Vacuum drying device

Abstract

The present invention provides a technology for suppressing uneven drying of a coating film. A reduced pressure drying device (1) includes: a chamber (10), a support pin (22) as an example of a pin abutment portion, a support plate (21) as an example of a wide width portion, a drive shaft (23) as an example of a narrow width portion, and an exhaust portion. The chamber (10) accommodates a substrate (9). The support plate (21) is disposed in the chamber (10) and includes a portion whose upper width is wider than that of the lower width. The support pin (22) extends upward from the support plate (21) and abuts against the lower surface of the substrate (9). The drive shaft (23) extends downward from the support plate (21) and has a width narrower than that of the support plate (21). The exhaust portion exhausts the gas in the chamber (10).

Description

Technical Field

[0001] The present disclosure relates to a reduced-pressure drying device. Background Art

[0002] For example, there is known a vacuum drying device for vacuum drying a coating film of a photoresist or the like coated on various substrates. For various substrates, for example, various substrates such as glass substrates, ceramic substrates, semiconductor wafers, electronic component substrates, or printed boards for printing, which are used to form various elements, can be applied. For various elements, for example, semiconductor devices, display panels, solar cell panels, magnetic disks, or optical disks can be applied. For display panels, for example, liquid crystal display panels, organic electroluminescence (EL) display panels, plasma display panels, or field emission displays can be applied.

[0003] When the coating film is dried using a reduced pressure drying device, for example, in a state where a plurality of pins support the substrate in the chamber, the chamber is exhausted from the chamber through the exhaust port at the bottom of the chamber using a vacuum pump. Then, for example, when the vacuum degree reaches a predetermined value, the exhaust from the chamber is stopped, and the chamber is returned to atmospheric pressure by supplying gas into the chamber. For example, an inert gas such as nitrogen or air can be used as the gas.

[0004] In a reduced pressure drying device, for example, if the drying speed of a coating film formed on the upper surface of a substrate varies depending on the location, uneven drying (also referred to as uneven drying) may occur in accordance with the difference in drying speed. Uneven drying may cause, for example, a thickness deviation of the coating film after drying.

[0005] For example, on a substrate, due to the contact of a plurality of pins, a temperature difference may be generated between a portion supported by a plurality of pins and a portion surrounding the portion. Thus, for example, depending on the temperature difference caused by the plurality of pins, a difference may be generated in the drying speed of the coating film. As a result, for example, uneven drying corresponding to the arrangement of the plurality of pins may be generated on the coating film. Here, for example, during the reduced pressure drying of the coating film, although the temperature of the substrate decreases due to the heat of vaporization generated when the solvent, etc., vaporizes from the coating film, the temperature of the plurality of pins is difficult to change regardless of whether the heat capacity of the plurality of pins is large or the plurality of pins are connected to a chamber with a large heat capacity. Therefore, for example, a temperature difference corresponding to the arrangement of the plurality of pins may be generated on the substrate.

[0006] Patent Document 1 describes that a plurality of pins supporting a substrate are hollow pins cooled by discharging a fluid in an inner space or by supplying a liquid such as cooling water into an inner space.

[0007] [Prior art literature]

[0008] [Patent Document]

[0009] [Patent Document 1] Japanese Patent No. 6579773 Summary of the invention

[0010] [Problems to be solved by the invention]

[0011] However, the reduced pressure drying device of Patent Document 1 has a complicated device structure, which results in a high device price. In addition, for example, in a structure in which cooling water is supplied to a hollow pin, leakage of cooling water may adversely affect the vacuum state in the chamber.

[0012] The present disclosure has been made in view of the above-mentioned problems, and an object of the present disclosure is to provide a technology for suppressing occurrence of drying unevenness in a coating film.

[0013] [Technical means to solve the problem]

[0014] The first embodiment is a reduced-pressure drying device for drying a coating film formed on the upper surface of a substrate, the reduced-pressure drying device comprising: a chamber for accommodating the substrate; a wide-width portion disposed in the chamber and including a portion whose upper width is wider than that of the lower width; a pin abutment portion extending upward from the wide-width portion and abutting against the lower surface of the substrate; a narrow-width portion extending downward from the wide-width portion and having a width narrower than that of the wide-width portion; and an exhaust portion for exhausting gas in the chamber.

[0015] In a second embodiment of the reduced-pressure drying device according to the first embodiment, the wide portion includes a portion whose width continuously increases upward.

[0016] In a third embodiment of the reduced-pressure drying device according to the first or second embodiment, the wide width portion includes a portion whose width gradually increases upward.

[0017] According to the reduced pressure drying device of any one of the first to third embodiments, in a fourth embodiment, the wide width portion includes: a first member; and a pair of umbrella portions extending obliquely downward from both sides of the first member.

[0018] According to the reduced pressure drying device of any one of the first to fourth embodiments, a fifth embodiment further includes a lifting portion for lifting and lowering the narrow width portion, and a plurality of the pin contact portions are vertically provided on the upper surface of the wide width portion.

[0019] According to the reduced-pressure drying device of the fifth embodiment, in a sixth embodiment, a plurality of the narrow width portions are arranged in a prescribed direction and extend downward from the wide width portion, and the wide width portion includes: a first component extending along the prescribed direction; and a plurality of second components avoiding a portion of the area between the narrow width portions when viewed in a plan view, being arranged in areas overlapping with the narrow width portions respectively, and having a width wider than that of the first component.

[0020] In a seventh embodiment of the reduced-pressure drying device according to any one of the first to fourth embodiments, the pin contact portion, the wide width portion, and the narrow width portion form a fixing pin.

[0021] [Effects of the Invention]

[0022] According to the first embodiment and the third embodiment, the gas in the chamber is greatly reduced by exhausting the gas using the exhaust portion. The temperature of the wide portion, the pin abutment portion, and the narrow portion does not decrease compared to the gas, so an upward airflow is generated around them. The wide portion includes a portion whose width at the top is wider than the width at the bottom, so the gas generated by the upward airflow flows obliquely upward through the wide portion. Therefore, the cold gas generated by the upward airflow expands in a direction closer to the horizontal direction directly below the substrate. Therefore, it is not easy to cause uneven temperature distribution of the substrate. In other words, the temperature distribution of the substrate can be made more uniform. Thus, the reduced pressure drying device can suppress uneven drying and dry the coating film.

[0023] According to the second embodiment, the gas generated by the ascending airflow can be made to flow more smoothly in a direction close to the horizontal direction.

[0024] According to the fourth embodiment, the cold gas generated by the rising airflow flows away from the substrate through the pair of umbrella parts. Therefore, the uneven temperature distribution of the substrate caused by the rising airflow can be further suppressed. In other words, the temperature distribution of the substrate can be made more uniform.

[0025] According to the fifth embodiment, the narrow width portion, the wide width portion, and the plurality of pin contact portions can be integrally raised and lowered by raising and lowering the narrow width portion.

