Control module and manufacturing method thereof, and electronic equipment

Abstract

The present application discloses a control module and a manufacturing method thereof, and an electronic device, and belongs to the field of display technology. The control module includes a circuit board, an IC, and a shielding cover. Since the shielding cover has a dispensing hole for dispensing glue, on the basis of soldering the IC to the circuit board, glue can be dispensed between the IC and the circuit board through the dispensing hole, so that the IC can be effectively fixed on the circuit board by both soldering and gluing, thereby improving the yield of the control module.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a control module and a manufacturing method thereof, and an electronic device. Background Art

[0002] The control module is one of the essential components of electronic equipment. The control module generally includes a circuit board, an integrated circuit (IC) soldered on the circuit board, and a shielding cover covering the IC, which can be used to shield the interference of other electrical signals on the operation of the IC.

[0003] However, due to the falling off of solder during IC soldering, the IC may not be effectively fixed on the circuit board, thus affecting the yield of the control module. Summary of the invention

[0004] The present disclosure provides a control module and a manufacturing method thereof, and an electronic device, which can solve the problem of low yield of the control module in the related art. The technical solution is as follows:

[0005] In one aspect, a control module is provided, the control module comprising:

[0006] Circuit boards;

[0007] An integrated circuit IC located on the circuit board;

[0008] A shielding cover which is welded on the circuit board and has the IC cover disposed therein;

[0009] Wherein, the shielding cover has a glue dispensing hole for dispensing glue.

[0010] Optionally, the shielding cover includes a top plate and a side plate connected to the top plate at one end and welded to the circuit board at the other end, and the glue dispensing hole is located on the top plate.

[0011] Optionally, the orthographic projection of the glue dispensing hole on the circuit board overlaps with the orthographic projection of the IC on the circuit board.

[0012] Optionally, the shape of the dispensing hole is: circular, square or diamond.

[0013] Optionally, the shielding cover also has an observation hole for observation.

[0014] Optionally, the orthographic projection of the IC on the circuit board is a rectangle, and the orthographic projections of the observation hole and the glue dispensing hole on the circuit board are located on two opposite sides or at two opposite corners of the rectangle.

[0015] Optionally, the control module further includes: a shielding film covering the opening, and the opening includes the glue dispensing hole.

[0016] Optionally, the orthographic projection of the opening on the circuit board is located within the orthographic projection of the shielding film on the circuit board.

[0017] Optionally, the shielding cover has at least one rectangular surface, and a plurality of openings located on the same rectangular surface;

[0018] There are multiple shielding films, and the multiple shielding films cover the multiple openings, and the multiple openings and the multiple shielding films correspond one to one; or, there is only one shielding film, and one shielding film covers the multiple openings.

[0019] Optionally, the shielding film is made of a flexible metal material, and a thickness of the flexible metal material is less than a thickness threshold.

[0020] Optionally, the shielding cover is made of metal material.

[0021] Optionally, the circuit board is a flexible circuit board FPC; and the IC is a touch IC.

[0022] Optionally, the glue used for the dispensing is hot melt glue.

[0023] Optionally, the glue dispensing includes: dispensing glue between the circuit board and the IC to bond the circuit board and the IC.

[0024] On the other hand, a method for manufacturing a control module is provided, for manufacturing the control module as described in the above aspect, the method comprising:

[0025] Provide circuit boards;

[0026] Arranging an integrated circuit IC on the circuit board;

[0027] Welding a shielding cover with the IC cover inside on the circuit board, wherein the shielding cover has a glue dispensing hole for dispensing glue;

[0028] Glue is dispensed between the IC and the circuit board through the glue dispensing hole.

[0029] On the other hand, an electronic device is provided, comprising: a substrate, and a control module as described in the above aspects; the control module is located on the substrate.

[0030] The beneficial effects brought by the technical solution provided by the embodiments of the present disclosure include at least:

[0031] In summary, the disclosed embodiments provide a control module and a manufacturing method thereof, and an electronic device, wherein the control module includes a circuit board, an IC, and a shielding cover. Since the shielding cover has a dispensing hole for dispensing glue, on the basis of soldering the IC to the circuit board, glue can be dispensed between the IC and the circuit board through the dispensing hole, thereby enabling the IC to be effectively fixed to the circuit board by both soldering and gluing, thereby improving the yield of the control module. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0033] Figure 1 is a structural schematic diagram of a control module provided by an embodiment of the present disclosure;

[0034] Figure 2 is a top view of a control module provided by an embodiment of the present disclosure;

[0035] Figure 3 is a top view of a shielding cover provided by an embodiment of the present disclosure;

[0036] Figure 4 is a schematic structural diagram of a shielding cover provided by an embodiment of the present disclosure;

[0037] Figure 5 is a schematic structural diagram of another shielding cover provided by an embodiment of the present disclosure;

[0038] Figure 6 is a schematic diagram of the structure of another control module provided in an embodiment of the present disclosure;

[0039] Figure 7 is a structural schematic diagram of another control module provided in an embodiment of the present disclosure;

[0040] Figure 8 is a schematic structural diagram of another shielding cover provided by an embodiment of the present disclosure;

