A Sub-6G-LTCC chip coupler suitable for solid-state lasers

Abstract

The present invention provides a Sub‑6G‑LTCC chip coupler suitable for a solid-state laser, comprising a coupler body arranged in a solid-state laser body, and a heat dissipation mechanism arranged on the surface of the coupler body through a fixing component, the heat dissipation mechanism comprising a heat dissipation shell arranged on the surface of the coupler body through a fixing component and having a heat dissipation cavity opened therein, a conduction component arranged on the heat dissipation shell for transferring heat generated by the coupler body to the heat dissipation shell, and a ventilation component arranged on the heat dissipation shell and used to accelerate the air circulation speed between the heat dissipation cavity and the outside; the conduction component is connected to a heat dissipation plate arranged in the heat dissipation cavity, the heat dissipation plate is a structure in which one side of two long plates is fixedly connected, and the angle between the two long plates is between 15 degrees and 45 degrees; the position where the two long plates are fixedly connected is opposite to the position where the air enters the heat dissipation cavity, and the present invention directly arranges the heat dissipation mechanism on the coupler body to achieve heat dissipation of the coupler body, thereby improving the heat dissipation effect of the coupler body.

Description

Technical Field

[0001] The invention relates to the technical field of couplers, and in particular to a Sub-6G-LTCC chip coupler suitable for solid-state lasers. Background Art

[0002] The photocoupler is an electrical-optical-electrical conversion device that uses light as a medium to transmit electrical signals. It consists of two parts: a light source and a light receiver. The light source and the light receiver are assembled in the same closed housing and isolated from each other by a transparent insulator. The pin of the light source is the input end, and the pin of the light receiver is the output end. The common light source is a light-emitting diode, and the light receiver is a photodiode, a phototransistor, etc. There are many types of photocouplers, the most common ones are photodiode type, phototransistor type, photoresistor type, photo-controlled thyristor type, photodarlington type, integrated circuit type, etc.

[0003] Most existing couplers do not have a heat dissipation function, while some couplers are provided with a heat dissipation device on one side. When manufacturing the coupler body, in order to make the coupler body have a heat dissipation function, the structure of the coupler body itself needs to be changed, but the heat dissipation effect is not ideal. Summary of the invention

[0004] In view of the above technical problems, the present invention provides a Sub-6G-LTCC chip coupler suitable for solid-state lasers, and directly sets a heat dissipation mechanism on the coupler body to achieve heat dissipation of the coupler body, thereby improving the heat dissipation effect of the coupler body.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solutions: a Sub-6G-LTCC chip coupler suitable for solid-state lasers, comprising a coupler body arranged in a solid-state laser body, and a heat dissipation mechanism arranged on the surface of the coupler body through a fixing component, wherein the heat dissipation mechanism comprises a heat dissipation shell arranged on the surface of the coupler body through the fixing component and having a heat dissipation cavity therein, a conduction component arranged on the heat dissipation shell for transferring heat generated by the coupler body to the heat dissipation shell, and a ventilation component arranged on the heat dissipation shell for accelerating the air circulation speed between the heat dissipation cavity and the outside;

[0006] The conduction component is connected to a heat sink disposed in the heat dissipation cavity. The heat sink is in the form of two long plates fixedly connected on one side. The angle between the two long plates is between degrees and degrees. The position where the two long plates are fixedly connected faces the position where the air enters the heat dissipation cavity.

[0007] The conduction assembly includes a conduction plate penetrating through the heat dissipation housing on the end surface of the coupler body, and a plurality of connection plates, one side of which is vertically arranged on the conduction plate and the other side is connected to the cavity wall of the heat dissipation cavity, wherein the plurality of connection plates are arranged in parallel and the heat dissipation plate is arranged between two adjacent connection plates;

[0008] A plurality of heat dissipation plates are arranged between every two adjacent connection plates, and the plurality of heat dissipation plates are alternately arranged on the two connection plates from one end to the other end.

[0009] Preferably, the fixing assembly includes two sliders respectively arranged on the lower end surface of the heat dissipation shell, which are away from each other and parallel to each other and have slide grooves, a mounting block arranged on the sliders, and a fixing belt which is sleeved on the coupler body and whose two ends can be connected to the mounting block respectively through the fixing blocks.

