Wireless network card heat sink

Abstract

The present invention provides a wireless network card heat sink. The wireless network card heat sink is suitable for being configured on a wireless network card and fixed to a circuit board, and includes a heat sink, a fixing portion, and a locking member. The heat sink has a lower surface, and the wireless network card is suitable for being located between the lower surface of the heat sink and the circuit board. The fixing portion is arranged beside the heat sink, the thickness of the fixing portion is greater than the thickness of the heat sink, the fixing portion extends along a normal direction of the heat sink, and protrudes from the lower surface of the heat sink, and the fixing portion is suitable for pressing the circuit board. The locking member is detachably arranged in the fixing portion, and is suitable for being fixed to the circuit board.

Description

Technical Field

[0001] The invention relates to a radiator, in particular to a wireless network card radiator. Background Art

[0002] With the advancement of technology, high-power chips generate a lot of heat when they are in operation. Generally speaking, heat sinks are installed on such heat-generating components to dissipate heat. Some heat sinks are fixed to the circuit board by screws. However, if the screws are tightened too much, the heat sink will be squeezed and the heat sink will bend, which will affect the life of the heat sink. The bent heat sink is also difficult to thermally couple well with the heat-generating component, which will affect the heat dissipation effect. Summary of the invention

[0003] The object of the present invention is to provide a wireless network card heat sink, which can provide a good heat dissipation effect.

[0004] A wireless network card heat sink of the present invention is suitable for being configured on a wireless network card and fixed to a circuit board, and comprises a heat sink, a fixing portion and a locking member. The heat sink has a lower surface, and the wireless network card is suitable for being located between the lower surface of the heat sink and the circuit board. The fixing portion is arranged beside the heat sink, the thickness of the fixing portion is greater than the thickness of the heat sink, the fixing portion extends along a normal direction of the heat sink, and protrudes from the lower surface of the heat sink, and the fixing portion is suitable for pressing against the circuit board. The locking member is detachably arranged in the fixing portion, and is suitable for being fixed to the circuit board.

[0005] In one embodiment of the present invention, the fixing portion includes a hole having an internal thread, and the locking element is screwed to the internal thread of the fixing portion.

[0006] In an embodiment of the present invention, the hole of the fixing portion has a first portion and a second portion, the inner diameter of the first portion is larger than the inner diameter of the second portion, and the internal thread is located in the second portion.

[0007] In one embodiment of the present invention, the heat dissipation plate and the fixing portion are integrally formed.

[0008] In one embodiment of the present invention, the locking element includes a nut, a neck connected to the nut, and a threaded portion connected to the neck, and the outer diameter of the neck is smaller than the outer diameter of the threaded portion.

[0009] In one embodiment of the present invention, the wireless network card heat sink further comprises two limiting portions extending from opposite sides of the heat dissipation plate along a normal direction and protruding from a lower surface of the heat dissipation plate.

[0010] In an embodiment of the present invention, the wireless network card heat sink further includes a heat dissipation pad disposed on the lower surface of the heat dissipation plate, and the two limiting portions are located on both sides of the heat dissipation pad.

[0011] In an embodiment of the present invention, projections of the two limiting portions on the plane where the lower surface of the heat sink plate is located are located outside the projection of the heat sink pad on the plane where the lower surface of the heat sink plate is located.

[0012] In one embodiment of the present invention, the heat dissipation plate and the two limiting portions are integrally formed.

[0013] In an embodiment of the present invention, the length of the heat dissipation plate is between 10 mm and 30 mm, and the width of the heat dissipation plate is between 10 mm and 30 mm.

[0014] Based on the above, the fixing part of the wireless network card heat sink of the present invention is arranged beside the heat sink, the thickness of the fixing part is greater than the thickness of the heat sink, and the fixing part extends along the normal direction of the heat sink, and protrudes from the lower surface of the heat sink. Such a design enables the fixing part to press against the circuit board below. In this way, when the locking member is passed through the fixing part and fixed to the circuit board, the distance between the fixing part and the circuit board can be fixed due to the fixing part pressing against the circuit board, and it can be avoided that when the locking member locks the circuit board too tightly, the locking member squeezes the fixing part and causes the fixing part to move downward relative to the heat sink toward the circuit board, causing the heat sink to bend and deform at the part close to the fixing part, thereby causing the heat sink and the wireless network card to have poor thermal coupling. In other words, the fixing part of the wireless network card heat sink of the present invention protrudes from the lower surface of the heat sink, and the design of pressing against the circuit board can ensure that the heat sink will not be affected by the locking of the fixing member and cause the board to bend, and can provide a sufficient service life and good heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram showing that a wireless network card heat sink is configured on a wireless network card and fixed to a circuit board according to an embodiment of the present invention.