[0041] Fig. 9 is a schematic structural diagram of another shielding cover provided by an embodiment of the present disclosure;

[0042] Fig.10 is a top view of another control module provided by an embodiment of the present disclosure;

[0043] Fig.11 is a flow chart of a method for manufacturing a control module provided by an embodiment of the present disclosure;

[0044] Fig.12 is a structural schematic diagram of an electronic device provided by an embodiment of the present disclosure;

[0045] Fig.13 It is a structural block diagram of an electronic device provided by an embodiment of the present disclosure. DETAILED DESCRIPTION

[0046] In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

[0047] At present, the ICs in the control modules are directly soldered to the circuit boards to bind to the circuit boards. This binding method can cause the ICs to separate from the circuit boards in some scenarios, which can cause the ICs to fail to work. For example, in a whole-machine drop test or a ball drop test before an electronic device leaves the factory, the solder at the welding point between the IC of the control module in the electronic device and the circuit board will fall off, and then the IC will separate from the circuit board. Among them, the whole-machine drop test refers to an experiment in which a control electronic device is dropped from a certain height, and the ball drop test refers to an experiment in which a ball is dropped from a certain height from the electronic device.

[0048] The disclosed embodiment provides a control module, in which an IC and a circuit board can be firmly bound, and the yield of the control module is good.

[0049] Figure 1 is a structural diagram of a control module provided in an embodiment of the present disclosure, Figure 2 yes Figure 1 The top view of the control module shown in FIG. Figure 1 and Figure 2 It can be seen that the control module may include:

[0050] Circuit board 10.

[0051] The IC 20 is located on the circuit board 10. Optionally, the IC 20 being located on the circuit board 10 may mean that the IC 20 is soldered to the circuit board 10 through a soldering process.

[0052] And, a shielding cover 30 is soldered on the circuit board 10 and covers the IC 20. Here, covering can be understood as the shielding cover 30 wrapping the IC 20, so that other external electrical signals can effectively shield the IC 20 from interference, that is, ensure the working reliability of the IC 20.

[0053] Optional, Figure 3 FIG. 1 is a top view of a shielding cover provided by an embodiment of the present disclosure. Figures 1 to 3It can be seen that the shielding cover 30 recorded in the embodiment of the present disclosure may have a glue dispensing hole K1 for dispensing glue. Glue dispensing refers to putting glue dots (or, it can also be called dripping) between the circuit board 10 and the IC 20. That is, in the embodiment of the present disclosure, glue can be dispensed between the circuit board 10 and the IC 20 through the glue dispensing hole K1 on the shielding cover 30 to reliably bond the circuit board 10 and the IC 20. In this way, even if the solder at the welding point between the IC 20 and the circuit board 10 falls off, the IC 20 can still be effectively fixed on the circuit board 10, that is, the reliable binding of the IC 20 and the circuit board 10 is ensured.

[0054] Optionally, the dispensing hole K1 can be used for glue to pass through, that is, glue can be directly dripped from the outside of the shielding cover 30 into the shielding cover 30 through the dispensing hole K1, and dripped between the circuit board 10 and the IC 20. Accordingly, the size of the dispensing hole K1 should be at least larger than the size of each drop of glue.

[0055] Alternatively, the dispensing hole K1 can be used for the dispensing end of the dispensing device to pass through, that is, the dispensing end of the dispensing device can extend into the shielding cover 30 through the dispensing hole K1 and drip glue between the circuit board 10 and the IC 20. Accordingly, the size of the dispensing hole K1 needs to be larger than the size of the dispensing end. For example, assuming that the dispensing hole K1 is circular and the dispensing end is cylindrical or conical, the diameter of the circular dispensing hole K1 should be larger than the diameter of the dispensing end.

[0056] Compared with directly dripping glue through the glue dispensing hole K1 into the space between the circuit board 10 and the IC 20, the glue dispensing end of the glue dispensing device is used to dispense glue between the circuit board 10 and the IC 20 through the glue dispensing hole K1, which can prevent glue splashing, ensure the accuracy of the glue dispensing position, and improve the glue dispensing accuracy. Therefore, in order to ensure the glue dispensing accuracy, the following embodiments of the present disclosure all take the glue dispensing hole K1 for the glue dispensing end of the glue dispensing device to pass through as an example to schematically illustrate the control module.

[0057] In summary, the disclosed embodiment provides a control module, which includes a circuit board, an IC, and a shielding cover. Since the shielding cover has a dispensing hole for dispensing glue, on the basis of soldering the IC to the circuit board, glue can be dispensed between the IC and the circuit board through the dispensing hole, so that the IC can be effectively fixed to the circuit board by both soldering and gluing, thereby improving the yield rate of the control module.