[0026] According to the sixth embodiment, the second member is provided so as to avoid a part of the region between the narrow width portions, so that the material cost of the second member can be reduced.

[0027] According to the seventh embodiment, the unevenness of the temperature distribution of the substrate caused by the upward airflow generated around the fixing pins can be suppressed. In other words, the temperature distribution of the substrate can be made more uniform. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a diagram showing an example of a longitudinal section of a reduced-pressure drying apparatus according to an embodiment.

[0029] Figure 2 This is a diagram showing an example of a cross-section of a reduced-pressure drying apparatus according to an embodiment.

[0030] Figure 3 This is a diagram showing an example of a longitudinal section of a reduced-pressure drying apparatus according to an embodiment.

[0031] Figure 4 It is a perspective view showing an example of a substrate.

[0032] Figure 5 This is a diagram showing an example of a longitudinal section of a part of a substrate.

[0033] Figure 6 This is a diagram schematically showing an example of air flow in a chamber under reduced pressure.

[0034] Figure 7 This is a diagram showing an example of temperature distribution near the support plate in the chamber according to the embodiment.

[0035] Figure 8 This is a diagram showing an example of temperature distribution near the support plate in the chamber of the comparative example.

[0036] Fig. 9 This is a diagram showing an example of temperature distribution of a portion of a substrate according to the embodiment.

[0037] Fig.10 This is a diagram showing an example of temperature distribution of a portion of a substrate of a comparative example.

[0038] Fig.11 It is a diagram schematically showing the structure of a first modified example of the support plate.

[0039] Fig.12 It is a diagram schematically showing the structure of a second modified example of the support plate.

[0040] Fig.13 It is a diagram schematically showing the structure of a third modified example of the support plate.

[0041] Fig.14 It is a diagram schematically showing the structure of a fourth modified example of the support plate.

[0042] Fig.15 It is a diagram schematically showing the structure of a fifth modification example of the support plate.

[0043] Fig.16 It is a diagram schematically showing the structure of a modified example of the support portion.

[0044] Explanation of symbols

[0045] 1: Vacuum drying device

[0046] 9: Substrate

[0047] 10: Chamber

[0048] 10s: Inner Space

[0049] 11: Bottom plate

[0050] 11h, 40h: Through hole

[0051] 12: Side wall

[0052] 13: Top plate

[0053] 14: Moving in and out

[0054] 15: Gate part (gate valve)

[0055] 16: Opening and closing drive unit

[0056] 16a, 16b, 16c, 16d: Exhaust port

[0057] 16f: Air supply port

[0058] 20: Support

[0059] 21: Wide section (support plate)

[0060] 21a: Upper surface

[0061] 21b: Lower surface

[0062] 21c, 21d: Side

[0063] 21ca: Curved surface

[0064] 21cb: Flat

[0065] 21Z: Support plate

[0066] 22: Pin contact portion (support pin)

[0067] 23: Narrow part (drive shaft)

[0068] 25: Fixed pin

[0069] 26: Pin contact portion

[0070] 27: Wide section

[0071] 28: Base end

[0072] 30: Exhaust

[0073] 31: Exhaust pipe

[0074] 31a, 31b, 31c, 31d: Individual piping

[0075] 31e: Main pipe

[0076] 32: Vacuum pump

[0077] 40: Bottom rectifier

[0078] 50: Side fairing

[0079] 60: Air supply department

[0080] 61: Gas supply piping

[0081] 62: Gas supply

[0082] 70: Pressure gauge

[0083] 80: Control Department

[0084] 90: Coating film

[0085] 100: Lifting Department

[0086] 211: First Component

[0087] 212: Second component

[0088] 213: Flat part

[0089] 214: Umbrella Department

[0090] 801: Processor

[0091] 802: Memory

[0092] 803: Storage

[0093] 803p:Computer Program (Program)

[0094] 804: Input

[0095] 805: Output

[0096] 806: Ministry of Communications

[0097] 807: Driver

[0098] 807m: Storage medium

[0099] A1: Area (formed area, coating area)

[0100] A2: Area (non-coating area)

[0101] A3: Area (covered area)

[0102] A4: Area (exposed area)

[0103] F1: First side

[0104] F2: Second side

[0105] G: Updraft

[0106] H1: descending position

[0107] H2: Ascending position

[0108] R1: Region

[0109] T1~T9、T11~T16:contour lines

[0110] Va, Vb, Vc, Vd: Individual valves

[0111] Ve: Main valve

[0112] Vf: Air supply valve DETAILED DESCRIPTION

[0113] Hereinafter, an embodiment of the present disclosure and various modified examples are described with reference to the accompanying drawings. In the accompanying drawings, parts having the same structure and function are marked with the same symbols, and repeated descriptions are omitted in the following description. The accompanying drawings are only schematically shown, and the dimensions and positional relationships of the various structures in each figure are not accurately illustrated. In addition, in this specification, the downward direction is the direction of gravity, and the upward direction is the direction opposite to the direction of gravity.

[0114] <1. Structure of vacuum drying device>

[0115] Figure 1 This is a diagram schematically showing an example of a longitudinal section of a reduced-pressure drying apparatus 1 according to an embodiment. Figure 2 This is a diagram schematically showing an example of a cross section of a reduced-pressure drying apparatus 1 according to an embodiment. Figure 3 This is a diagram schematically showing an example of a longitudinal section of a reduced-pressure drying apparatus 1 according to an embodiment. Figure 1 The longitudinal section of Figure 3 The longitudinal sections of FIG. 1 show the structure of the vacuum drying device 1 when viewed from directions that differ by about 90 degrees. Figure 2 and Figure 3 In order to avoid complication of the drawings, for the sake of convenience, the structures related to the exhaust unit 30, the air supply unit 60, the pressure gauge 70 and the control unit 80 described later are omitted. The reduced pressure drying device 1 is a device for drying a coating film 90 (see Figure 5 )Drying device.

[0116] For example, a glass substrate, a semiconductor wafer, or a ceramic substrate can be applied to the substrate 9. The substrate 9 has, for example, a first surface F1 (see Figure 4 and Figure 5 ) and a second surface F2 (refer to Figure 5) is a flat substrate. For example, in the reduced pressure drying device 1, the first surface F1 of the substrate 9 is set as the upper surface of the substrate 9, and the second surface F2 of the substrate 9 is set as the lower surface of the substrate 9. Here, it is appropriate to cite a specific example in which a rectangular glass substrate is applied to the substrate 9 for illustration. On the first surface F1 of the substrate 9, for example, a coating film 90 is partially formed by pre-coating a treatment liquid containing an organic material and a solvent. The coating of the treatment liquid is performed, for example, by a slit coater or an inkjet device. For the treatment liquid, for example, a coating liquid such as a liquid containing a polyimide precursor and a solvent (also called a polyimide (PI) liquid) or an anti-etching agent liquid can be applied. For the polyimide precursor, for example, polyamide (Polyamide) acid (Polyamic acid) can be applied. For the solvent, for example, NMP (N-methyl-2-pyrrolidone: N-Methyl-2-Pyrrolidone) can be applied. In addition, for example, when the reduced pressure drying device 1 is applied to the manufacturing process of an organic EL display, the coating film 90 may be dried in the reduced pressure drying device 1 to become a hole injection layer, a hole transport layer or a light-emitting layer of the organic EL display panel.