[0016] Figure 2 yes Figure 1 Schematic diagram of moving the wireless network card heat sink upward.

[0017] Figure 3 It is along Figure 1 Schematic diagram of the cross-section of the AA line segment.

[0018] Figure 4 yes Figure 1 An exploded diagram of the wireless network card heat sink.

[0019] Figure 5 yes Figure 1 A schematic diagram showing another perspective of a wireless network card heat sink configured on a wireless network card.

[0020] The reference numerals are as follows:

[0021] D1: Normal direction

[0022] D2: Direction

[0023] H: Height

[0024] I1, I2: inner diameter

[0025] L: Length

[0026] O1, O2, O3: outer diameter

[0027] T1, T2, T3, T4: thickness

[0028] W: Width

[0029] 10: Wireless network card

[0030] 12: Chip

[0031] 20: Circuit Board

[0032] 22: Fixed seat

[0033] 24: Connector

[0034] 100: Wireless network card radiator

[0035] 110: Heat sink

[0036] 112: Lower surface

[0037] 114: Upper surface

[0038] 116: Fins

[0039] 120:Fixed part

[0040] 122: Holes

[0041] 123: Part 1

[0042] 124: Part 2

[0043] 125: Internal thread

[0044] 130: Locking firmware

[0045] 132: Nut

[0046] 134: Neck

[0047] 136:Screw joint

[0048] 140: Limiting part

[0049] 150: Cooling pad DETAILED DESCRIPTION

[0050] Figure 1It is a schematic diagram showing that a wireless network card heat sink is configured on a wireless network card and fixed to a circuit board according to an embodiment of the present invention. Figure 2 yes Figure 1 Schematic diagram of moving the wireless network card heat sink upward. Figure 3 It is along Figure 1 Schematic diagram of the cross-section of the AA line segment. Figure 4 yes Figure 1 An exploded diagram of the wireless network card heat sink. Figure 5 yes Figure 1 A schematic diagram showing another perspective of a wireless network card heat sink configured on a wireless network card.

[0051] See also Figures 1 to 5 The wireless network card heat sink 100 of this embodiment is suitable for being configured on a wireless network card 10 ( Figure 2 ) and fixed to a circuit board 20, and can be stably fixed on the circuit board 20 and thermally coupled to the wireless network card 10 to dissipate heat for the wireless network card 10. In this embodiment, the wireless network card 10 is, for example, a WiFi 6 network card, but the type of the wireless network card 10 is not limited thereto.

[0052] like Figure 4 As shown, in this embodiment, the wireless network card heat sink 100 includes a heat sink 110, a fixing portion 120 and a locking member 130. In this embodiment, the size of the heat sink 110 is close to the size of the wireless network card 10. Since the wireless network card 10 is a WiFi 6 network card as an example, the length L of the heat sink 110 is between 10 mm and 30 mm, and the width W of the heat sink 110 is between 10 mm and 30 mm. Of course, in other embodiments, the length L and width W of the heat sink 110 are not limited to this.

[0053] In addition, if Figure 3 As shown, the heat sink 110 has a lower surface 112, and the wireless network card 10 is suitable for being located between the lower surface 112 of the heat sink 110 and the circuit board 20. The fixing portion 120 is disposed beside the heat sink 110, and the thickness T1 of the fixing portion 120 is greater than the thickness T2 of the heat sink 110. The fixing portion 120 extends along a normal direction D1 of the heat sink 110 (that is, extends downward) and protrudes from the lower surface 112 of the heat sink 110. In other words, the bottom surface of the fixing portion 120 is lower than the lower surface 112 of the heat sink 110. Therefore, when the wireless network card heat sink 100 is disposed on the wireless network card 10 and fixed to the circuit board 20, the fixing portion 120 can be pressed against the circuit board 20.

[0054] In this embodiment, the fixing portion 120 includes a hole 122, and the locking member 130 is detachably inserted into the hole 122 of the fixing portion 120 and is suitable for fixing to the circuit board 20. In this embodiment, the height H of the fixing portion 120 protruding from the lower surface 112 of the heat sink 110 is close to the sum of the thickness T3 of the heat sink 150 and the thickness T4 of the chip 12. Such a design enables the fixing portion 120 to press against the circuit board 20. During assembly, since the fixing portion 120 presses against the circuit board 20, even if the locking member 130 is locked downward and presses against the upper surface 114 of the fixing portion 120, the fixing portion 120 will not move downward relative to the circuit board 20, causing the heat sink 110 to bend and deform at a location close to the fixing portion 120, resulting in a plate bending condition.

