A nanofluid resuspension type electronic equipment heat dissipation system and heat dissipation method

Abstract

The invention discloses a nanofluid re-suspension type electronic equipment heat dissipation system and heat dissipation method. The heat dissipation system comprises a heat dissipation shell, a condensation pipe, a dielectric retainer, a positive electrode, a negative electrode and a voltage source. The heat dissipation shell has a cooling cavity inside, the bottom of the cooling cavity is filled with nanofluid, the dielectric retainer is arranged on the front inner wall of the heat dissipation shell, the positive electrode is arranged inside the rear side wall of the heat dissipation shell, the negative electrode is arranged inside the rear side wall of the heat dissipation shell as a whole, the outer end of the positive electrode is connected to the positive electrode of the voltage source, the top of the heat dissipation shell and the side wall of the bottom end of the heat dissipation shell are connected to the cooling cavity through the condensation pipe, the negative electrode is arranged near the bottom of the heat dissipation shell, an electric field is formed between the rear side wall of the heat dissipation shell and the side cover plate, and between the cooling cavity and the positive electrode, so that the nanofluid in the heat dissipation shell is suspended again, the heat dissipation performance of the system is improved, and the problem of drying out or insufficient supply of the nanofluid working medium is well solved.

Description

Technical Field

[0001] The present invention belongs to the field of heat dissipation technology, in particular to the field of heat pipe heat dissipation technology, and more particularly to a nanofluid re-suspension type electronic equipment heat dissipation system and a heat dissipation method. Background Art

[0002] As integrated circuits, microprocessors, power amplifiers and other high-performance electronic devices are developing towards high density, high power and high frequency, it is particularly urgent and important to adopt effective heat dissipation and cooling methods in order to enable these high-performance electronic devices to perform at their best and ensure operational reliability, safety and service life. However, the heat generated by the packaging area of ​​high-performance electronic devices has exceeded 100w / cm 2 , the heat dissipation technology of these high-performance devices is increasingly becoming a bottleneck restricting the development of technology. Most of the current electronic devices and equipment adopt air cooling and heat pipe cooling. Its advantages of air cooling and heat dissipation are low cost and simple structure, and are widely used in various electronic devices. However, it has high noise and poor cooling effect, which is far from meeting the heat dissipation needs of high-performance electronic devices. Heat pipe is a heat transfer element with excellent performance. It relies on the phase change of its internal working fluid to achieve heat transfer. It has the characteristics of large heat transfer capacity, high isotherm, constant temperature, and strong environmental adaptability. Traditional heat pipes have the problem of working fluid drying or insufficient supply, resulting in reduced heat dissipation performance. The EHD effect can well solve the problem of working fluid drying or insufficient supply, and ensure the normal and efficient operation of heat pipes. For this reason, the introduction of nanofluids into the heat exchange field is combined with the active enhancement of the electric field. Compared with pure working fluids, the electric field has a more significant effect on the enhanced heat exchange of nanofluids. At present, no relevant technical documents have been found for coupling nanofluids with electric fields for heat dissipation in electronic equipment heat dissipation systems. Summary of the invention

[0003] The purpose of the present invention is to provide a nanofluid re-suspension electronic equipment heat dissipation system and heat dissipation method. The present invention can use the electric field to cause the nanofluid in the heat dissipation housing to suspend again, which can effectively solve the problem of nanofluid working fluid drying up or insufficient supply, and prevent the nanofluid working fluid from easily agglomerating and depositing in the cooling cavity after working for a long time, thereby improving the heat dissipation performance of the heat dissipation housing, and can effectively solve the problem of nanofluid working fluid drying up or insufficient supply, and ensure the normal and efficient operation of the heat pipe. In order to achieve the above purpose, the present invention adopts the following technical effects:

[0004] According to one aspect of the present invention, a nanofluid re-suspension electronic device heat dissipation system is provided, the heat dissipation system includes a voltage source, the heat dissipation system also includes a heat dissipation shell, a condensation pipe, a dielectric retainer, a positive electrode and a negative electrode, the heat dissipation shell has a cooling cavity inside, the bottom of the cooling cavity is filled with nanofluid, the dielectric retainer is arranged on the front inner wall of the heat dissipation shell, the positive electrode is arranged inside the rear side wall of the heat dissipation shell, the negative electrode is arranged as a whole inside the rear side wall of the heat dissipation shell, the outer end of the positive electrode is connected to the positive electrode of the voltage source, the top end of the heat dissipation shell and the bottom side wall of the heat dissipation shell are connected to the cooling cavity through the condensation pipe, the negative electrode is arranged near the bottom of the heat dissipation shell, one end of the negative electrode extends into the cooling cavity and is located below the liquid surface of the nanofluid, and the other end of the negative electrode extends out of the heat dissipation shell to be connected to the negative electrode of the voltage source.

