance between the top plate 1 and the mounting position 31, that is, to increase the thermal resistance between the high-temperature component (i.e., the top plate 1 in this embodiment) and the power board, and reduce the heat transferred to the power board. At the same time, a gap communicating with the air flow channel 4 is left between the heat insulation board 5 and the air guide plate 3, and the air outlet of the fan 2 can still dissipate the heat generated by the power board itself. A gap is formed between the heat insulation board 5 and the top plate 1, and the air outlet of the fan 2 can enter the air flow channel 4 and can pass through the gap between the heat insulation board 5 and the top plate 1 to the air outlet 42, and the heat of the high-temperature component can be guided to the air outlet 42 through the air flow below the heat insulation board 5. It can be seen that, based on the present invention, without increasing the power of the fan 2 or even reducing the power of the fan 2, a good heat dissipation effect can be achieved on the power board, thereby significantly reducing energy consumption and reducing operating noise.

[0031] Furthermore, the front end of the above-mentioned heat insulation board 5 abuts against the air guide plate 3, and the rear end is spaced apart from the air guide plate 3, so that the cold air blown out by the fan 2 can better enter the gap between the heat insulation board 5 and the installation position 31, and after entering the gap, since the front end of the heat insulation board 5 abuts against the air guide plate 3, the flow speed of the cold air will be reduced, so that the power board can be better cooled. Preferably, the ratio of the distance between the rear end of the heat insulation board 5 and the air guide plate 3 to the height of the air flow channel 4 here is 0.3 to 0.45. Therefore, on the basis of ensuring the heat dissipation of the heat insulation board 5, more incoming air passes through the channel below the heat insulation board 5 to the air outlet 42, thereby taking away the heat transferred by the high-temperature components, further reducing the influence of heat transfer on the power board.

[0032] In order to further reduce the influence of heat transfer on the power board, partition blocks 6 are respectively provided between the left and right ends of the heat insulation board 5 and the corresponding positions of the air guide plate 3, so that a relatively independent space can be isolated in the air flow channel 4, that is, only the cold air blown out by the fan 2 can enter the gap between the heat insulation board 5 and the air guide plate 33, which can further reduce the influence of heat transfer on the power board. In addition, the end faces of the front ends of each partition block 6 are all rounded, so that the resistance of the front ends of the partition blocks 6 to the air flow can be reduced, ensuring good gas flow, so that the air flow can enter the gap between the heat insulation board 5 and the air guide plate 3 more smoothly. In addition, the plate body of the air guide plate 3 at the mounting position 31 is raised upward, which can increase the distance between the power board and the high-temperature components, and can allow more cold air to enter the gap between the mounting position 31 and the heat insulation board 5, thereby further improving the cooling effect.

[0033] In this embodiment, in order to improve the heat dissipation effect of the power board, the above-mentioned insulation board 5 is provided with small holes 51 that pass through from top to bottom. In this way, on the one hand, the hot air flow on the upper layer of the insulation board 5 can flow to the lower layer of the insulation board 5 through the small holes 51, and pass through the air outlet of the fan 2 to guide the air outlet 42. On the other hand, the cold air on the upper layer of the insulation board 5 can enter the small holes 51, thereby further reducing the flow rate of the cold air and further prolonging the residence time of the cold air under the installation position 31, thereby further improving the heat dissipation effect of the power board.

[0034] Furthermore, the channels of the above-mentioned small holes 51 are inclined. In this way, on the one hand, the hot air entering the small holes 51 can be better mixed with the airflow below the heat insulation board 5 when entering the bottom of the heat insulation board 5 from the small holes 51. On the other hand, the residence time of the cold air below the installation position 31 can be further prolonged, and the heat insulation board 5 can obtain a better heat insulation effect. Preferably, the angle α between the extension direction of the channel of the small hole 51 and the vertical direction is 45° to 75° (68° in this embodiment). In order to enable the heat insulation board 5 to obtain a better cooling and heat insulation effect, it is preferred that the above-mentioned small holes 51 are multiple and arranged in an array on the heat insulation board 5. The staggered arrangement of small holes 51 in different rows can obtain a better cooling and heat insulation effect. In this embodiment, the array formed by the small holes 51 is an array of equal row spacing arranged with equal row spacing along the length direction of the heat insulation board 5.

[0035] Embodiment 2:

[0036] like Fig. 9 As shown, different from the embodiment 1, in this embodiment, the array formed by the small holes 51 is a variable row spacing array (such as D2>D1) with the row spacing increasing from front to back along the length direction of the heat insulation board 5, and the variable coefficient of the variable row spacing array is greater than 1 and less than 1.2. In this way, the small holes 51 with different row spacings can make the airflow form a vortex at the heat insulation board 5, thereby further improving the cooling effect of the power board and further improving the heat insulation effect.

Claims

1. An oven air guide structure, comprising a fan (2), an air guide plate (3) and a top plate (1), wherein an air flow channel (4) is formed between the air guide plate (3) and the top plate (1), wherein the air flow channel (4) has an air inlet (41) and an air outlet (42), wherein the fan (2) is arranged at the air inlet (41), and ... A heat insulation board (5) is arranged in the air flow channel (4); the projection of the heat insulation board (5) on the air guide plate (3) overlaps with the installation position (31) of the power board on the air guide plate (3) or the periphery of the projection is located at the periphery of the installation position (31); a gap communicating with the air outlet (42) of the fan (2) is left between the heat insulation board (5) and the installation position (31); a gap is formed between the heat insulation board (5) and the top plate (1); after the air outlet of the fan (2) enters the air flow channel (4), it can pass through the gap between the heat insulation board (5) and the top plate (1) to the air outlet (42); The front end of the heat insulation board (5) abuts against the air guide plate (3), and the rear end is spaced apart from the air guide plate (3); The ratio of the distance between the rear end of the heat insulation plate (5) and the air guide plate (3) to the height of the air flow channel (4) at this point is 0.3 to 0.45; Separation blocks (6) are respectively provided between the left and right ends of the heat insulation board (5) and the corresponding positions of the air guide plate (3).

2. The oven air guide structure according to claim 1, characterized in that: The end surface of the front end of the partition block (6) is rounded and smooth.

3. The oven air guide structure according to claim 1 or 2, characterized in that: The heat insulation board (5) is provided with a small hole (51) which passes through from top to bottom.

4. The oven air guide structure according to claim 3, characterized in that: The channel of the small hole (51) is inclined.

5. The oven air guide structure according to claim 4, characterized in that: The angle between the extension direction of the small hole (51) and the vertical direction is 45° to 75°.

6. The oven air guide structure according to claim 5, characterized in that: The small holes (51) are in plurality and arranged in an array on the heat insulation board (5).

7. The oven air guide structure according to claim 6, characterized in that: The array formed by the small holes (51) is an array of equal row spacing arranged at equal row spacings along the length direction of the heat insulation board (5), or is an array of variable row spacings in which the row spacing increases from front to back along the length direction of the heat insulation board (5), and the variable row spacing array has a progressive coefficient greater than 1 and less than 1.

2.

8. The oven air guide structure according to claim 1 or 2, characterized in that: The plate body of the air guide plate (3) at the installation position (31) bulges upward.

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