[0010] Preferably, the conducting plate, the connecting plate and the heat dissipating plate are all made of metal materials with a thermal conductivity greater than 100 W / mk.

[0011] Preferably, the conducting plate, the connecting plate and the heat dissipating plate are all made of metallic copper.

[0012] Preferably, the ventilation assembly includes two ventilation strips arranged in parallel at both ends of the connecting plates, and two air inlet pipes and exhaust pipes, one end of which is located outside the heat dissipation shell and the other end of which respectively penetrates the heat dissipation cavity and is vertically arranged on different ventilation strips and communicates with the interior of the ventilation strips. Openings that communicate with the interior of the ventilation strip are opened on the side of the ventilation strip between two adjacent connecting plates.

[0013] Preferably, a connecting groove is provided on the side surface of one side of the heat dissipation shell, and a connecting block which cooperates with the connecting groove is provided on the side surface of the heat dissipation shell away from the connecting groove.

[0014] The beneficial effects of the present invention are as follows: the heat dissipation mechanism is directly fixed on the coupler body to dissipate heat from the coupler body, thereby improving the heat dissipation effect of the coupler body. There is no need to change the structure of the coupler body. Only the heat dissipation mechanism needs to be customized or purchased and directly fixed on the coupler body. The installation is simple and the cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0016] Figure 1 This is a schematic diagram of the simplified structure of the Sub-6G-LTCC chip coupler suitable for solid-state lasers proposed in the present invention.

[0017] Figure 2This is a schematic diagram of the bottom-up structure of the Sub-6G-LTCC chip coupler suitable for solid-state lasers proposed in the present invention.

[0018] Figure 3 It is a schematic diagram of the heat dissipation housing structure of the present invention.

[0019] Figure 4 It is a bottom view of the structure of the heat dissipation housing of the present invention.

[0020] Figure 5 It is a schematic diagram of the internal structure of the heat dissipation housing of the present invention.

[0021] Figure 6 It is a schematic diagram of the structure of the conducting plate and the connecting plate of the present invention.

[0022] Figure 7 It is a schematic diagram of the heat dissipation plate structure of the present invention.

[0023] In the figure: 1. coupler body; 2. heat dissipation shell; 3. air inlet pipe; 4. exhaust pipe; 5. fixing belt; 6. slide groove; 7. mounting block; 8. fixing block; 9. connecting groove; 10. connecting block; 11. conduction plate; 12. connecting plate; 13. heat dissipation plate; 14. ventilation strip; 15. opening. DETAILED DESCRIPTION

[0024] In order to make the technical means, creative features, objectives and effects of the present invention easy to understand, the present invention is further described below in conjunction with specific embodiments and drawings, but the following embodiments are only preferred embodiments of the present invention, not all. Based on the embodiments in the implementation mode, other embodiments obtained by those skilled in the art without creative work are all within the scope of protection of the present invention.

[0025] See also Figure 1-7 A Sub-6G-LTCC chip coupler suitable for solid-state lasers, comprising a coupler body 1 disposed in a solid-state laser body, and a heat dissipation mechanism attached to the surface of the coupler body 1 through a fixing component, the heat dissipation mechanism comprising a heat dissipation shell 2 disposed on the surface of the coupler body 1 through a fixing component and having a heat dissipation cavity therein, a conduction component disposed on the heat dissipation shell 2 for transferring heat generated by the coupler body 1 to the heat dissipation shell 2, and a ventilation component disposed on the heat dissipation shell 2 for accelerating the air circulation speed between the heat dissipation cavity and the outside;

[0026] The conduction component is connected to the heat sink 13 in the heat dissipation cavity. The heat sink 13 is a structure in which two long plates are fixedly connected on one side, and the angle between the two long plates is between 15 degrees and 45 degrees; the position where the two long plates are fixedly connected is opposite to the air inlet position in the heat dissipation cavity.