[0005] The above scheme is further preferred, the top of the heat dissipation shell has an upper opening, and the front side wall of the heat dissipation shell is provided with a side opening extending vertically downward along the upper opening close to the bottom end, and integrated plug-in slide grooves are provided along both sides and the bottom of the side opening, and the medium retainer is plugged into the slide grooves on both sides of the side opening, and a side cover plate for sealing and fixing the medium retainer is provided on the side opening, and an upper cover plate for fixing the top of the medium retainer is provided on the upper opening, the negative electrode is located below the lower end of the side opening, and the top of the upper cover plate is connected to the bottom side wall of the cooling cavity through a condensation pipe.

[0006] The above scheme is further preferred in that a plurality of outflow joints connected to the cooling cavity are arranged on the upper cover plate, and a plurality of inflow joints connected to the cooling cavity are arranged on the bottom side wall of the heat dissipation shell opposite to the side opening, and each outflow joint and inflow joint are connected to each other through a condensation pipe.

[0007] The above scheme is further preferred in that a groove vertically distributed from the upper opening direction to the bottom direction is provided on the inner side wall of the medium retainer, the upper cover plate is connected to the upper end of the medium retainer by bolts, and the lower end of the medium retainer is sealed and bonded to the bottom of the plug-in slide groove.

[0008] The above scheme is further preferred, wherein the medium retainer comprises an upper medium retainer and a lower medium retainer, and upper and lower integrally connected grooves are arranged on the inner side walls of the upper medium retainer and the inner side walls of the lower medium retainer, the upper cover plate is connected to the upper end of the upper medium retainer by bolts, the lower end of the upper medium retainer is in sealing contact with the upper end of the lower medium retainer, and the lower end of the lower medium retainer is sealed and bonded to the bottom of the plug-in slide groove.

[0009] In the above scheme, it is further preferred that the groove is a rectangular groove, a V-shaped groove, a trapezoidal groove or a wavy groove, and a capillary medium structure or a multi-porous medium structure is provided on the inner wall of the groove.

[0010] In the above scheme, it is further preferred that the nanofluid is formed by mixing nanopowder and solvent, and the particle size of the nanopowder is 10nm-100nm.

[0011] The above scheme is further preferred, wherein the nanopowder is a mixture of one or more of nanometal powder, nanometal oxide powder and nanononmetal, and the solvent is one of methanol, ethanol, acetone, toluene, water, liquid ammonia, liquid nitrogen, liquid carbon dioxide or R123 refrigerant.

[0012] According to another aspect of the present invention, the present invention utilizes a heat dissipation method of a nanofluid re-suspension electronic device heat dissipation system, comprising the following steps: the heat dissipation housing obtains heat from the electronic device and transfers the heat to a cooling cavity inside the heat dissipation housing; the nanofluid stored at the bottom of the cooling cavity is heated and vaporized and gradually rises; a voltage source is started to form an electric field between the positive electrode inside the rear side wall of the heat dissipation housing and the side cover plate and between the negative electrode and the positive electrode at the bottom of the cooling cavity, so that the nanofluid deposited in the cooling cavity is suspended again; a portion of the heated and vaporized nanofluid is immersed in a capillary medium structure or a multi-aperture medium structure on the inner wall of a medium holder for cooling and heat dissipation; due to the continuous increase in the heated and vaporized area, another portion of the heated and vaporized nanofluid escapes from the top of the heat dissipation housing and is condensed through a condensation pipe, and then flows back to the bottom of the cooling cavity; the condensed nanofluid is circulated again to be heated and vaporized to take away the heat in the cooling cavity, thereby cyclically dissipating the heat of the heat dissipation housing.