[0117] Figure 4 It is a perspective view showing an example of the substrate 9 . Figure 5 9 is a diagram showing an example of a longitudinal section of a portion of the substrate 9. Figure 4 As shown, the substrate 9 has, for example, a rectangular shape with different lengths in the vertical and horizontal directions when viewed from above. A plurality of regions A1 for forming elements and the like (also referred to as formed regions and coating regions) are arranged on the substrate 9. Figure 4 In the example, when viewed from above, four rectangular coating areas A1 are arranged in a matrix of two rows and two columns on the substrate 9. However, the shape, number, and arrangement of the coating areas A1 are not limited to the example described above. In the coating process before the vacuum drying process using the vacuum drying device 1, the coating film 90 is formed on the upper surface of each coating area A1 in a desired pattern by a slit coater or an inkjet device. For the desired pattern, for example, a circuit pattern can be applied. Here, for example, Figure 5 As shown, the first surface F1 as the upper surface of each coating area A1 has an area (also referred to as a covered area) A3 covered by the coating film 90 and an exposed area (also referred to as an exposed area) A4 not covered by the coating film 90. In addition, the area around the coating area A1 in the substrate 9 and the area between the adjacent coating areas A1 become areas (also referred to as non-coating areas) A2 where the coating film 90 is not formed on the first surface F1 as the upper surface. The non-coating area A2 is also an exposed area (exposed area) A4 not covered by the coating film 90.

[0118] <<Overview of the structure of the vacuum drying device>>

[0119] First, the structure of the reduced pressure drying device 1 is summarized. Figure 1 As shown, the reduced pressure drying device 1 includes, for example, a chamber 10, a support portion 20, and an exhaust portion 30. The chamber 10 is a portion for accommodating the substrate 9. The support portion 20 is disposed in the chamber 10 and supports the substrate 9 in a horizontal posture. The so-called horizontal posture mentioned here refers to a posture in which the thickness direction of the substrate 9 is along the up-down direction. The exhaust portion 30 exhausts the gas in the chamber 10 to the outside, thereby reducing the air pressure in the chamber 10. Due to the reduction in the air pressure, the solvent of the coating film 90 evaporates and the coating film 90 is dried.

[0120] In addition, Figure 1 In the example of , the reduced pressure drying device 1 includes: an air supply unit 60, a control unit 80, a bottom straightening plate 40, a side straightening plate 50, and a pressure gauge 70. The air supply unit 60 supplies gas into the chamber 10. In this way, the air pressure in the chamber 10 can be restored to atmospheric pressure. The bottom straightening plate 40 and the side straightening plate 50 are arranged in the chamber 10, and adjust the air flow in the chamber 10. The pressure gauge 70 measures the air pressure in the chamber 10 and outputs an electrical signal indicating the measurement result to the control unit 80. The control unit 80 controls various structures of the reduced pressure drying device 1. For example, the control unit 80 controls the exhaust unit 30 based on the air pressure measured by the pressure gauge 70, and adjusts the air pressure in the chamber 10 to the target air pressure.

[0121] Next, a more detailed example of each structure of the reduced-pressure drying apparatus 1 will be described.

[0122] <<Chamber 10>>

[0123] The chamber 10 is a portion for accommodating the substrate 9. For the chamber 10, a pressure-resistant container having an internal space 10s for accommodating the substrate 9 can be applied. The chamber 10 is, for example, fixed to an apparatus frame which is not shown in the figure. The shape of the chamber 10 is, for example, a flat rectangular parallelepiped. The chamber 10 has, for example, a substantially rectangular bottom plate portion 11, four side wall portions 12, and a substantially rectangular top plate portion 13. The four side wall portions 12 connect, for example, the four end sides of the bottom plate portion 11 with the four end sides of the top plate portion 13 in the up and down directions. For example, a loading and unloading port 14 and a gate portion (also called a gate valve) 15 for opening and closing the loading and unloading port 14 are provided in one of the four side wall portions 12. The gate portion 15 is, for example, linked to or connected to an opening and closing drive portion 16. In Figure 3In order to avoid complication of the drawings, the opening and closing drive unit 16 is conceptually shown. For example, a drive mechanism such as a cylinder can be applied to the opening and closing drive unit 16. Here, for example, by the operation of the opening and closing drive unit 16, the gate unit 15 can move between a position (also referred to as a closed position) in which the loading and unloading port 14 is closed and a position (also referred to as an open position) in which the loading and unloading port 14 is opened.

[0124] Here, for example, when the shutter 15 is in the closed position, the internal space 10s of the chamber 10 is sealed. For example, when the shutter 15 is in the open position, the substrate 9 can be carried into and out of the internal space 10s of the chamber 10 through the loading / unloading port 14.

[0125] <<Supporting portion 20>>

[0126] The support part 20 is a portion that supports the substrate 9 from below in the chamber 10. For example, the support part 20 is located in the internal space 10s of the chamber 10, and can support the substrate 9 accommodated in the internal space 10s of the chamber 10 from below.

[0127] like Figures 1 to 3 As shown in FIG. 2 , the support portion 20 includes a support plate 21 as an example of a wide width portion, a support pin 22 as an example of a pin contact portion, and a drive shaft 23 as an example of a narrow width portion. Figure 1 and Figure 2 As shown, a plurality of (five in the figure) support plates 21 can be provided on the support portion 20. Figure 1 and Figure 2 In the example, a plurality of support plates 21 are arranged at intervals in the horizontal direction. Hereinafter, the direction in which the plurality of support plates 21 are arranged is referred to as the arrangement direction. Each support plate 21 has a long strip shape with a horizontal direction perpendicular to the arrangement direction as the long side direction. A plurality of (four in the figure) support pins 22 are vertically provided on the upper surface 21a of each support plate 21. The plurality of support plates 21 are the parts that serve as the base of the support portion 20. The substrate 9 is, for example, arranged above the plurality of support plates 21, and the upper ends of the plurality of support pins 22 are in contact with the second surface F2 which is the lower surface of the substrate 9, whereby the substrate 9 is supported in a horizontal posture.

