Temperature plate sealing structure
By adopting the non-line sealing stamping part in the temperature uniform plate sealing structure, the problem that the existing temperature uniform plate sealing structure cannot be sealed and leaked is solved, and higher airtightness and stability are achieved.
Patent Information
- Application Number
- CN201911157537.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-11-22
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2039-11-22
AI Technical Summary
The existing temperature uniform plate sealing structure may not be able to seal properly when flattened and sealed, and it is prone to leakage due to external forces collision, resulting in loss of airtightness.
Adopt a temperature uniform plate sealing structure with a non-linear sealing stamping part, and the sealing stamping part is increased by design, and the airtightness is improved. The multi-directional sealing is ensured by combining the water injection flow channel and the sealing stamping part. Effect.
It effectively improves the airtightness of the temperature uniform plate, prevents vacuum leakage and working liquid leakage, and enhances the stability and collision resistance of the sealing structure.
Smart Images

Figure CN110926248B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a temperature averaging plate sealing structure, in particular to a temperature averaging plate sealing structure capable of increasing the sealing performance and improving the air tightness of the temperature averaging plate. Background Art
[0002] The temperature plate is a heat transfer element with a three-dimensional heat transfer effect. It is mainly formed by overlapping two plates with capillary structures to form a vacuum airtight chamber, which is then filled with working liquid. This is a low-boiling point heat transfer element. The vacuum airtight chamber is mainly evacuated and filled with working liquid through a vacuum and water filling pipe reserved by the temperature plate. Finally, the pipe is sealed to maintain airtightness.
[0003] Chinese patent publication No. CN202014433U discloses a sealed temperature equalizing plate, which includes a shell, a capillary structure, a working fluid and a filling and degassing pipe. The shell is sealed by two corresponding shell plates, and has a hollow cavity inside. The filling and degassing pipe is connected to the shell and has a channel communicating with the hollow cavity. The shell plate is deformed by pressure at the position corresponding to the filling and degassing pipe, so that the channel is closed, and the outer edge of the filling and degassing pipe is flush with the side edge of the shell. Therefore, the exposure of the tube body and interference with other mechanisms can be avoided, and secondary cutting can be performed at the position corresponding to the indentation..., but the case still has a filling and degassing pipe and is clamped in the shell. In this way, even if the position where it is set is flattened and sealed, it may still lose airtightness because the filling and degassing pipe cannot be truly sealed or leaks due to external force collision.
[0004] Therefore, how to improve the deficiencies of the prior art is the first thing that people in this field need to improve. Summary of the invention
[0005] Therefore, in order to solve the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a temperature-vaporizing plate sealing structure that can increase the airtightness of the temperature-vaporizing plate sealing.
[0006] In order to achieve the above-mentioned purpose, the present invention provides a temperature-vaporizing plate sealing structure, characterized in that it comprises:
[0007] A body, comprising a first plate and a second plate, wherein the first plate and the second plate are overlapped to form a lip and define an airtight chamber together, wherein the lip has a water injection channel and a sealing stamping portion, wherein one end of the water injection channel is connected to the airtight chamber, and the other end is connected to the sealing stamping portion, and the sealing stamping portion is non-uniform;
[0008] A capillary structure is selectively disposed in the airtight chamber space of the main body.
[0009] The described heat pipe sealing structure, wherein: the sealing indentation part is in any one of the shapes of omega, U, horseshoe, X, C, wave, or cross.
[0010] The described heat pipe sealing structure, wherein: the lip surrounds the outer edge of the airtight chamber.
[0011] The described heat pipe sealing structure, wherein: the sealing indentation part is lower than the height of the lip of the first plate body.
[0012] The described heat pipe sealing structure, wherein: the first plate body has a first side surface and a second side surface, the second plate body has a third side surface and a fourth side surface, a groove part and the water injection part are formed by protruding from the first side surface of the first plate body to the second side surface, and the second plate body correspondingly covers the groove part to form the airtight chamber.
[0013] The described heat pipe sealing structure, wherein: the capillary structure is arranged in the airtight chamber and is stacked with the first plate body and the second plate body.
[0014] The described heat pipe sealing structure, wherein: the capillary structure is selectively arranged on any one of the first side surface, the third side surface of the first plate body and the second plate body in the airtight chamber, or is arranged on the surfaces of the first side surface, the third side surface of the first plate body and the second plate body.
[0015] The described heat pipe sealing structure, wherein: the second side surface and the fourth side surface are respectively arranged on the upper and lower sides of the body, and the second side surface is defined as a condensation surface, and the fourth side surface is defined as a heat absorption surface.
[0016] The described heat pipe sealing structure, wherein: the sealing indentation part is simultaneously pressed into a depression from the first plate body to the lip of the second plate body, and is simultaneously lower than the heights of the lips of the first plate body and the second plate body.
[0017] The described heat pipe sealing structure, wherein: the lips of the first plate body and the second plate body corresponding to the position of the sealing indentation part have a first notch and a second notch.