[0013] In summary, the present invention adopts the above technical solution, and the present invention has the following technical effects:

[0014] The heat pipe system of the present invention can form an electric field between the rear side wall and the side cover plate of the heat dissipation shell and between the cooling cavity and the positive electrode, so as to cause the nanofluid in the heat dissipation shell to be suspended again, effectively solving the problem of the nanofluid working medium drying up or insufficient supply, and preventing the nanofluid working medium from being easily deposited in the cooling cavity due to agglomeration after working for a long time, thereby improving the heat dissipation performance of the heat dissipation shell, and effectively solving the problem of the nanofluid working medium drying up or insufficient supply, ensuring the normal and efficient operation of the heat pipe, and the generated electric field increases the capillary wetting length and the filling rate in the capillary medium structure or the multi-aperture medium structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the system structure of a nanofluid re-suspension electronic equipment heat dissipation system of the present invention;

[0016] Figure 2 It is a schematic cross-sectional structure diagram of a nanofluid re-suspension type electronic equipment heat dissipation system of the present invention;

[0017] Figure 3 It is a schematic diagram of the exploded structure of a nanofluid re-suspension electronic equipment heat dissipation system of the present invention;

[0018] Figure 4 is a schematic structural diagram of a medium retainer of the present invention;

[0019] Figure 5 It is a working schematic diagram of a nanofluid resuspension type electronic equipment heat dissipation system of the present invention;

[0020] In the accompanying drawings, there are a heat dissipation shell, a condensation pipe 2, a dielectric retainer 3, a positive electrode 4, a negative electrode 5, a voltage source 6, a nanofluid 7, a cooling cavity 10, an outflow joint 11, an inflow joint 12, a groove 30, an upper opening 100, a side opening 101, a plug-in slide 102, a side cover plate 103, an upper cover plate 104, an upper dielectric retainer 300, a lower dielectric retainer 301, and bolts 104a. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and preferred embodiments. However, it should be noted that many details listed in the specification are only for the purpose of enabling the reader to have a thorough understanding of one or more aspects of the present invention, and these aspects of the present invention can be implemented even without these specific details.

[0022] Combination Figure 1 and Figure 2As shown, according to a nanofluid re-suspension electronic device heat dissipation system of the present invention, the heat dissipation system includes a heat dissipation housing 1, a condensation pipe 2, a dielectric holder 3, a positive electrode 4, a negative electrode 5 and a voltage source 6, wherein the positive electrode 4 and the negative electrode 5 can be in the form of a wire electrode, a needle electrode, a mesh electrode, a flat electrode or any combination of two thereof, the heat dissipation housing 1 is made of an insulating material, and its length, width and height are 25-30 mm, 10-15 mm and 45-60 mm respectively, the wall thickness of the heat dissipation housing 1 is 2-3 mm, the heat dissipation housing 1 has a cooling cavity 10 inside, and the bottom of the cooling cavity 10 is filled with a nanofluid 7, and the nano The fluid may be a single nanofluid formed by mixing a nanoparticle with a base liquid solvent, or a mixed nanofluid formed by mixing a plurality of nanoparticles with a base liquid. The nanofluid 7 is a colloidal mixture formed by mixing nanoparticles with a base liquid, and solid nanoparticles (including but not limited to metal, metal oxide, non-metal oxide and other nanoparticles) are dispersed in a base liquid or solvent (the base liquid includes but is not limited to traditional heat exchange medium, such as water, mineral oil and ethylene glycol). The particle size of the nanoparticles is 10nm-100nm, preferably 20nm-40nm, and the nanoparticles are nano metal powders, nano metal oxide powders and nano non-metallic The nano powder used in the present invention is nano copper powder, nano aluminum powder, etc., the nano metal oxide powder is nano alumina powder, nano ferroferric oxide powder, nano titanium dioxide powder or nano manganese dioxide powder, etc., the nano non-metal is nano silicon dioxide silicon powder or nano silicon carbide powder, etc., the base liquid or solvent of the present invention can be one of methanol, ethanol, acetone, toluene, liquid ammonia, liquid nitrogen, liquid carbon dioxide or R123 refrigerant, the medium retainer 3 is arranged on the front inner wall of the heat dissipation housing 1, the width of the medium retainer 3 is 15mm-20mm, the length (height) is 25mm-35mm, the thickness is 0 .2mm-1.5mm, the positive electrode 4 is arranged inside the rear side wall of the heat dissipation shell 1, and the positive electrode 4 is composed of more than 3 parallel wire electrodes. The negative electrode 5 is arranged as a whole inside the rear side wall of the heat dissipation shell 1, and the outer end of the positive electrode 4 is connected to the positive electrode of the voltage source 6. The top of the heat dissipation shell 1 and the bottom side wall of the heat dissipation shell 1 are connected to the cooling cavity 10 through the condensation pipe 2. The negative electrode 5 is arranged near the bottom of the heat dissipation shell 1, and one end of the negative electrode 5 extends into the cooling cavity 10 and is located below the liquid surface of the nanofluid 7, and the other end of the negative electrode 5 extends out of the heat dissipation shell 1 and is connected to the negative electrode (ground) of the voltage source 6.