[0027] like Figure 1-7As shown, when the coupler body 1 generates heat during operation, the conduction component will be increased and transferred to the heat sink 13 arranged in the heat dissipation cavity, wherein the heat sink 13 is equivalent to being connected by one side of two long plates, and the connection point is at the position of the air inlet in the heat dissipation cavity, so that the two long plate surfaces and the direction of air flow in the heat dissipation cavity are at a certain angle, and the angle range is between 7.5 degrees and 22.5 degrees, so that when the air flows, it is not blown parallel to the long plate surface or hits the long plate surface vertically. When the air blows onto the long plate surface at a certain angle, more heat on the long plate is taken away than when the air blows parallel to the long plate surface, thereby improving the heat dissipation effect of the coupler body 1, and compared with when the long plate surface is perpendicular to the air flow direction, although this will take away a lot of heat, it also slows down the air flow speed, so that the heat cannot be quickly discharged from the heat dissipation shell 2, resulting in a lower heat dissipation effect than the setting in which the long plate is at a certain angle to the air flow direction. Therefore, by setting the heat sink 13, the heat dissipation effect of the coupler body 1 is better than the traditional situation or the general situation.

[0028] The fixing assembly includes two sliders which are respectively arranged on the lower end surface of the heat dissipation shell 2 and are far away from each other and parallel to each other and have slide grooves 6, a mounting block 7 arranged on the slider, and a fixing belt 5 which is sleeved on the coupler body 1 and can be connected to the mounting block 7 at both ends through fixing blocks 8.

[0029] like Figure 1-2 As shown, the fixing belt 5 can be made of metal material or woven material. The mounting block 7 is arranged in the slide groove 6 through the slider to increase the selection range of the fixing point on the heat dissipation shell 2. This can avoid the situation where the mounting block 7 is fixed on the lower end surface of the heat dissipation shell 2 and the components on the coupler body 1 block the fixing belt 5 and cannot be fixed at this position. By moving the slider, it is convenient to change the position where the fixing belt 5 is fixed on the coupler body 1.

[0030] The heat dissipation housing 2 is directly fixed to the coupler body 1 through a fixing assembly to dissipate heat. There is no need to change the structure of the coupler body 1. Only the heat dissipation mechanism needs to be customized or purchased and directly fixed on the coupler body 1. The installation is simple and the cost is low.

[0031] The conduction component includes a conduction plate 11 that passes through the heat dissipation shell 2 and is adjacent to the end surface of the coupler body 1, and multiple connecting plates 12 that are vertically arranged on the conduction plate 11 on one side and connected to the wall of the heat dissipation cavity on the other side. The multiple connecting plates 12 are arranged in parallel and a heat dissipation plate 13 is arranged between two adjacent connecting plates 12.

[0032] The conductive plate 11 fits closely with the coupler body 1 so that the heat generated by the coupler body 1 during operation is transferred to the conductive plate 11 , and then to the heat dissipation plate 13 through the connecting plate 12 , and then to the air flowing in the heat dissipation cavity through the heat dissipation plate 13 , so as to dissipate the heat of the coupler body 1 .

[0033] A plurality of heat dissipation plates 13 are disposed between every two adjacent connection plates 12 , and the plurality of heat dissipation plates 13 are alternately disposed on the two connection plates 12 from one end to the other end.

[0034] The conducting plate 11 , the connecting plate 12 and the heat dissipating plate 13 are all made of metal materials with a thermal conductivity greater than 100 W / mk.

[0035] The conducting plate 11 , the connecting plate 12 and the heat dissipating plate 13 are all made of metal copper.

[0036] The thermal conductivity of pure copper is as high as 398W / mk, which is second only to silver with a thermal conductivity of 411W / mk among common metal materials, but the difference is not very large, and the value of copper is lower than the price of silver. Therefore, using copper in production and processing can facilitate heat conduction and reduce production costs.

[0037] The ventilation assembly includes two ventilation strips 14 arranged in parallel at both ends of the connecting plate 12, and two air inlet pipes 3 and exhaust pipes 4, one end of which is located outside the heat dissipation shell 2 and the other end of which respectively penetrates the heat dissipation cavity and is vertically arranged on different ventilation strips 14 and is connected to the inside of the ventilation strips 14. The side of the ventilation strip 14 located between the two adjacent connecting plates 12 is provided with an opening 15 that is connected to the inside of the ventilation strip 14.