[0058] In addition, since the shielding cover included in the control module in the related art does not have a dispensing hole or any other opening, if dispensing is required, it can only be performed before welding the shielding cover. This operation sequence will cause the glue that has been dispensed between the IC and the circuit board to be melted due to the influence of the welding temperature (generally 220 degrees) when welding the shielding cover, which will cause the IC to still be separated from the circuit board due to the fall of solder in a certain scenario. Therefore, the related art can only either set up a shielding cover or dispense glue. However, since the shielding cover 30 provided in the embodiment of the present disclosure has a dispensing hole for dispensing glue, that is, the embodiment of the present disclosure dispenses glue between the circuit board 10 and the IC 20 through the dispensing hole K1 on the shielding cover 30, so after the shielding cover 30 is welded, it can be further dispensed between the circuit board 10 and the IC 20 through the dispensing hole K1. In this way, it is effectively avoided that the glue is first dispensed and then welded on the shielding cover 30, which causes the glue to be melted due to the influence of the welding temperature. That is, the influence of the welding of the shielding cover on the glue dispensing is effectively avoided, so that the IC can be effectively fixed on the circuit board, thereby improving the yield rate of the control module.

[0059] Optionally, the shielding cover 30 described in the embodiment of the present disclosure may be a hemispherical structure having a cavity and an opening on one side, or may be a prism having a cavity and an opening on one side. Figures 1 to 3 ,as well as Figure 4 As can be seen from the schematic diagram of the structure of a shielding cover shown, the shielding cover 30 may include a top plate 301 and a side plate 302, wherein one end of the side plate 302 may be connected to the top plate 301, and the other end of the side plate 302 may be welded to the circuit board 10. Optionally, the top plate 301 and the circuit board 10 may be arranged in parallel.

[0060] For example, the shielding cover 30 may include a top plate 301 and a plurality of side plates 302. For example, the shielding cover 30 may be a quadrangular prism having a cavity and an opening on one side. Figures 1 to 4 The shielding cover 30 shown here includes a top plate 301 and four side plates 302, that is, the shielding cover 30 shown here is a rectangular parallelepiped. The following embodiments of the present disclosure all take the shielding cover 30 as a rectangular parallelepiped as an example to illustrate the control module.

[0061] Optionally, in order to facilitate the miniaturization design of the electronic device and ensure that the shielding cover 30 can completely cover the IC 20 and avoid the shielding cover 30 contacting the IC 20 and affecting the operation of the IC 20, when the shielding cover 30 is a rectangular structure and the IC 20 is also a rectangular structure, the length of the shielding cover 30 can be greater than the length of the IC 20 and less than the length threshold, the width can be greater than the width of the IC 20 and less than the width threshold, and the height can be greater than the height of the IC 20 and less than the height threshold.

[0062] Optional, such as Figure 1and Figure 4 As shown, the dispensing hole K1 recorded in the embodiment of the present disclosure can be located on the top plate 301. Alternatively, as Figure 5 Another schematic diagram of the structure of the shielding cover is shown, and the glue hole K1 can also be located on any side plate 302. For example, Figure 5 The glue dispensing hole K1 shown is located on the right side plate 302 of the shielding cover.

[0063] By arranging the dispensing hole K1 on the top plate 301, under the action of gravity, when the dispensing hole K1 is used for dispensing glue, it is ensured that the glue can be reliably and smoothly dispensed between the IC 20 and the circuit board 10 without adjusting the placement position of the control module. That is, the dispensing accuracy can be ensured.

[0064] Optionally, in the embodiment of the present disclosure, the orthographic projection of the dispensing hole K1 on the circuit board 10 and the orthographic projection of the IC 20 on the circuit board 10 may overlap.

[0065] For example, combining the above Figure 1 , the orthographic projection of the glue hole K1 on the circuit board 10 can completely overlap with the orthographic projection of the IC 20 on the circuit board 10, that is, the size of the glue hole K1 can be the same as the size of the IC 20. In this way, the glue can be reliably applied between the IC 20 and the circuit board 10 at one time. Of course, refer to Figure 6 In the structural schematic diagram of another control module shown, the orthographic projection of the dispensing hole K1 on the circuit board 10 and the orthographic projection of the IC 20 on the circuit board 10 may also only partially overlap.

[0066] Optionally, in the embodiment of the present disclosure, the shape of the dispensing hole K1 can be: circular, square or diamond. Figures 1 to 5 The dispensing hole K1 is shown as a square in shape. Figure 6 A dispensing hole K1 is shown as a circular dispensing hole K1, wherein the circular dispensing hole is more convenient for the glue to pass through and avoids the glue from adhering to the edge of the dispensing hole.

[0067] Refer to Figure 6 The shielding cover 30 described in the embodiment of the present disclosure may also have an observation hole K2 for observation. That is, when dispensing glue through the dispensing hole K1, the dispensing process can be observed through the observation hole K2, and the dispensing related parameters can be adjusted in real time during the observation, such as adjusting the dispensing position or the dispensing amount. In this way, the dispensing accuracy can be further improved, that is, the yield of the control module can be further ensured.

[0068] Optional, reference Figures 1 to 6 , the orthographic projection of IC 20 on circuit board 10 may be rectangular. Figure 6As shown, the orthographic projections of the observation hole K2 and the dispensing hole K1 on the circuit board 10 can be located on two opposite sides or two opposite corners of the rectangle. And the distance between the observation hole K2 and the dispensing hole K1 can be set to be greater than a specified distance threshold, so that the dispensing process can be effectively viewed through the observation hole K2.