[0023] In the present invention, combined with Figure 1 , Figure 2 and Figure 3As shown, the top of the heat dissipation housing 1 has an upper opening 100, and a side opening 101 is provided on the front side wall of the heat dissipation housing 1 vertically downward along the upper opening 100 close to the bottom, and an integrated plug-in slide 102 is provided along both sides and the bottom of the side opening 100, and the medium holder 3 is plugged into the slides on both sides of the side opening 100, and a side cover plate 103 for sealing and fixing the medium holder 3 is provided on the side opening 101, and an upper cover plate 104 for fixing the top of the medium holder 3 is provided on the upper opening 100, and the negative electrode 5 is located at the side opening Below the lower end of the opening 100, the top of the upper cover plate 104 is connected to the bottom side wall of the cooling cavity 10 through the condensation pipe 2, and a plurality of outflow joints 11 connected to the cooling cavity 10 are arranged on the upper cover plate 104, and a plurality of inflow joints 12 connected to the cooling cavity 10 are arranged on the bottom side wall of the heat dissipation housing 1 on the side opposite to the side opening 101, and each outflow joint 11 is connected to the inflow joint 12 through the condensation pipe 2, and a groove 30 vertically distributed from the upper opening 100 to the bottom direction is arranged on the inner side wall of the medium retainer 3, such as Figure 4As shown, the groove 30 is a rectangular groove, a V-shaped groove, a trapezoidal groove or a wavy groove, and a capillary medium structure or a multi-aperture medium structure is arranged on the inner wall of the groove 30. The aperture medium structure of the inner wall of the groove 30 is formed by a material with good wettability to form a large number of densely packed tiny gaps. The upper cover plate 104 is connected to the upper end of the medium holder 3 by bolts 104a, and the lower end of the medium holder 3 is sealed and bonded to the bottom of the plug-in slide 102; the medium holder 3 includes an upper medium holder 300 and a lower medium holder 301, and the upper medium holder The inner wall of the medium holder 300 and the inner wall of the lower medium holder 301 are provided with a groove 30 which is integrally connected from top to bottom. The upper cover plate 104 is connected to the upper end of the upper medium holder 300 by means of bolts 104a. The lower end of the upper medium holder 300 is in sealing contact with the upper end of the lower medium holder 301. The lower end of the lower medium holder 301 is sealed and bonded to the bottom of the plug-in slide groove 102. The lower medium holder 301 is plugged and assembled into the plug-in slide groove 102 for fixing. Then, the upper medium holder 300 is inserted. Then, the side cover plate 103 is assembled on the heat dissipation shell. The rear side of the heat dissipation housing 1 is sealed to seal the side opening 101 and fix the medium holder 3 on the rear side of the heat dissipation housing 1. Then, the heat dissipation housing 1 is filled with nanofluid 7. The height of the nanofluid 7 is flush with or below the lower edge of the side opening 101. The negative electrode 5 is submerged and covered by the nanofluid 7. The upper opening 100 at the top of the heat dissipation housing 1 is sealed by the upper cover plate 104 and the upper medium holder 300 is fixedly connected by bolts 104a to ensure internal sealing. The upper cover plate 104 is connected to the cooling medium holder 300 through the condensation pipe 2. The bottom side wall of the cooling cavity 10 is connected and the vacuum inside the cooling cavity 10 is extracted, and a good circulation connection state is ensured between the top and the bottom side wall of the heat dissipation shell 1, the positive electrode 4 of the inner cavity side wall of the heat dissipation shell 1 and the side cover 103 (rear cover) generate an electric field, and an electric field is generated between the positive electrode 4 of the inner cavity side wall of the heat dissipation shell 1 and the negative electrode 5 close to the bottom of the cooling cavity 10, the side cover 103 (rear cover) and the negative electrode 5 close to the bottom of the cooling cavity 10 are grounded, and the positive electrode 4 in the inner cavity side wall of the heat dissipation shell 1 is connected to the high voltage end (positive pole) of the voltage source 6, such as Figure 5As shown, the electric field generated by the inner cavity side wall electrode of the cooling cavity 10 and the side cover plate 103 (rear cover plate) increases the capillary wetting length and the filling rate in the capillary structure or the porous medium structure. The capillary medium structure or the multi-aperture medium structure processes a smaller groove 30 on the flat substrate (the side wall of the medium holder 3). The groove 30 has a capillary structure, and the depth of the groove 30 is 0.3-0.5 mm, and the width of the groove 30 is 0.3-0.8 mm. After the nanofluid 7 is immersed in the inner cavity, the height of the nanofluid in the groove 30 is higher than the internal liquid level in the cooling cavity 10, and the side cover plate 103 is used as the back cover plate. 03 (rear cover) connects the electronic equipment to dissipate heat and transfer heat to the capillary medium structure or the multi-porous medium structure. The nanofluid in the groove 30 is vaporized by heat, and the steam enters the condensation pipe 2 and condenses into liquid and flows into the cooling cavity 10 again, forming a complete heat pipe system cycle. The electric field generated by the positive electrode 4 in the inner cavity side wall of the heat dissipation shell 1 and the side cover 103 (rear cover) increases the capillary wetting length and filling rate in the capillary medium structure or the multi-porous medium structure. The electric field generated by the positive electrode 4 in the inner cavity side wall of the heat dissipation shell 1 and the negative electrode 5 at the bottom can re-suspend the deposited nanoparticles.