[0018] The described heat pipe sealing structure, wherein the first plate body and the second plate body are any one or a mixed combination of aluminum, copper, commercially pure titanium, aluminum alloy, copper alloy, ceramic, and stainless steel.
[0019] The described heat pipe sealing structure, wherein: a plurality of pits are provided on the first side surface of the first plate body, and the plurality of pits protrude from the first side surface towards the groove part and abut against one side of the capillary structure.
[0020] The described heat pipe sealing structure, wherein: the body further has a pipe body, the pipe body is inserted into the water injection flow channel, and the pipe body is pressed into a flat shape by the sealing indentation part.
[0021] In this way, the sealing performance is increased by sealing the stamped portion to improve the airtightness of the temperature equalizing plate. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 It is a three-dimensional exploded view of the first embodiment of the temperature equalizing plate sealing structure of the present invention;
[0023] Figure 2 It is a three-dimensional assembly diagram of the first embodiment of the temperature equalizing plate sealing structure of the present invention;
[0024] Figure 3 is a combined cross-sectional view of a second embodiment of the temperature homogenizing plate sealing structure of the present invention;
[0025] Figure 4 is a combined cross-sectional view of a third embodiment of the temperature homogenizing plate sealing structure of the present invention;
[0026] Figure 5 It is a combined stereogram of a fourth embodiment of the temperature homogenizing plate sealing structure of the present invention;
[0027] Figure 6 is a combined cross-sectional view of a fifth embodiment of the temperature homogenizing plate sealing structure of the present invention;
[0028] Figure 7 It is a combined cross-sectional view of a sixth embodiment of the temperature homogenizing plate sealing structure of the present invention.
[0029] Explanation of the reference numerals: main body 1; first plate body 11; first side surface 111; second side surface 112; pit 113; second plate body 12; third side surface 121; fourth side surface 122; airtight chamber 13; lip edge 14; water injection channel 141; sealing stamping portion 142; first notch 143; second notch 144; groove portion 15; capillary structure 2; working liquid 3; tube body 4. DETAILED DESCRIPTION
[0030] See also Figure 1 , Figure 2 , is a three-dimensional exploded and assembled diagram of the first embodiment of the temperature-vaporizing plate sealing structure of the present invention. As shown in the figure, the temperature-vaporizing plate sealing structure of the present invention comprises: a body 1, a capillary structure 2;
[0031] The main body 1 has a first plate 11 and a second plate 12, and the first plate 11 and the second plate 12 are correspondingly covered to form a lip 14 and jointly define an airtight chamber 13, and the lip 14 surrounds the outer edge of the airtight chamber 13. The first plate 11 has a first side surface 111 and a second side surface 112, and the second plate 12 has a third side surface 121 and a fourth side surface 122. The first plate 11 and the second plate 12 are any one of aluminum, copper, commercially pure titanium, aluminum alloy, copper alloy, ceramic, stainless steel, or a mixed combination.
[0032] The lip 14 has a water injection channel 141 and a sealing stamping portion 142, one end of the water injection channel 141 is connected to the airtight chamber 13 and the other end is connected to the sealing stamping portion 142, the sealing stamping portion 142 is not in a straight shape, and the sealing stamping portion 142 is in any of an ohm shape, a U shape, a horseshoe shape, an X shape, a C shape, a wave shape, and a M shape, and the sealing stamping portion 142 is lower than the height of the lip 14 of the first plate body 11.
[0033] A groove portion 15 and the water injection channel 141 are formed by the first side surface 111 of the first plate body 11 protruding toward the second side surface 112. The second side surface, the fourth side surface 112, and the 122 are respectively arranged on the upper and lower sides of the main body 1, and the second side surface 112 is defined as a condensation surface, and the fourth side surface 122 is defined as a heat absorption surface. The second plate body 12 corresponds to covering the groove portion 15 to form the airtight chamber 13.
[0034] The capillary structure 2 is optionally arranged in the space of the airtight chamber 13 of the aforementioned main body 1, such as being optionally arranged on any one of the first side faces, third side faces 111, 121 of the first plate body, the second plate body 11, 12 in the airtight chamber 13, or being arranged on the surface of the first side faces, third side faces 111, 121 of the first plate body, the second plate body 11, 12 (not shown in the figure).
[0035] In this way, the sealing performance of the sealing stamping portion 142 is increased to improve the airtightness of the temperature equalizing plate, thereby preventing vacuum leakage and leakage of the working liquid.
[0036] See also Figure 3 , is a combined cross-sectional view of the second embodiment of the temperature equalizing plate sealing structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here. However, the difference between this embodiment and the first embodiment is that the capillary structure 2 is arranged in the airtight chamber 13 and overlaps with the first plate body and the second plate body 11 and 12. The capillary structure 2 can be any one or more of sintered powder, mesh body, fiber body, and corrugated plate. This embodiment is implemented by using a mesh body as an illustration but is not limited to it.