[0128] Each support pin 22 has a rod-like shape extending in the up-down direction. As a more specific example, each support pin 22 has a roughly cylindrical shape with a central axis along the up-down direction. The lower end of the support pin 22 is mounted on the upper surface 21a of the support plate 21. That is, the support pin 22 extends upward from the upper surface 21a of the support plate 21. For the material of the support pin 22, for example, a resin material such as polyetheretherketone or polyimide can be applied. The support pin 22 is, for example, a solid material. The front end shape of the support pin 22 may also have a pointed tapered shape that becomes thinner as it goes upward. The support portion 20 can support the substrate 9 by the front ends of the plurality of support pins 22 abutting against the second surface F2 of the substrate 9.

[0129] exist Figure 2 and Figure 3 In the example of , on each support plate 21, a plurality of support pins 22 are arranged in a row in the longitudinal direction of the support plate 21. Specifically, four support pins 22 are arranged in a row at substantially equal intervals. However, the support pins 22 may be arranged in a plurality of rows on the support plate 21.

[0130] The width of the upper surface 21a of the support plate 21 (the width along the arrangement direction) is wider than the width (eg, diameter) of the support pin 22. Figure 1 As shown in FIG. 1 , the support plate 21 has a shape in which the width of the upper portion is wider than the width of the lower portion. Figure 1 In the example of , the support plate 21 has a shape whose width continuously widens from the bottom to the top. In other words, the width of the support plate 21 increases monotonically as it goes upward. In addition, it can also be said that the support plate 21 includes a first portion and a second portion that is wider than the first portion at a position above the first portion.

[0131] like Figures 1 to 3 As shown, the support plate 21 has an upper surface 21a, a lower surface 21b, two side surfaces 21c, and two side surfaces 21d. The upper surface 21a is, for example, a horizontal plane and has a substantially rectangular shape when viewed from above (see FIG. Figure 2 ). The short side direction of the upper surface 21a is along the arrangement direction of the plurality of support plates 21, and the long side direction of the upper surface 21a is along the direction perpendicular to the arrangement direction. The lower surface 21b of the support plate 21 is, for example, a horizontal plane, and has a shape that is substantially rectangular when viewed in a plan view. The short side direction of the lower surface 21b is along the arrangement direction of the plurality of support plates 21, and the long side direction of the lower surface 21b is along the direction perpendicular to the arrangement direction. The width of the lower surface 21b in the short side direction is narrower than the width of the upper surface 21a in the short side direction (refer to Figure 1). Each side surface 21c connects the end edge of the upper surface 21a and the end edge of the lower surface 21b extending along the longitudinal direction in the vertical direction. Each side surface 21c has a substantially rectangular shape. The two side surfaces 21c are inclined relative to the horizontal plane in such a manner that the interval between the two side surfaces 21c (i.e., the width of the support plate 21) continuously widens as it goes upward. Figure 1 In the example of , the support plate 21 has a shape of an inverted isosceles trapezoid obtained by inverting a substantially isosceles trapezoid in a cross section perpendicular to the long side direction. Each side surface 21d connects the end edge of the upper surface 21a and the end edge of the lower surface 21b extending along the short side direction in the vertical direction. Each side surface 21d has a substantially rectangular shape. The support plate 21 may also have the same shape in the long side direction. That is, the support plate 21 may also have the same shape in any cross section whose positions in the long side direction are different from each other.

[0132] exist Figure 2 and Figure 3 In the example of the embodiment, the drive shaft 23 has a rod-like shape extending in the vertical direction. As a more specific example, the drive shaft 23 has a substantially cylindrical shape with a central axis along the vertical direction. The support plate 21 is fixed to the upper end of the drive shaft 23. That is, the drive shaft 23 extends downward from the support plate 21.

[0133] exist Figure 2 and Figure 3 In the example, a plurality of (two in the figure) drive shafts 23 are provided for each support plate 21. The two drive shafts 23 are arranged at intervals in the long side direction of the support plate 21. Specifically, the two drive shafts 23 are respectively arranged near both sides of the long side direction of the support plate 21. The width (e.g., diameter) of each drive shaft 23 is narrower than the width in the short side direction of the support plate 21 (i.e., the width in the short side direction of the upper surface 21a). For example, the width of each drive shaft 23 may be less than two-thirds of the width of the support plate 21, or less than half. The width (e.g., diameter) of each drive shaft 23 may also be wider than the width (e.g., diameter) of the support pin 22. The width of the drive shaft 23 may also be, for example, more than twice the width of the support pin 22. As a specific example, the width of the support plate 21 is set to, for example, about several tens of mm (specifically, 30 mm), the width of the drive shaft 23 is set to, for example, about half the width of the support plate 21 (specifically, 15 mm), and the width of the support pin 22 is set to, for example, about several mm (for example, about 3 mm).

[0134] exist Figure 3 In the example of , the support portion 20 is provided with a lifting portion 100. The lifting portion 100 is a portion that moves the support pins 22 up and down in the chamber 10. In other words, for example, the lifting portion 100 has a mechanism (also referred to as a lifting mechanism) that can move the support pins 22 up and down. Figure 1In order to avoid complication of the drawings, the lifting unit 100 is conceptually shown. For example, a driving device such as a direct-acting motor or a cylinder can be applied to the lifting unit 100. Figure 3 As shown, the lifting unit 100 is fixed to a device frame (not shown) outside the chamber 10, for example. The drive shaft 23 is connected to the lifting unit 100. The lifting unit 100 lifts and lowers the drive shaft 23. As a result, the support plate 21 fixed to the drive shaft 23 and the support pin 22 fixed to the support plate 21 are lifted and lowered integrally with the drive shaft 23.

[0135] Each drive shaft 23 is inserted into the through hole 11h of the bottom plate 11 of the chamber 10. For example, if a bellows is provided between the bottom surface of the bottom plate 11 and the drive shaft 23, the gap between the bottom plate 11 and the drive shaft 23 can be sealed.

[0136] Here, for example, when the lifting unit 100 is operated, the support unit 20 is at the lowered position H1 ( Figure 1 and Figure 3 The position indicated by the dotted line) is higher than the ascending position H2 ( Figure 1 and Figure 3 In this case, for example, a plurality of support plates 21 can be lifted and lowered in an integrated manner.

[0137] <<Exhaust section 30>>

[0138] Reference Figure 1 The exhaust part 30 is a part for exhausting the gas in the chamber 10. Figure 1 As shown, four exhaust ports 16a, 16b, 16c, and 16d are provided on the bottom plate 11 of the chamber 10, for example. The exhaust section 30 includes, for example, an exhaust pipe 31, four individual valves Va, Vb, Vc, and Vd, a main valve Ve, and a vacuum pump 32. The exhaust pipe 31 includes, for example, four individual pipes 31a, 31b, 31c, and 31d and one main pipe 31e. For example, one end of the individual pipe 31a is connected to the exhaust port 16a, one end of the individual pipe 31b is connected to the exhaust port 16b, one end of the individual pipe 31c is connected to the exhaust port 16c, and one end of the individual pipe 31d is connected to the exhaust port 16d. For example, the other ends of the four individual pipes 31a, 31b, 31c, and 31d merge and are connected to one end of the main pipe 31e. For example, the other end of the main pipe 31e is connected to the vacuum pump 32. For example, the individual valve Va is provided on the path of the individual pipe 31a, the individual valve Vb is provided on the path of the individual pipe 31b, the individual valve Vc is provided on the path of the individual pipe 31c, and the individual valve Vd is provided on the path of the individual pipe 31d. For example, the main valve Ve is provided on the path of the main pipe 31e.