[0069] For example, assuming that the boundary of the orthographic projection of IC 20 on circuit board 10 is an axisymmetric figure, the orthographic projection of dispensing hole K1 on circuit board 10 and the orthographic projection of observation hole K2 on circuit board 10 can be located on both sides of the symmetry axis of the axisymmetric figure. In this way, when dispensing through dispensing hole K1 in one orientation, observation can be made through observation hole K2 in another orientation, which is convenient for observation.

[0070] Taking the axisymmetric figure as a rectangle as an example, in an optional example, combined with Figure 6 , the orthographic projection of the dispensing hole K1 on the circuit board 10 and the orthographic projection of the observation hole K2 on the circuit board 10 can be located on two opposite sides of the rectangle, so as to be symmetrical with respect to a symmetry axis of the rectangle. For example, the center of the orthographic projection of the dispensing hole K1 on the circuit board 10 and the center of the orthographic projection of the observation hole K2 on the circuit board 10 coincide with the midpoints of the two opposite sides of the rectangle, respectively. In this way, when dispensing through the dispensing hole K1 in one orientation, it can be observed through the observation hole K2 in another orientation symmetrical to the orientation, which is convenient for observation.

[0071] In another optional example, the orthographic projection of the dispensing hole K1 on the circuit board 10 and the orthographic projection of the observation hole K2 on the circuit board 10 are respectively located at two opposite corners of the rectangle, and thus are located on both sides of a symmetry axis of the rectangle. For example, the center of the orthographic projection of the dispensing hole K1 on the circuit board 10 and the center of the orthographic projection of the observation hole K2 on the circuit board 10 coincide with the vertices of the two opposite corners of the rectangle. When dispensing through the dispensing hole K1 in one orientation, it is possible to observe through the observation hole K2 in another orientation that is diagonally opposite to the orientation, which is convenient for observation.

[0072] Optionally, in order to improve the efficiency of glue dispensing, the shielding cover 30 recorded in the embodiment of the present disclosure may include a plurality of glue dispensing holes K1. Correspondingly, in order to achieve reliable observation of glue dispensing through each glue dispensing hole K1, the shielding cover 30 may also include a plurality of observation holes K2. Moreover, the plurality of glue dispensing holes K1 and the plurality of observation holes K2 may be arranged in a one-to-one correspondence, for example, the orthographic projection of each group of corresponding glue dispensing holes and observation holes on the circuit board is symmetrical with respect to the symmetry axis of the axially symmetrical figure M. The embodiment of the present disclosure does not limit the number of glue dispensing holes K1 and observation holes K2.

[0073] Figure 7 FIG. 1 is a schematic diagram of the structure of another control module provided in an embodiment of the present disclosure. Figure 7As shown, the control module may further include: a shielding film P1 covering the opening. Optionally, the opening may include Figure 7 The dispensing hole K1 is shown.

[0074] Of course, if the shielding cover 30 further includes an observation hole K2, the opening may also include the observation hole K2. Figure 6 , such as 8 and Fig. 9 The shielding cover 30 may have a plurality of openings (e.g., a dispensing hole K1 and an observation hole K2) located on the same rectangular surface. The rectangular surface may be: the surface of the top plate 301 of the shielding cover 30, or the surface of any side plate 302 of the shielding cover 30. Figure 8 There can be multiple shielding films P1, and the multiple shielding films P1 can cover multiple openings and correspond to the multiple openings one by one, that is, one shielding film P1 covers one opening. Or, refer to Fig. 9 There can be one shielding film P1, and the shielding film P1 can cover multiple openings. For example, Figure 8 and Fig. 9 Both show two openings on the surface of the top plate 301, and accordingly, Figure 8 Two shielding films P1 are shown. Optionally, the shielding films P1 can be covered on the opening by gluing or embossing.

[0075] By providing the shielding film P1 to cover the opening, it is possible to further effectively prevent other external electrical signals from entering the shielding cover 30 through the opening to interfere with the operation of the IC 20. It can also play a certain dustproof role.

[0076] Optionally, the orthographic projection of the opening on the circuit board 10 may be located within the orthographic projection of the shielding film on the circuit board 10. Figures 7 to 9 The size of the opening can be larger than the size of the shielding film P1, and the opening can be completely covered by the shielding film P1. In this way, reliable shielding of other external electrical signals can be further ensured.

[0077] Optionally, the shape of the observation hole K2 can be Figure 8 The square shown, or, alternatively, can be Fig. 9 Of course, the viewing hole K2 can also be in other shapes, such as a rhombus.

[0078] Optionally, the material of the shielding film P1 can be a flexible metal material, and the thickness of the flexible metal material can be less than the thickness threshold. That is, the shielding film P1 can be made of a thinner and softer material, so that the control module can be prevented from occupying a larger volume of the electronic device. That is, it is conducive to the miniaturization design of the electronic device.

[0079] Optionally, the shielding cover 30 may be made of metal material, that is, the shielding cover 30 may be a metal grounding shielding cover.