[0037] See also Figure 4, is a combined cross-sectional view of a third embodiment of the temperature equalizing plate sealing structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment, so it will not be repeated here. However, the difference between this embodiment and the aforementioned first embodiment is that a first side surface 111 of the first plate body 11 is provided with a plurality of pits 113, and the plurality of pits 113 protrude from the first side surface 111 toward the groove portion 15 and abut against one side of the capillary structure 2, so that the return water of the working liquid 3 after internal condensation during the internal vapor-liquid circulation of the body 1 can be increased, and the support between the first plate body 11 and the second plate body 11 and 12 can be increased. Of course, a support column can be arranged between the first plate body 11 and the second plate body 11, 12, and the two ends of the support column can respectively abut against the first side surface and the third side surface (not shown in the figure). The structure can also increase the support strength between the two.
[0038] See also Figure 5 , is a combined stereoscopic diagram of a fourth embodiment of the temperature equalizing plate sealing structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment, so it will not be repeated here. However, the difference between this embodiment and the aforementioned first embodiment is that the lip 14 of the sealing stamping portion 142 corresponding to the first plate body 11 and the second plate body 12 has a first notch 143 and a second notch 144. The first and second notches 143 can reduce the occurrence of stress concentration when the sealing stamping portion 142 needs to stamp downward on the part recessed into the lip range.
[0039] See also Figure 6 , is a combined cross-sectional view of the fifth embodiment of the temperature equalizing plate sealing structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here. However, the difference between this embodiment and the first embodiment is that the sealing stamping portion 142 is pressed into the recess from the first plate body 11 to the lip edge 14 of the second plate body 12 at the same time, which means that the sealing stamping portion of the main body 1 is lower than the lip edge height of the first plate body and the second plate body at the same time.
[0040] See also Figure 7 , is a combined cross-sectional view of a sixth embodiment of the temperature equalizing plate sealing structure of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here. However, the difference between this embodiment and the first embodiment is that the main body 1 further has a tube body 4, which is inserted into the water injection channel 141 (not shown in the figure because it overlaps with the tube body 4), and the tube body 4 is partially pressed into a flat shape by the sealing stamping portion 142, so that the airtight chamber 13 in the main body 1 can achieve the effect of maintaining vacuum airtightness.
[0041] The present invention mainly provides a temperature equalizing plate sealing structure without an exhaust water filling pipe, which can not only improve the defect of the prior art that the pipe body cannot be sealed to prevent leakage after being set, but also further prevent leakage in the direction of the water injection channel, and extend the sealing range to other directions, so that the lip of the body can be compressed in multiple directions to prevent leakage.
Claims
1. A temperature plate sealing structure, characterized in that: Include: A body, comprising a first plate and a second plate, wherein the first plate and the second plate are correspondingly covered to form a lip and jointly define an airtight chamber, wherein the lip surrounds the outer edge of the airtight chamber, wherein the lip has a water injection channel and a sealing stamping portion, wherein one end of the water injection channel is connected to the airtight chamber, and the other end is connected to the sealing stamping portion, wherein the sealing stamping portion is not in a straight line shape, and wherein the sealing stamping portion is in an ohm shape, a U shape, a horseshoe shape, a C shape, or a wave shape, wherein the sealing stamping portion is simultaneously pressed into a depression from the first plate toward the lip of the second plate, and is simultaneously lower than the lip height of the first plate and the second plate, wherein the first plate has a first side surface and a second side surface, and wherein the second plate has a third side surface and a fourth side surface; A capillary structure is arranged in the airtight chamber space of the aforementioned main body. The capillary structure is arranged on any one of the first plate body, the first side surface and the third side surface of the second plate body in the airtight chamber, or on the first side surface and the third side surface surface of the first plate body and the second plate body.
2. The temperature homogenizing plate sealing structure according to claim 1, characterized in that: A groove and the water injection channel are formed by the first side surface of the first plate body protruding toward the second side surface, and the second plate body covers the groove portion to form the airtight chamber.
3. The temperature homogenizing plate sealing structure according to claim 1, characterized in that: The capillary structure is arranged in the airtight chamber and overlapped with the first plate body and the second plate body.
4. The temperature equalizing plate sealing structure according to claim 2, characterized in that: The second side surface and the fourth side surface are respectively arranged on the upper and lower sides of the main body, and the second side surface is defined as a condensation surface, and the fourth side surface is defined as a heat absorption surface.
5. The temperature homogenizing plate sealing structure according to claim 1, characterized in that: The first plate body and the second plate body are made of any one of aluminum, copper, commercially pure titanium, aluminum alloy, copper alloy, ceramic, and stainless steel, or a mixed combination thereof.
6. The temperature homogenizing plate sealing structure according to claim 2, characterized in that: A plurality of pits are disposed on the first side surface of the first plate body. The plurality of pits protrude from the first side surface toward the groove portion and abut against one side of the capillary structure.
Citation Information
Patent Citations
Isothermal vapor chamber with seal
CN202014433U
Thinning heat conduction device with pipeless sealing structure and forming method of thinning heat conduction device
CN102748967A
Vapor chamber water injection part side seal structure and making method thereof
CN108302968A
Temperature equalizing plate sealing structure
CN212205766U