[0139] Here, for example, when at least one of the four individual valves Va, Vb, Vc, and Vd and one main valve Ve are opened and the vacuum pump 32 is operated while the loading and unloading port 14 is closed by the gate portion 15, the gas in the chamber 10 is exhausted to the outside of the chamber 10 through the exhaust pipe 31. As a result, for example, the gas pressure of the internal space 10s of the chamber 10 can be reduced. The four individual valves Va, Vb, Vc, and Vd are, for example, valves for adjusting the exhaust volume from the four exhaust ports 16a, 16b, 16c, and 16d, respectively. For example, a valve (also referred to as an on-off valve) that switches between an open state and a closed state based on a command from the control portion 80 can be applied to each of the four individual valves Va, Vb, Vc, and Vd. The main valve Ve is, for example, a valve for adjusting the total exhaust volume from the four exhaust ports 16a, 16b, 16c, and 16d. As the main valve Ve, for example, a valve whose opening degree can be adjusted based on a command from the control unit 80 (also referred to as an opening control valve) can be applied.

[0140] <<Under reduced pressure>>

[0141] Figure 6 : is a diagram schematically showing an example of the air flow in the chamber 10 under reduced pressure. When the exhaust unit 30 exhausts the gas in the chamber 10, the temperature of the gas in the chamber 10 drops sharply due to adiabatic expansion. The temperature of the gas in the chamber 10 can drop to, for example, about minus (-) 20 degrees Celsius. On the other hand, the temperature of the object (solid) in the chamber 10 also drops. For example, the temperature of the substrate 9 drops due to the absorption of the heat of vaporization accompanying the evaporation of the solvent of the coating film 90 and the heat exchange between the substrate 9 and the surrounding gas. In addition, for example, the temperature of the support pin 22, the support plate 21 and the drive shaft 23 drops due to the heat exchange with the surrounding gas. However, the temperature drop of these objects is not as large as the temperature drop of the gas caused by adiabatic expansion. For example, the temperature drop of the support pin 22, the support plate 21 and the drive shaft 23 is about a few degrees (for example, less than about 2 degrees). Therefore, the temperature of the support pin 22, the support plate 21 and the drive shaft 23 becomes, for example, about 23 degrees Celsius.

[0142] The gas is heated by heat exchange between the support pin 22, the support plate 21 and the drive shaft 23 and the gas. Therefore, an airflow is generated in the chamber 10. In particular, the drive shaft 23 extends in the up-down direction and has a wide width, so it is easy to generate an upward airflow G around the drive shaft 23. The temperature of the gas of the upward airflow G is very low compared to the temperature of the substrate 9. Therefore, when the upward airflow G is locally supplied to the second surface F2 (lower surface) of the substrate 9, the temperature difference between the area of ​​the substrate 9 to which the upward airflow G is supplied and the area to which the upward airflow G is not supplied becomes large, and the temperature distribution of the substrate 9 may become uneven.

[0143] In this embodiment, the support plate 21 has a shape in which the width increases as it goes upward. Figure 6 In the example of FIG. 2 , the side surfaces 21c on both sides of the support plate 21 are inclined so as to expand toward both outer sides of the support plate 21 as they approach the upper surface 21a. Therefore, the gas generated by the rising airflow G around the drive shaft 23 flows outward along the side surfaces 21c. That is, the gas generated by the rising airflow G flows in a direction closer to the horizontal direction just below the substrate 9.

[0144] Figure 7 and Figure 8 2 is a diagram showing an example of temperature distribution near the support plate 21 in the chamber 10 as a simulation result. Fig. 9 and Fig.10 It is a diagram showing an example of temperature distribution of a part of the substrate 9 in a plan view as a simulation result. Figure 7 and Fig. 9 The simulation results using the support plate 21 according to the embodiment are shown. Figure 8 and Fig.10 The simulation results using the support plate 21Z of the comparative example are shown. The support plate 21Z has a plate-like shape. The support plate 21Z has a substantially uniform width and a substantially rectangular cross-sectional shape. Fig. 9 and Fig.10 In FIG. 1 , in order to indicate the positions of the support plate 21 and the support plate 21Z, the support plate 21 and the support plate 21Z are indicated by solid lines.

[0145] exist Figure 7 and Figure 8 In the figure, contour lines T1 to T9 are shown. The smaller the number at the end of the symbol of contour lines T1 to T9, the lower the temperature. That is, contour line T1 has the lowest temperature, and contour line T9 has the highest temperature. The temperature difference between the contour lines is 5 degrees, and the area surrounded by contour line T1 represents the area with a temperature from -2 degrees Celsius to 0.5 degrees Celsius. Fig. 9 In FIG. 1 , contour lines T15 and T16 are shown. Fig.10 , contour lines T11 to T16 are shown. The smaller the number at the end of the symbol of contour lines T11 to T16, the lower the temperature. That is, the temperature of contour line T11 is the lowest, and the temperature of contour line T16 is the highest. The temperature difference between the contour lines is 0.2 degrees, and the area surrounded by contour line T11 represents the area with a temperature from 20 degrees Celsius to 20.2 degrees Celsius.

[0146] like Figure 8As shown, in the support plate 21Z, especially in the region R1, each of the contour lines T1 to T6 has a convex shape protruding toward the substrate 9 side more significantly near the drive shaft 23. The contour lines T7 to T9 in the region R1 also have a shape that is slightly expanded toward the substrate 9 side at approximately the same horizontal position as the convex shape of the contour lines T1 to T6. The reason for this is believed to be that the gas generated by the rising airflow G rises straight along the side of the drive shaft 23 and the support plate 21Z, and is supplied to the lower surface of the substrate 9. In other words, the reason is believed to be that the gas generated by the rising airflow G is locally supplied to the substrate 9 in the region on both sides relative to the drive shaft 23. Therefore, as Fig.10 As shown in the contour lines T11 to T14, the temperature of the areas on both sides of the substrate 9 corresponding to the drive shaft 23 is lower than the temperature of other areas. Fig.10 In the example shown in FIG. 1 , the temperature decreases particularly in the region near the contour line T11.