[0055] In other words, the wireless network card heat sink 100 of this embodiment is designed to press against the circuit board 20 by having the fixing portion 120 protrude from the lower surface 112 of the heat sink 110, so that the distance between the fixing portion 120 and the circuit board 20 is fixed, thereby ensuring that the heat sink 110 will not be bent due to the locking effect of the locking piece 130, and can provide a sufficient service life and good heat dissipation effect.

[0056] In addition, if Figure 3 As shown, the wireless network card heat sink 100 further includes a heat dissipation pad 150, which is disposed on the lower surface 112 of the heat dissipation plate 110. As the locking member 130 is screwed to the fixing seat 22 of the circuit board 20, the heat dissipation plate 110 will press the heat dissipation pad 150 tightly against the chip 12 of the wireless network card 10. The heat dissipation pad 150 contacts the chip 12 of the wireless network card 10, and the heat energy generated by the chip 12 of the wireless network card 10 can be transferred to the heat dissipation plate 110 through the heat dissipation pad 150, and dissipated through the fins 116 above the upper surface 114 of the heat dissipation plate 110.

[0057] In addition, in this embodiment, since the size of the heat sink 110 is relatively small, a single locking member 130 can fix the wireless network card heat sink 100 on the circuit board 20, and sufficient pressure can be applied to press the heat pad 150 tightly against the chip 12 of the wireless network card 10. Of course, in other embodiments, the number of fixing portions 120 and locking members 130 is not limited thereto.

[0058] Furthermore, in this embodiment, the heat sink 110 and the fixing portion 120 are integrally formed, for example, by aluminum extrusion. However, the heat sink 110 and the fixing portion 120 may also be two separately manufactured parts, which is not limited thereto.

[0059] It should be noted that in this embodiment, the hole 122 of the fixing portion 120 has a first portion 123 and a second portion 124. The first portion 123 is the portion through which the fastener 130 first passes when inserted, and the second portion 124 is the portion through which the fastener 130 later passes when inserted. Figure 3 As shown, in this embodiment, the inner diameter I1 of the first portion 123 is larger than the inner diameter I2 of the second portion 124. The second portion 124 has an inner thread 125, and the fastener 130 can be screwed to the inner thread 125 of the second portion 124 of the fixing portion 120.

[0060] like Figure 4 As shown, in this embodiment, the fastener 130 includes a nut 132, a neck 134 connected to the nut 132, and a threaded portion 136 connected to the neck 134. The outer diameter O1 of the nut 132 is greater than the outer diameter O3 of the threaded portion 136, and the outer diameter O3 of the threaded portion 136 is greater than the outer diameter O2 of the neck 134.

[0061] Please go back Figure 3 When the locking member 130 passes through the fixing portion 120 and is fixed to the circuit board 20, the neck 134 of the locking member 130 is located in the first portion 123 of the hole 122 of the fixing portion 120, and the threaded portion 136 of the locking member 130 is threadedly connected to the second portion 124 of the hole 122 of the fixing portion 120 and the fixing seat 22 of the circuit board 20.

[0062] Since the fixing portion 120 of the wireless network card heat sink 100 has an internal thread 125, the locking member 130 can be screwed to the fixing portion 120. Therefore, when the wireless network card heat sink 100 has not yet been installed on the wireless network card 10 and the circuit board 20, the locking member 130 can be screwed to the fixing portion 120 and can not be separated from the fixing portion 120, so as to reduce the probability of the locking member 130 being lost.

[0063] In addition, after the wireless network card 10 is inserted into the connector 24 on the circuit board 20 and the rear end of the wireless network card 10 is placed on the fixing seat 22 of the circuit board 20, the assembler can place the wireless network card heat sink 100 on the wireless network card 10. Because the locking element 130 itself is screwed to the fixing portion 120, the assembler only needs to turn the locking element 130 that is already on the fixing portion 120 downward to screw it to the fixing seat 22 of the circuit board 20 to complete the assembly, which is more convenient and simple.

[0064] Furthermore, if Figure 5 As shown, in this embodiment, the wireless network card heat sink 100 further includes two limiting portions 140, which extend from opposite sides of the heat sink 110 along the normal direction and protrude from the lower surface 112 of the heat sink 110. The two limiting portions 140 are located on both sides of the heat dissipation pad 150. When the wireless network card heat sink 100 is set on the wireless network card 10, the two limiting portions 140 will be located on both sides of the wireless network card 10, and the wireless network card 10 will be restricted from moving along the direction D2 relative to the wireless network card heat sink 100, so that the wireless network card heat sink 100 can be stably fixed on the wireless network card 10.