[0080] Optionally, the circuit board 10 may be a flexible printed circuit (FPC), and the shape of the circuit board 10 may be a rectangle as shown in the figure, or other shapes, such as a circle. The IC 20 may be a touch IC, and accordingly, the control module may be a touch module, which may be used to drive the electronic device to realize the touch function. Alternatively, the IC 20 may be a display control IC, and accordingly, the control module may be a timing controller or a source driver chip, which may be used to drive the display screen of the electronic device to realize the display function.

[0081] Optionally, the glue used in the dispensing of the embodiment of the present disclosure may be hot melt glue, and because the glue is dispensed between the IC 20 and the circuit board 10 , the glue may also be referred to as under fill glue.

[0082] Optional, Fig.10 FIG. 2 is a top view of another control module provided by an embodiment of the present disclosure. Fig.10 The top plate of the shielding case is removed. Fig.10 As shown, in addition to the IC 20, the control module generally includes other electronic components (such as resistors, capacitors and / or inductors) 40 for providing electrical signals to the IC 20. The shielding cover 30 not only covers the IC 20, but also covers the other electronic components 40. Moreover, the size of the circuit board 10 shown in the drawings is only a schematic illustration, and does not mean that the size of the circuit board 10 must be larger than the size of the shielding cover 30.

[0083] In summary, the disclosed embodiment provides a control module, which includes a circuit board, an IC, and a shielding cover. Since the shielding cover has a dispensing hole for dispensing glue, on the basis of soldering the IC to the circuit board, glue can be dispensed between the IC and the circuit board through the dispensing hole, so that the IC can be effectively fixed to the circuit board by both soldering and gluing, thereby improving the yield rate of the control module.

[0084] Fig.11 FIG. 1 is a flow chart of a method for manufacturing a control module provided by an embodiment of the present disclosure. The method can be used to manufacture the control module shown in the above-mentioned figure. Fig.11 As shown, the method may include:

[0085] Step 1101: Provide a circuit board.

[0086] Optionally, the circuit board may be an FPC circuit board.

[0087] Step 1102: Arrange an integrated circuit IC on a circuit board.

[0088] Optionally, the IC may be soldered to the circuit board by a soldering process. The process involved in step 1102 may be referred to as a surface mounted technology (SMT).

[0089] Step 1103: solder a shielding cover with the IC cover inside on the circuit board.

[0090] The shielding cover may have a dispensing hole for dispensing glue. Optionally, the dispensing hole may be opened on the shielding cover by laser cutting before welding the shielding cover to the circuit board. In this way, the problem of opening the hole after welding the shielding cover and failing to ensure the opening accuracy can be avoided.

[0091] Step 1104 , glue is dispensed between the IC and the circuit board through the glue dispensing hole.

[0092] After the shielding cover is welded, glue can be dispensed between the IC and the circuit board through the glue dispensing holes.

[0093] Optionally, glue can be directly dripped into the shielding case through the glue dispensing hole and dripped between the IC and the circuit board. Alternatively, the glue dispensing end of the glue dispensing device can be extended into the shielding case through the glue dispensing hole, and glue can be dispensed between the IC and the circuit board through the glue dispensing end.

[0094] After the glue is dispensed, the dispensed glue may be cured by a curing process (eg, ultraviolet light irradiation) to ensure that the IC and the circuit board are reliably bonded by the glue.

[0095] In summary, the disclosed embodiment provides a method for manufacturing a control module. Due to this method, after welding a shielding cover with an IC cover inside on a circuit board, glue can be dripped between the IC and the circuit board through the glue dispensing holes on the shielding cover. Therefore, the IC can be effectively fixed on the circuit board by welding and gluing, thereby improving the yield rate of the control module.

[0096] Optionally, since the shielding case may include a top plate and a side plate with one end connected to the top plate and the other end welded to the circuit board, a dispensing hole may be provided on the top plate or the side plate of the shielding case.

[0097] Optionally, in order to ensure the dispensing accuracy and efficiency, when opening the dispensing holes, the orthographic projection of the IC on the circuit can be referred to, and the dispensing holes can be opened at the position where the top plate of the shielding cover overlaps with the orthographic projection.

[0098] Optionally, the shape of the dispensing holes can be circular, square or diamond-shaped.

[0099] Optionally, in order to facilitate observation of the dispensing process and further improve the dispensing accuracy, an observation hole for observation can be opened on the shielding cover before welding the shielding cover on the circuit board. Furthermore, if the orthographic projection of the IC on the circuit board is a rectangle, the observation hole and the dispensing hole can be opened so that the orthographic projection of the circuit board is located on the opposite sides or opposite corners of the rectangle.

[0100] Optionally, in order to prevent other external electrical signals from entering the shielding cover through the openings (including the glue dispensing holes and the observation holes) and affecting the operation of the IC, a shielding film may be covered on the openings of the shielding cover after step 1104. For example, the shielding film may be covered on the openings by gluing, that is, the shielding film may be adhered to the openings by using a sticky glue. Alternatively, the shielding film may be pressed on the openings by embossing.

[0101] Optionally, in order to further ensure shielding reliability, a shielding film having a size larger than the size of the opening may be used to completely cover the opening, that is, the orthographic projection of the opening on the circuit board is within the orthographic projection of the shielding film on the circuit board.