[0147] In contrast, Figure 7 As shown in FIG. 1 , in the support plate 21, in the region R1, each of the contour lines T1 to T6 does not have a convex shape that partially protrudes toward the substrate 9. Therefore, in the region R1, the contour lines T7 to T9 become more horizontal. This is because even if the gas generated by the rising airflow G rises straight along the drive shaft 23, its moving direction changes obliquely upward due to the side surface 21c of the support plate 21 (see also FIG. 1 ). Figure 6 ). Therefore, directly below the substrate 9, the cold gas generated by the rising airflow G flows in a direction closer to the horizontal direction and flows more extensively. Therefore, it is difficult to locally supply cold gas to the substrate 9. Fig. 9 As shown, the temperature drop in the regions of the substrate 9 corresponding to both sides of the drive shaft 23 can be suppressed. In other words, the uniformity of the temperature distribution of the substrate 9 can be improved. Fig. 9 In FIG. 1 , only the contour lines T15 and T16 are shown, and therefore it can be seen that the temperature distribution of the substrate 9 can be made uniform.

[0148] <<Bottom straightening plate 40>>

[0149] Reference Figure 1 The bottom straightening plate 40 is a plate for limiting the flow of gas in the internal space 10s when the chamber 10 is depressurized by the exhaust unit 30. For example, the bottom straightening plate 40 is arranged between the substrate 9 supported by the support unit 20 and the bottom plate 11 of the chamber 10. The bottom straightening plate 40 is fixed to the bottom plate 11 of the chamber 10 via a plurality of pillars (not shown), for example.

[0150] The bottom straightening plate 40 is provided between the support plate 21 and the bottom plate portion 11, and the drive shaft 23 passes through the through hole 40h formed in the bottom straightening plate 40 and penetrates the bottom straightening plate 40. When the support plate 21 is located at the descending position H1, the lower end (i.e., the lower surface 21b) of the support plate 21 is located above the upper surface of the bottom straightening plate 40. Therefore, the drive shaft 23 protrudes further upward than the bottom straightening plate 40. The space between the drive shafts 23 that are adjacent to each other in the arrangement direction of the support plates 21 and located above the bottom straightening plate 40 is communicated with the lower surface of the substrate 9 through the space between the adjacent support plates 21. In this structure, an ascending airflow G is generated around the portion of the drive shaft 23 that is above the bottom straightening plate 40. In the present embodiment, as described above, the gas generated by the ascending airflow G moves obliquely upward through the support plate 21, so that the temperature distribution of the substrate 9 can be made more uniform.

[0151] <<Side fairing 50>>

[0152] The side rectifying plates 50 are plates used together with the bottom rectifying plates 40 to restrict the flow of gas in the internal space 10s when the chamber 10 is depressurized by the exhaust portion 30. For example, the side rectifying plates 50 are arranged between the substrate 9 supported by the support portion 20 arranged at the lowered position H1 and the side wall portion 12 of the chamber 10. Here, for example, four side rectifying plates 50 are arranged so as to surround the periphery of the substrate 9 supported by the support portion 20.

[0153] Here, for example, when the pressure in the chamber 10 is reduced by the exhaust unit 30, the gas in the internal space 10s of the chamber 10 is discharged to the outside of the chamber 10 through the space between the side rectifying plate 50 and the side wall portion 12, the space between the bottom rectifying plate 40 and the bottom plate portion 11, and the exhaust ports 16a, 16b, 16c, and 16d in the order described above. In this way, for example, the gas flows in the space away from the substrate 9, and it is difficult to form an airflow near the substrate 9. In addition, it is difficult to generate a concentrated airflow around the peripheral portion of the substrate 9. As a result, for example, it is possible to suppress the occurrence of uneven drying of the coating film 90 formed on the upper surface of the substrate 9.

[0154] <<Air supply unit 60>>

[0155] The gas supply unit 60 is a part that performs the operation of supplying gas into the chamber 10 (also referred to as gas supply). Figure 1As shown, the bottom plate portion 11 of the chamber 10 is provided with, for example, an air supply port 16f. The air supply port 16f is, for example, located below the bottom face rectifying plate 40. The air supply portion 60 includes an air supply pipe 61 connected to the air supply port 16f, an air supply valve Vf, and an air supply source 62. For example, one end of the air supply pipe 61 is connected to the air supply port 16f. For example, the other end of the air supply pipe 61 is connected to the air supply source 62. For example, the air supply valve Vf is provided on the path of the air supply pipe 61.

[0156] Here, for example, when the gas supply valve Vf is opened, gas is supplied from the gas supply source 62 to the internal space 10s of the chamber 10 via the gas supply pipe 61 and the gas supply port 16f. As a result, the gas pressure in the chamber 10 can be increased. The gas supplied from the gas supply source 62 can be, for example, an inert gas such as nitrogen or clean dry air. The clean dry air can be prepared by, for example, purifying the air in a general environment to remove particles and moisture.

[0157] <<Pressure gauge 70>>

[0158] The pressure gauge 70 is a sensor for measuring the air pressure of the internal space 10s of the chamber 10. Figure 1 As shown, for example, the pressure gauge 70 is installed in a part of the chamber 10. The pressure gauge 70 can measure the pressure of the internal space 10s of the chamber 10, for example, and output the measurement result to the control unit 80.

[0159] <<Control unit 80>>

[0160] The control unit 80 is a unit for controlling the operation of each part of the reduced pressure drying device 1. For example, the control unit 80 can control the exhaust unit 30, the air supply unit 60, and the lifting unit 100. The control unit 80 includes, for example, a computer having a processor 801 such as a central processing unit (CPU), a memory 802 such as a random access memory (RAM), and a storage unit 803 such as a hard disk drive. In the storage unit 803, for example, a computer program (also referred to as a program) 803p and various data for performing a process (also referred to as a reduced pressure drying process) of drying the coating film 90 on the substrate 9 by reducing pressure in the reduced pressure drying device 1 are stored. The storage unit 803, for example, stores the program 803p and has a function as a non-temporary storage medium that can be read by a computer. The control unit 80, for example, reads the program 803p and data from the storage unit 803 to the memory 802, and performs arithmetic processing according to the program 803p and data in the processor 801, thereby controlling the operation of each part of the reduced pressure drying device 1. Therefore, for example, the program 803 p can execute the reduced-pressure drying process by being executed by the processor 801 included in the control unit 80 in the reduced-pressure drying apparatus 1 .

[0161] In addition, the control unit 80 may be connected to, for example, an input unit 804, an output unit 805, a communication unit 806, and a driver 807. The input unit 804 is, for example, a part that inputs various signals to the control unit 80 in response to the user's actions. The input unit 804 may include, for example, an operation unit that inputs signals corresponding to the user's operations, a microphone that inputs signals corresponding to the user's voice, and various sensors that input signals corresponding to the user's movements. The output unit 805 is, for example, a part that outputs various information in an embodiment that the user can recognize. The output unit 805 may include, for example, a display unit, a projector, and a speaker. The display unit may also be a touch screen integrated with the input unit 804. The communication unit 806 is, for example, a part that sends and receives various information to and from an external device such as a server through a wired or wireless communication component. For example, a program 803p received from an external device through the communication unit 806 may also be stored in the storage unit 803. The driver 807 is, for example, a part that can load and unload a removable storage medium 807m such as a magnetic disk or an optical disk. The driver 807, for example, performs data transmission between the storage medium 807m and the control unit 80 when the storage medium 807m is installed. For example, the storage medium 807m storing the program 803p may be installed in the driver 807, and the program 803p may be read from the storage medium 807m and stored in the storage unit 803. Here, the storage medium 807m, for example, stores the program 803p and serves as a non-temporary storage medium that can be read by a computer.