[0065] It is worth mentioning that in this embodiment, the two limiting parts 140 are two plates perpendicular to the heat sink 110. Therefore, the projection of the two limiting parts 140 on the plane where the lower surface 112 of the heat sink 110 is located is outside the projection of the heat pad 150 on the plane where the lower surface 112 of the heat sink 110 is located. Since the two limiting parts 140 are two perpendicular plates, the two limiting parts 140 will not extend toward each other and below the circuit board 20 at the parts away from the heat sink 110. Such a design allows the wireless network card heat sink 100 of this embodiment to be applied to wireless network cards 10 of different thicknesses, effectively avoiding the risk of interference between the limiting parts 140 and the electronic parts on the wireless network card 10.

[0066] In this embodiment, the heat sink 110 and the two limiting portions 140 are integrally formed, for example, by aluminum extrusion. However, the heat sink 110 and the two limiting portions 140 may also be multiple components manufactured separately, and are not limited thereto.

[0067] In summary, the fixing part of the wireless network card heat sink of the present invention is arranged beside the heat sink, the thickness of the fixing part is greater than the thickness of the heat sink, and the fixing part extends along the normal direction of the heat sink and protrudes from the lower surface of the heat sink. Such a design enables the fixing part to press against the circuit board below. In this way, when the locking member is passed through the fixing part and fixed to the circuit board, the distance between the fixing part and the circuit board can be fixed due to the fixing part pressing against the circuit board, and it can be avoided that when the locking member locks the circuit board too tightly, the locking member squeezes the fixing part and causes the fixing part to move downward relative to the heat sink toward the circuit board, causing the heat sink to bend and deform at the part close to the fixing part, thereby causing the heat sink and the wireless network card to have poor thermal coupling. In other words, the fixing part of the wireless network card heat sink of the present invention protrudes from the lower surface of the heat sink, and the design of pressing against the circuit board can ensure that the heat sink will not be affected by the locking of the fixing member and cause the board to bend, and can provide a sufficient service life and good heat dissipation effect.

Claims

1. A wireless network card heat sink, suitable for being configured on a wireless network card and fixed to a circuit board, characterized in that: include: A heat sink having a lower surface, wherein the wireless network card is suitable for being located between the lower surface of the heat sink and the circuit board; a fixing portion, disposed beside the heat sink, the thickness of the fixing portion being greater than the thickness of the heat sink, the fixing portion extending along a normal direction of the heat sink and protruding from the lower surface of the heat sink, and the fixing portion being suitable for pressing against the circuit board; as well as A locking member, detachably disposed through the fixing portion and suitable for fixing to the circuit board; The circuit board is provided with a fixing seat and a connector, and the locking piece is suitable for being screwed to the fixing seat; when the front end of the wireless network card is inserted into the connector and the rear end is placed on the fixing seat, the wireless network card heat sink can be placed on the wireless network card.

2. The wireless network card heat sink according to claim 1, characterized in that: The fixing portion comprises a hole having an internal thread, and the locking element is screwed to the internal thread of the fixing portion.

3. The wireless network card heat sink as claimed in claim 2, characterized in that: The hole of the fixing portion has a first portion and a second portion. The inner diameter of the first portion is greater than the inner diameter of the second portion. The inner thread is located at the second portion.

4. The wireless network card heat sink according to claim 1, characterized in that: The heat dissipation plate and the fixing portion are integrally formed.

5. The wireless network card heat sink according to claim 1, characterized in that: The locking element comprises a nut, a neck connected to the nut and a threaded portion connected to the neck, wherein the outer diameter of the neck is smaller than the outer diameter of the threaded portion.

6. The wireless network card heat sink according to claim 1, characterized in that: The invention also comprises two limiting parts, which extend from opposite sides of the heat dissipation plate along the normal direction and protrude from the lower surface of the heat dissipation plate.

7. The wireless network card heat sink according to claim 6, characterized in that: It also includes a heat dissipation pad, which is arranged on the lower surface of the heat dissipation plate, and the two limiting parts are located on both sides of the heat dissipation pad.

8. The wireless network card heat sink as claimed in claim 7, characterized in that: The projections of the two limiting portions on the plane where the lower surface of the heat sink plate is located are located outside the projection of the heat sink pad on the plane where the lower surface of the heat sink plate is located.

9. The wireless network card heat sink according to claim 6, characterized in that: The heat dissipation plate and the two limiting parts are formed in one piece.

10. The wireless network card heat sink according to claim 1, characterized in that: The length of the heat dissipation plate is between 10 mm and 30 mm, and the width of the heat dissipation plate is between 10 mm and 30 mm.

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