[0024] In the present invention, combined with Figure 1 , Figure 2 , Figure 3 and Figure 5As shown, the present invention is a heat dissipation method for a nanofluid re-suspension electronic device heat dissipation system, comprising the following steps: the heat dissipation housing 1 obtains the heat of the electronic device, and transfers the heat to the cooling cavity 10 inside the heat dissipation housing 1, the nanofluid 7 stored at the bottom of the cooling cavity 10 is heated and vaporized and gradually rises, and the voltage source 6 is started. The voltage source 6 is a high-voltage alternating voltage or a high-voltage direct current voltage. The voltage range of the high-voltage alternating voltage or the high-voltage direct current voltage is above 1000 volts, and its upper limit voltage does not break down the heat dissipation housing 1 as the maximum upper limit voltage, so that an electric field is formed between the positive electrode 4 inside the rear side wall of the heat dissipation housing 1 and the side cover plate 103, and an EHD effect is generated inside the heat dissipation housing 1, thereby increasing the capillary wetting length and the filling rate in the capillary medium structure or the multi-aperture medium structure, and forming an electric field between the negative electrode 5 and the positive electrode 4 at the bottom of the cooling cavity 10 so that the deposited nanoparticles can be resuspended, the stability of the thermophysical properties of the nanofluid 7 is maintained, and the nanofluid can also be reduced. The preparation difficulty and cost are reduced, so that the nanofluid 7 deposited in the cooling cavity 10 is suspended again, and a part of the heated and vaporized nanofluid is immersed in the capillary medium structure or the multi-porous medium structure of the inner wall of the medium retainer 3 for cooling and heat dissipation. Due to the continuous increase in the heated vaporization area, another part of the heated and vaporized nanofluid 7 escapes from the top of the heat dissipation shell 1 and is condensed through the condensation pipe 2, and then flows back to the bottom of the cooling cavity 10. The condensed nanofluid is heated again and vaporized to take away the heat in the cooling cavity 10, thereby cyclically dissipating the heat of the heat dissipation shell 1. The present invention utilizes the coupling between the electric field, the flow field and the temperature field to re-suspend the nanoparticles and form a predetermined direction of movement under the action of the electric field, so as to achieve the effect of enhanced heat exchange, avoid the nanofluid working medium from being easily deposited in the cooling cavity 10 due to agglomeration after working for a long time, improve the heat dissipation performance of the heat dissipation shell 1, and can well solve the problem of nanofluid working medium burning dry or insufficient supply, and ensure the normal and efficient operation of the heat pipe.