[0162] <2. Reduced pressure drying treatment>

[0163] Next, the reduced pressure drying treatment of the substrate 9 using the reduced pressure drying device 1 is summarized. First, the substrate 9 is carried into the chamber 10. At this time, the substrate 9 is in a state where an undried coating film 90 is formed on the first surface F1 (upper surface) of the substrate 9. For example, the gate part 15 opens the loading and unloading port 14 under the control of the control part 80, and the transport robot (not shown) carries the substrate 9 on the fork-shaped manipulator and carries the substrate 9 into the internal space 10s of the chamber 10 through the loading and unloading port 14 of the chamber 10. At this time point, the support part 20 is, for example, configured in the descending position H1. The transport robot, for example, carries the substrate 9 on the support part 20 while inserting the fork-shaped manipulator between the plurality of support plates 21 of the support part 20, and then retreats the fork to the outside of the chamber 10. Then, the gate part 15 closes the loading and unloading port 14 under the control of the control part 80. Thus, the substrate 9 is supported by the plurality of support pins 22.

[0164] Next, the reduced pressure drying device 1 exhausts the gas in the chamber 10. Specifically, the control unit 80 causes the exhaust unit 30 to exhaust the gas in the chamber 10. The control unit 80 causes the exhaust unit 30 to reduce the pressure in the chamber 10 so that the pressure in the chamber 10 becomes the target pressure. During the decompression, for example, the control unit 80 can appropriately raise and lower the support unit 20, and can also appropriately control the opening and closing states of each of the plurality of individual valves Va, Vb, Vc, and Vd, and can also appropriately control the opening degree of the main valve Ve.

[0165] By reducing the pressure in the chamber 10, the temperature of the gas in the chamber 10 decreases. In addition, by reducing the pressure, the solvent in the coating film 90 evaporates, and the coating film 90 is dried. The degree of evaporation of the solvent also depends on the temperature of the coating film 90. In this embodiment, as described above, the uneven temperature distribution of the substrate 9 caused by the rising airflow G under reduced pressure can be suppressed. In other words, the temperature distribution of the substrate 9 can be made more uniform. Therefore, the coating film 90 can be dried while suppressing the uneven drying. That is, the reduced pressure drying device 1 can dry the coating film 90 more uniformly.

[0166] Next, the control unit 80 opens the gas supply valve Vf, thereby supplying gas from the gas supply source 62 through the gas supply pipe 61 and the gas supply port 16f to the internal space 10s of the chamber 10. As a result, the gas pressure in the chamber 10 rises to the atmospheric pressure again.

[0167] Then, for example, the substrate 9 is finally carried out of the chamber 10. First, the gate unit 15 opens the loading / unloading port 14 under the control of the control unit 80, and the transport robot (not shown) carries the dried substrate 9 placed on the support unit 20 out of the chamber 10 through the loading / unloading port 14 of the chamber 10. In this way, the reduced pressure drying process for one substrate 9 can be completed.

[0168] As described above, the reduced pressure drying device 1 can perform reduced pressure drying treatment on the substrate 9. In the reduced pressure drying device 1, the width of the upper part of the support plate 21 is wider than the width of the lower part. Accordingly, under the reduced pressure of the chamber 10, the gas generated by the rising airflow G passes through the support plate 21 and moves obliquely upward. Therefore, the cold gas generated by the rising airflow G moves in a direction closer to the horizontal direction directly below the substrate 9, and it is difficult to be locally supplied to the second surface F2 (lower surface) of the substrate 9. Therefore, the unevenness of the temperature distribution of the substrate 9 caused by the rising airflow G can be suppressed. In other words, the temperature distribution of the substrate 9 can be made more uniform.

[0169] In the above-described specific example, the support plate 21 includes a portion whose width continuously increases upward. Therefore, the gas generated by the ascending airflow G can be moved more smoothly in a direction close to the horizontal direction.

[0170] <<Shape of support plate>>

[0171] Fig.11 2 is a diagram schematically showing the structure of a first modified example of the support plate 21. Fig.11 In the example of , the upper surface 21a of the support plate 21 is also a horizontal plane, and the support plate 21 has a portion whose width continuously widens as it goes upward. In other words, the support plate 21 has a portion whose width monotonically widens as it goes upward. Fig.11 In the example, the side 21c has a curved surface 21ca and a plane 21cb. The lower edge of the curved surface 21ca of the side 21c is connected to the end edge of the lower surface 21b and is bent into a roughly circular arc shape. The two curved surfaces 21ca are bent in an expanding manner toward the outside and toward the bottom in a manner that the interval between the two side surfaces 21c (i.e., the width of the support plate 21) gradually expands as it goes upward. The upper edge of the curved surface 21ca of the side 21c is connected to the lower edge of the plane 21cb. The plane 21cb is a plane along the up and down direction, and the upper edge of the plane 21cb is connected to the end edge of the upper surface 21a. The interval between the planes 21cb of the two side surfaces 21c (i.e., the width of the support plate 21) is roughly constant.

[0172] The width of the support plate 21 is continuously widened as it goes upward on the curved surface 21ca. Therefore, the gas generated by the rising airflow G flows upward and outward obliquely upward through the side surface 21c. Figure 6 Similarly, the support plate 21 can make the temperature distribution of the substrate 9 under reduced pressure more uniform.

[0173] Fig.12 2 is a diagram schematically showing the structure of a second modified example of the support plate 21. Fig.12 In the example of FIG. 2 , the support plate 21 includes a first member 211 and a second member 212. Here, the first member 211 and the second member 212 are independent of each other. The first member 211 and the second member 212 may be formed of the same material or different materials.

[0174] The first member 211 has a strip shape with the horizontal direction perpendicular to the arrangement direction of the support plates 21 as the long side direction. Fig.12 In the example, the shape of the first member 211 in the cross section perpendicular to the long side direction is a substantially rectangular shape. The first member 211 may also have the same shape in the long side direction. That is, the first member 211 may also have the same shape in any cross section at different positions in the long side direction. The lower surface 21b of the support plate 21 is equivalent to the lower surface of the first member 211. The upper end of the drive shaft 23 is fixed to the lower surface of the first member 211.