[0102] Optionally, when there are multiple openings on the same rectangular surface of the shielding cover, each opening may be covered with a shielding film, or only one shielding film may be covered on the multiple openings, that is, a shielding film of a larger size is used to cover the multiple openings.

[0103] In summary, the disclosed embodiment provides a method for manufacturing a control module. Due to this method, after welding a shielding cover with an IC cover inside on a circuit board, glue can be dripped between the IC and the circuit board through the glue dispensing holes on the shielding cover. Therefore, the IC can be effectively fixed on the circuit board by welding and gluing, thereby improving the yield rate of the control module.

[0104] Optional, Fig.12 Schematic diagram of the structure of an electronic device provided by an embodiment of the present disclosure. Fig.12 As shown, the electronic device may include: a substrate 000, and Figure 1 , Figure 2 , Figure 6 , Figure 7 and Fig.10 Any of the control modules 100 shown. Fig.12 As shown, the control module 100 may be located on a substrate 000 .

[0105] Optionally, the electronic device may be: a display device, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, or any other product or component with a display function.

[0106] Fig.13The electronic device 1300 is a block diagram of an exemplary embodiment of the present invention. The electronic device 1300 may also be called a user device, a portable terminal, a laptop terminal, a desktop terminal, etc. Generally, the electronic device 1300 includes a processor 1301 and a memory 1302.

[0107] The processor 1301 may include one or more processing cores, such as a 4-core processor, an 8-core processor, etc. The processor 1301 may be implemented in at least one hardware form of digital signal processing (DSP), field-programmable gate array (FPGA), and programmable logic array (PLA). The processor 1301 may also include a main processor and a coprocessor. The main processor is a processor for processing data in the awake state, also known as a central processing unit (CPU); the coprocessor is a low-power processor for processing data in the standby state. In some embodiments, the processor 1301 may be integrated with a graphics processing unit (GPU), and the GPU is responsible for rendering and drawing the content to be displayed on the display screen. In some embodiments, the processor 1301 may also include an artificial intelligence (AI) processor, which is used to process computing operations related to machine learning.

[0108] The memory 1302 may include one or more computer-readable storage media, which may be non-transitory. The memory 1302 may also include high-speed random access memory and non-volatile memory, such as one or more disk storage devices and flash memory storage devices.

[0109] In some embodiments, the electronic device 1300 may further optionally include: a peripheral device interface 1303 and at least one peripheral device. The processor 1301, the memory 1302 and the peripheral device interface 1303 may be connected via a bus or a signal line. Each peripheral device may be connected to the peripheral device interface 1303 via a bus, a signal line or a circuit board. Specifically, the peripheral device includes: at least one of a radio frequency circuit 1304, a touch display screen 1305, a camera 1306, an audio circuit 1307, a positioning component 1308 and a power supply 1309.

[0110] The peripheral device interface 1303 may be used to connect at least one peripheral device related to input / output (I / O) to the processor 1301 and the memory 1302. In some embodiments, the processor 1301, the memory 1302, and the peripheral device interface 1303 are integrated on the same chip or circuit board; in some other embodiments, any one or two of the processor 1301, the memory 1302, and the peripheral device interface 1303 may be implemented on a separate chip or circuit board, which is not limited in this embodiment.

[0111] The radio frequency circuit 1304 is used to receive and transmit radio frequency (RF) signals, also known as electromagnetic signals. The radio frequency circuit 1304 communicates with the communication network and other communication devices through electromagnetic signals. The radio frequency circuit 1304 converts the electrical signal into an electromagnetic signal for transmission, or converts the received electromagnetic signal into an electrical signal. Optionally, the radio frequency circuit 1304 includes: an antenna system, an RF transceiver, one or more amplifiers, a tuner, an oscillator, a digital signal processor, a codec chipset, a user identity module card, and the like. The radio frequency circuit 1304 can communicate with other terminals through at least one wireless communication protocol. The wireless communication protocol includes, but is not limited to: a metropolitan area network, various generations of mobile communication networks (2G, 3G, 4G and 5G), a wireless local area network and / or a wireless fidelity (WiFi) network. In some embodiments, the radio frequency circuit 1304 may also include circuits related to near field communication (NFC), which is not limited in the present disclosure.

[0112] The display screen 1305 is used to display a user interface (UI). The UI may include graphics, text, icons, videos, and any combination thereof. When the display screen 1305 is a touch display screen, the display screen 1305 also has the ability to collect touch signals on the surface or above the surface of the display screen 1305. The touch signal can be input to the processor 1301 as a control signal for processing. At this time, the display screen 1305 can also be used to provide virtual buttons and / or virtual keyboards, also known as soft buttons and / or soft keyboards. In some embodiments, the display screen 1305 can be one, and the front panel of the electronic device 1300 is set; in other embodiments, the display screen 1305 can be at least two, which are respectively set on different surfaces of the electronic device 1300 or are folded; in some other embodiments, the display screen 1305 can be a flexible display screen, which is set on the curved surface or folded surface of the electronic device 1300. The display screen 1305 can also be set as a non-rectangular irregular shape, that is, a special-shaped screen. The display screen 1305 can be made of materials such as liquid crystal display (LCD) and organic light-emitting diode (OLED).