[0038] Here, the air inlet pipe 3 is connected to the air intake fan arranged on the fixed laser, and the air exhaust pipe 4 to the outside is connected to the heat dissipation port on the solid laser to discharge the air containing heat.

[0039] A connecting groove 9 is provided on the side surface of one side of the heat dissipation housing 2 , and a connecting block 10 which is matched and connected with the connecting groove 9 is provided on the side surface of the heat dissipation housing 2 away from the connecting groove 9 .

[0040] like Figure 2-3 As shown, the heat dissipation shell 2 can be spliced. For different coupler bodies 1, by splicing multiple heat dissipation shells 2 onto the coupler body 1, the heat dissipation effect of the coupler body 1 can be ensured.

[0041] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A Sub-6G-LTCC chip coupler suitable for solid-state lasers, comprising a coupler body (1) disposed in a solid-state laser body, and a heat dissipation mechanism attached to the surface of the coupler body (1) through a fixing component, characterized in that: The heat dissipation mechanism comprises a heat dissipation shell (2) which is arranged on the surface of the coupler body (1) through the fixing component and has a heat dissipation cavity inside, a conduction component arranged on the heat dissipation shell (2) and used to transfer the heat generated by the coupler body (1) to the heat dissipation shell (2), and a ventilation component arranged on the heat dissipation shell (2) and used to accelerate the air circulation speed between the inside of the heat dissipation cavity and the outside; The conduction component is connected to a heat sink (13) disposed in the heat dissipation cavity, and the heat sink (13) is in the form of two long plates fixedly connected on one side, with the angle between the two long plates being between 15 and 45 degrees; the position where the two long plates are fixedly connected faces the position where the air enters the heat dissipation cavity; The conduction component comprises a conduction plate (11) penetrating the heat dissipation housing (2) on an end surface adjacent to the coupler body (1), and a plurality of connection plates (12) one side of which is vertically arranged on the conduction plate (11) and the other side of which is connected to the cavity wall of the heat dissipation cavity, wherein the plurality of connection plates (12) are arranged in parallel and a heat dissipation plate (13) is arranged between two adjacent connection plates (12); A plurality of heat dissipation plates (13) are arranged between every two adjacent connecting plates (12), and the plurality of heat dissipation plates (13) are alternately arranged on the two connecting plates (12) from one end to the other end.

2. The Sub-6G-LTCC chip coupler suitable for solid-state lasers according to claim 1, characterized in that: The fixing assembly comprises two sliding blocks which are respectively arranged on the lower end surface of the heat dissipation housing (2) and are spaced apart from each other and are parallel to each other and have sliding grooves (6), a mounting block (7) arranged on the sliding blocks, and a fixing belt (5) which is sleeved on the coupler body (1) and can be connected to the mounting block (7) at both ends through fixing blocks (8).

3. The Sub-6G-LTCC chip coupler suitable for solid-state lasers according to claim 1, characterized in that: The conducting plate (11), the connecting plate (12) and the heat dissipating plate (13) are all made of metal materials with a thermal conductivity greater than 100 W / mk.

4. The Sub-6G-LTCC chip coupler suitable for solid-state lasers according to claim 3, characterized in that: The conducting plate (11), the connecting plate (12) and the heat dissipating plate (13) are all made of metallic copper.

5. A Sub-6G-LTCC chip coupler suitable for solid-state lasers according to any one of claims 3 to 4, characterized in that: The ventilation assembly comprises two ventilation strips (14) arranged in parallel at both ends of the connecting plate (12), and two air inlet pipes (3) and air outlet pipes (4), one end of which is located outside the heat dissipation shell (2) and the other end of which respectively penetrates the heat dissipation cavity and is vertically arranged on different ventilation strips (14) and is connected to the inside of the ventilation strips (14). The side of the ventilation strip (14) located between two adjacent connecting plates (12) is provided with an opening (15) that is connected to the inside of the ventilation strip (14).

6. The Sub-6G-LTCC chip coupler suitable for solid-state lasers according to claim 1, characterized in that: A connecting groove (9) is provided on the side surface of one side of the heat dissipation housing (2), and a connecting block (10) which is matched and connected with the connecting groove (9) is provided on the side surface of the heat dissipation housing (2) away from the connecting groove (9).

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