[0025] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A nanofluid resuspension electronic device heat dissipation system, the heat dissipation system comprising a voltage source, characterized in that: The heat dissipation system further comprises a heat dissipation shell, a condensation pipe, a dielectric holder, a positive electrode and a negative electrode. The heat dissipation shell has a cooling cavity inside, the bottom of the cooling cavity is filled with nanofluid, the dielectric holder is arranged on the front inner wall of the heat dissipation shell, the positive electrode is arranged inside the rear wall of the heat dissipation shell, the negative electrode is arranged as a whole inside the rear wall of the heat dissipation shell, the outer end of the positive electrode is connected to the positive electrode of the voltage source, the top of the heat dissipation shell and the side wall of the bottom end of the heat dissipation shell are connected to the cooling cavity through the condensation pipe, the negative electrode is arranged near the bottom of the heat dissipation shell, one end of the negative electrode extends into the cooling cavity and is located below the liquid surface of the nanofluid, and the other end of the negative electrode extends outside the heat dissipation shell to be connected to the negative electrode of the voltage source; The top of the heat dissipation shell has an upper opening, and a side opening is provided on the front side wall of the heat dissipation shell vertically downward along the upper opening close to the bottom end, and integrated plug-in slide grooves are provided along the two sides and the bottom of the side opening, and the medium retainer is inserted into the slide grooves on both sides of the side opening, and a side cover plate for sealing and fixing the medium retainer is provided on the side opening, and an upper cover plate for fixing the top of the medium retainer is provided on the upper opening, and the negative electrode is located below the lower end of the side opening, and the top of the upper cover plate is connected to the bottom side wall of the cooling cavity through a condensation pipe; A plurality of outflow joints connected to the cooling cavity are arranged on the upper cover plate, and a plurality of inflow joints connected to the cooling cavity are arranged on the bottom side wall of the heat dissipation shell opposite to the side opening, and each outflow joint and inflow joint are interconnected through a condensation pipe; the nanofluid is formed by a mixture of nanopowder and solvent, and the particle size of the nanopowder is 10nm-100nm; the nanopowder is a mixture of one or more of nanometal powder, nanometal oxide powder and nanonon-metal.

2. The nanofluid resuspension electronic device heat dissipation system according to claim 1, characterized in that: A groove vertically distributed from the upper opening direction to the bottom direction is provided on the inner side wall of the medium retainer, the upper cover plate is connected to the upper end of the medium retainer by bolts, and the lower end of the medium retainer is sealed and bonded to the bottom of the plug-in slide groove.

3. The nanofluid resuspension electronic device heat dissipation system according to claim 2, characterized in that: The medium retainer includes an upper medium retainer and a lower medium retainer, and upper and lower integrally connected grooves are arranged on the inner side walls of the upper medium retainer and the inner side walls of the lower medium retainer. The upper cover plate is connected to the upper end of the upper medium retainer by bolts, and the lower end of the upper medium retainer is in sealing contact with the upper end of the lower medium retainer, and the lower end of the lower medium retainer is sealed and bonded to the bottom of the plug-in slide groove.

4. A nanofluid resuspension electronic device heat dissipation system according to claim 2 or 3, characterized in that: The groove is a rectangular groove, a V-shaped groove, a trapezoidal groove or a wavy groove, and a capillary medium structure or a multi-aperture medium structure is arranged on the inner wall of the groove.

5. The nanofluid resuspension electronic device heat dissipation system according to claim 1, characterized in that: The solvent is one of methanol, ethanol, acetone, toluene, water, liquid ammonia, liquid nitrogen, liquid carbon dioxide or R123 refrigerant.

6. A heat dissipation method using a nanofluid resuspension electronic device heat dissipation system according to any one of claims 1 to 5, characterized in that: The invention comprises the following steps: the heat dissipation shell obtains the heat of the electronic device and transfers the heat to the cooling cavity inside the heat dissipation shell; the nanofluid stored at the bottom of the cooling cavity is vaporized by the heat and gradually rises; the voltage source is started to form an electric field between the positive electrode inside the rear side wall of the heat dissipation shell and the side cover plate and between the negative electrode and the positive electrode at the bottom of the cooling cavity, so that the nanofluid deposited in the cooling cavity is suspended again; a part of the nanofluid vaporized by the heat is immersed in the capillary medium structure or the multi-aperture medium structure on the inner wall of the medium holder for cooling and heat dissipation; due to the continuous increase of the vaporization area by the heat, another part of the nanofluid vaporized by the heat escapes from the top of the heat dissipation shell and is condensed through the condensation pipe, and then flows back to the bottom of the cooling cavity again; the condensed nanofluid is heated again and vaporized to take away the heat in the cooling cavity, thereby cyclically dissipating the heat of the heat dissipation shell.

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