[0113] The camera assembly 1306 is used to capture images or videos. Optionally, the camera assembly 1306 includes a front camera and a rear camera. Typically, the front camera is arranged on the front panel of the terminal, and the rear camera is arranged on the back of the terminal. In some embodiments, there are at least two rear cameras, which are any one of a main camera, a depth of field camera, a wide-angle camera, and a telephoto camera, so as to realize the fusion of the main camera and the depth of field camera to realize the background blur function, the fusion of the main camera and the wide-angle camera to realize panoramic shooting and virtual reality (VR) shooting function or other fusion shooting functions. In some embodiments, the camera assembly 1306 may also include a flash. The flash can be a monochrome temperature flash or a dual-color temperature flash. A dual-color temperature flash refers to a combination of a warm light flash and a cold light flash, which can be used for light compensation at different color temperatures.

[0114] The audio circuit 1307 may include a microphone and a speaker. The microphone is used to collect sound waves from the user and the environment, and convert the sound waves into electrical signals and input them into the processor 1301 for processing, or input them into the radio frequency circuit 1304 to achieve voice communication. For the purpose of stereo acquisition or noise reduction, there may be multiple microphones, which are respectively arranged at different parts of the electronic device 1300. The microphone may also be an array microphone or an omnidirectional acquisition microphone. The speaker is used to convert the electrical signal from the processor 1301 or the radio frequency circuit 1304 into sound waves. The speaker may be a traditional film speaker or a piezoelectric ceramic speaker. When the speaker is a piezoelectric ceramic speaker, it can not only convert the electrical signal into sound waves audible to humans, but also convert the electrical signal into sound waves inaudible to humans for purposes such as ranging. In some embodiments, the audio circuit 1307 may also include a headphone jack.

[0115] The positioning component 1308 is used to locate the current geographic location of the electronic device 1300 to implement navigation or location based services (LBS). The positioning component 1308 can be a positioning component based on the global positioning system (GPS) of the United States, the Beidou system of China, the Grenades system of Russia, or the Galileo system of the European Union.

[0116] The power supply 1309 is used to power various components in the electronic device 1300. The power supply 1309 can be an alternating current, a direct current, a disposable battery, or a rechargeable battery. When the power supply 1309 includes a rechargeable battery, the rechargeable battery can support wired charging or wireless charging. The rechargeable battery can also be used to support fast charging technology.

[0117] In some embodiments, the electronic device 1300 further includes one or more sensors 1310 , including but not limited to: an acceleration sensor 1311 , a gyroscope sensor 1312 , a pressure sensor 1313 , a fingerprint sensor 1314 , an optical sensor 1315 , and a proximity sensor 1316 .

[0118] The acceleration sensor 1311 can detect the magnitude of acceleration on the three coordinate axes of the coordinate system established by the electronic device 1300. For example, the acceleration sensor 1311 can be used to detect the components of gravity acceleration on the three coordinate axes. The processor 1301 can control the touch display screen 1305 to display the user interface in a horizontal view or a vertical view according to the gravity acceleration signal collected by the acceleration sensor 1311. The acceleration sensor 1311 can also be used for collecting game or user motion data.

[0119] The gyro sensor 1312 can detect the body direction and rotation angle of the electronic device 1300, and the gyro sensor 1312 can cooperate with the acceleration sensor 1311 to collect the user's 3D actions on the electronic device 1300. The processor 1301 can implement the following functions based on the data collected by the gyro sensor 1312: motion sensing (such as changing the UI according to the user's tilt operation), image stabilization during shooting, game control, and inertial navigation.

[0120] The pressure sensor 1313 can be set on the side frame of the electronic device 1300 and / or the lower layer of the touch display screen 1305. When the pressure sensor 1313 is set on the side frame of the electronic device 1300, it can detect the user's holding signal of the electronic device 1300, and the processor 1301 performs left and right hand recognition or shortcut operations according to the holding signal collected by the pressure sensor 1313. When the pressure sensor 1313 is set on the lower layer of the touch display screen 1305, the processor 1301 controls the operability controls on the UI interface according to the user's pressure operation on the touch display screen 1305. The operability controls include at least one of a button control, a scroll bar control, an icon control, and a menu control.

[0121] The fingerprint sensor 1314 is used to collect the user's fingerprint, and the processor 1301 identifies the user's identity based on the fingerprint collected by the fingerprint sensor 1314, or the fingerprint sensor 1314 identifies the user's identity based on the collected fingerprint. When the user's identity is identified as a trusted identity, the processor 1301 authorizes the user to perform relevant sensitive operations, which include unlocking the screen, viewing encrypted information, downloading software, paying, and changing settings. The fingerprint sensor 1314 can be set on the front, back, or side of the electronic device 1300. When a physical button or a manufacturer logo is set on the electronic device 1300, the fingerprint sensor 1314 can be integrated with the physical button or the manufacturer logo.

[0122] The optical sensor 1315 is used to collect the ambient light intensity. In one embodiment, the processor 1301 can control the display brightness of the touch display screen 1305 according to the ambient light intensity collected by the optical sensor 1315. Specifically, when the ambient light intensity is high, the display brightness of the touch display screen 1305 is increased; when the ambient light intensity is low, the display brightness of the touch display screen 1305 is reduced. In another embodiment, the processor 1301 can also dynamically adjust the shooting parameters of the camera assembly 1306 according to the ambient light intensity collected by the optical sensor 1315.

[0123] The proximity sensor 1316, also called a distance sensor, is usually arranged on the front panel of the electronic device 1300. The proximity sensor 1316 is used to collect the distance between the user and the front of the electronic device 1300. In one embodiment, when the proximity sensor 1316 detects that the distance between the user and the front of the electronic device 1300 is gradually decreasing, the processor 1301 controls the touch display screen 1305 to switch from the screen-on state to the screen-off state; when the proximity sensor 1316 detects that the distance between the user and the front of the electronic device 1300 is gradually increasing, the processor 1301 controls the touch display screen 1305 to switch from the screen-off state to the screen-on state.

[0124] Those skilled in the art will understand that Fig.13 The structure shown in the figure does not constitute a limitation on the electronic device 1300, and may include more or less components than those shown in the figure, or combine certain components, or adopt a different component arrangement.

[0125] It should be understood that the "and / or" mentioned in this article indicates that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the objects before and after are in an "or" relationship.

[0126] The above description is only an optional embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A control module, characterized in that: The control module comprises: Circuit boards; An integrated circuit IC located on the circuit board; A shielding cover which is welded on the circuit board and has the IC cover disposed therein; Wherein, the shielding cover has a glue dispensing hole for dispensing glue, and the glue dispensing includes: dispensing glue between the circuit board and the IC through the glue dispensing hole to bond the circuit board and the IC.

2. The control module according to claim 1, characterized in that: The shielding cover comprises a top plate and a side plate with one end connected to the top plate and the other end welded to the circuit board, and the glue dispensing hole is located on the top plate.

3. The control module according to claim 2, characterized in that: The orthographic projection of the dispensing hole on the circuit board overlaps with the orthographic projection of the IC on the circuit board.

4. The control module according to any one of claims 1 to 3, characterized in that: The shape of the dispensing hole is: round, square or diamond.

5. The control module according to any one of claims 1 to 3, characterized in that: The shielding cover also has an observation hole for observation.

6. The control module according to claim 5, characterized in that: The orthographic projection of the IC on the circuit board is a rectangle, and the orthographic projections of the observation hole and the glue dispensing hole on the circuit board are located on two opposite sides or at two opposite corners of the rectangle.

7. The control module according to any one of claims 1 to 3, characterized in that: The control module further includes: a shielding film covering the opening, and the opening includes the glue dispensing hole.

8. The control module according to claim 7, characterized in that: The orthographic projection of the opening on the circuit board is located within the orthographic projection of the shielding film on the circuit board.

9. The control module according to claim 7, characterized in that: The shielding cover has at least one rectangular surface and a plurality of openings located on the same rectangular surface; There are multiple shielding films, and the multiple shielding films cover the multiple openings, and the multiple openings and the multiple shielding films correspond one to one; or, there is only one shielding film, and one shielding film covers the multiple openings.

10. The control module according to claim 7, characterized in that: The shielding film is made of a flexible metal material, and a thickness of the flexible metal material is less than a thickness threshold.

11. The control module according to any one of claims 1 to 3, characterized in that: The shielding cover is made of metal material.

12. The control module according to any one of claims 1 to 3, characterized in that: The circuit board is a flexible circuit board FPC; the IC is a touch IC.

13. The control module according to any one of claims 1 to 3, characterized in that: The glue used in the glue dispensing is hot melt glue.

14. The control module according to claim 9, characterized in that: The shielding cover also has an observation hole for observation; the orthographic projection of the IC on the circuit board is rectangular, and the orthographic projections of the observation hole and the dispensing hole on the circuit board are located on two opposite sides or at two opposite corners of the rectangle; The shape of the dispensing hole is: circular, square or diamond; the orthographic projection of the opening on the circuit board is located within the orthographic projection of the shielding film on the circuit board; The material of the shielding film is a flexible metal material, and the thickness of the flexible metal material is less than a thickness threshold; the material of the shielding cover is a metal material; The circuit board is a flexible circuit board FPC; The IC is a touch IC; The glue used in the glue dispensing is hot melt glue; the glue dispensing includes: dispensing glue between the circuit board and the IC to bond the circuit board and the IC.

15. A method for manufacturing a control module, characterized in that: For manufacturing a control module according to any one of claims 1 to 14, the method comprises: Provide circuit boards; Arranging an integrated circuit IC on the circuit board; Welding a shielding cover with the IC cover inside on the circuit board, wherein the shielding cover has a glue dispensing hole for dispensing glue; Glue is dispensed between the IC and the circuit board through the glue dispensing hole.

16. An electronic device, characterized in that: The electronic device comprises: a substrate, and a control module as claimed in any one of claims 1 to 14; the control module is located on the substrate.

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