[0175] The second member 212 is fixed to the upper surface of the first member 211. The second member 212 can be fixed to the first member 211 by any fixing method. As for the fixing method, for example, fixing methods such as screwing and bonding can be applied. The second member 212 has a plate-like shape. The second member 212 is fixed to the upper surface of the first member 211 with its thickness direction along the up-down direction. The second member 212 may also have the same shape in the long side direction. The upper surface 21a of the support plate 21 is equivalent to the upper surface of the second member 212. The lower end of the support pin 22 can be fixed to the upper surface of the second member 212.

[0176] The width of the second member 212 in the short side direction is wider than the width of the first member 211 in the short side direction. The second member 212 protrudes from the first member 211 to both sides. The side surface 21c of the support plate 21 corresponds to the entire side surface of the first member 211 and the second member 212. Fig.12 In the example of FIG. 1 , the support plate 21 includes a portion whose width gradually increases upward.

[0177] With such a support plate 21, the gas generated by the ascending airflow G also flows upward and obliquely upward toward the outside through the side surface 21c of the support plate 21. Therefore, the temperature distribution of the substrate 9 can be made more uniform.

[0178] Fig.13 2 is a diagram schematically showing the structure of a third modified example of the support plate 21. Fig.13 In the example, also with Fig.12 The support plate 21 includes a first member 211 and a second member 212. Fig.12 Unlike the example of , the first member 211 has a shape in which the width thereof continuously widens as it goes upward. Fig.13 In the example, the first member 211 has an inverted isosceles trapezoidal shape.

[0179] With such a support plate 21, the rising airflow G also flows upward and obliquely upward toward the outside through the side surface 21c. Therefore, the temperature distribution of the substrate 9 can be made more uniform.

[0180] Fig.14 2 is a diagram schematically showing the structure of a fourth modified example of the support plate 21. Fig.14 In the example, also with Fig.12 The support plate 21 includes a first member 211 and a second member 212. Fig.12 Unlike the example of , the first member 211 has a shape in which the width thereof continuously widens as it goes upward. Fig.14In the example, the first member 211 has an inverted triangle shape obtained by inverting a substantially isosceles triangle up and down. In addition, the second member 212 has an umbrella shape. Specifically, the second member 212 includes a flat portion 213 and a pair of umbrella portions 214. The flat portion 213 has a flat plate shape and is fixed to the upper surface of the first member 211 with its thickness direction along the up-down direction. One of the umbrella portions 214 extends from one of the ends of the short side direction of the flat portion 213 along the outside and along the oblique downward direction below. The other umbrella portion 214 extends from the other end of the flat portion 213 along the outside and along the oblique downward direction below. In addition, it is sufficient as long as the lower surface of the umbrella portion 214 extends from the end of the flat portion 213 to the outside and to the oblique downward direction below.

[0181] In this support plate 21, at a position lower than the umbrella portion 214, the width of the first member 211 gradually widens as it moves upward. In addition, the width of the umbrella portion 214 of the support plate 21 is wider than the width of the first member 211. That is, this support plate 21 also has a portion whose width at the top is wider than the width at the bottom. The gas generated by the rising airflow G flows obliquely upward along the side of the first member 211 of the support plate 21, and at the same time touches the lower surface of the umbrella portion 214 and further moves upward, and flows to the outside while moving away from the substrate 9. Therefore, it is more difficult for cold air to approach the substrate 9, and the unevenness of the temperature distribution of the substrate 9 caused by the rising airflow can be further suppressed. In other words, the temperature distribution of the substrate 9 can be made more uniform.

[0182] <<Shape of the second member>>

[0183] In the example, the support plate 21 has the same shape in the long side direction. However, this is not necessarily the case. The rising airflow G is mainly generated around the drive shaft 23, so it is sufficient as long as the support plate 21 includes a portion whose width becomes wider just above the drive shaft 23. That is, it is sufficient as long as the support plate 21 includes a portion whose width becomes wider as it goes upward in the first section that includes the drive shaft 23 and is orthogonal to the long side direction of the support plate 21. Conversely, the support plate 21 may also have a shape different from the first section in the second section that does not include the drive shaft 23 and is orthogonal to the long side direction.

[0184] Fig.15 2 is a cross-sectional view schematically showing the structure of a fifth modified example of the support plate 21. Fig.15 In the embodiment, the support plate 21 and Figure 12 to Figure 14 Similarly, it includes a first component 211 and a second component 212. Fig.15 In the example of , a plurality of (here, two) drive shafts 23 are also provided on each support plate 21. The two drive shafts 23 are arranged in the longitudinal direction (corresponding to the predetermined direction) of the support plate 21 and extend downward from the support plate 21.

[0185] exist Fig.15 In the example of , each support plate 21 includes two second members 212 corresponding to the two drive shafts 23. Each second member 212 is disposed in a region overlapping with the drive shaft 23 when viewed in a plan view. That is, the second member 212 is disposed directly above the corresponding drive shaft 23. The width of the second member 212 in the short side direction of the support plate 21 is wider than the width of the first member 211 in the short side direction. Fig.15 In the example of FIG. 2 , the second member 212 has a circular shape in a plan view, and the diameter of the second member 212 is larger than the width of the first member 211. Therefore, the second member 212 protrudes outward from both sides of the first member 211.

[0186] The second member 212 can be Fig.12 and Fig.13 It also has a flat plate shape and can be used with Fig.14 Also, the cross section of the first member 211 may be similar to Figure 12 to Figure 14 Likewise, the shape has a rectangular shape, an inverted isosceles trapezoidal shape, or an inverted triangle shape.

[0187] Each second member 212 is provided only near the corresponding drive shaft 23, and is not provided in the region between the two drive shafts 23 in each support plate 21. In other words, in each support plate 21, the second member 212 is provided avoiding a portion of the region between the drive shafts 23. For example, the second member 212 is provided avoiding more than half of the region between the drive shafts 23.

[0188] Through such a support plate 21, the gas generated by the rising airflow G generated around the driving shaft 23 also contacts the second member 212, so that the gas can flow in a direction closer to the horizontal direction. Therefore, the temperature distribution of the substrate 9 can be made more uniform. In addition, the second member 212 is only provided near the driving shaft 23, so the material cost of the second member 212 can be reduced, thereby reducing the manufacturing cost of the support plate 21.

[0189] <<Fixing pin>>

[0190] Fig.16 2 is a diagram schematically showing a structure of a modified example of the support portion 20. Fig.16 The chamber 10 and the substrate 9 are also shown in the figure. In order to avoid complicating the drawings, the illustration of other structures is omitted.

[0191] The support portion 20 includes a plurality of fixing pins 25. The fixing pins 25 are fixed in the chamber 10. The fixing pins 25 are non-driven pins and are substantially fixed so as not to move. For example, the lower ends of the fixing pins 25 are fixed to the bottom plate 11 of the chamber 10. The plurality of fixing pins 25 are arranged, for example, in a matrix shape when viewed in a plane. The support portion 20 can support the substrate 9 in a horizontal position by abutting the second surface F2 (lower surface) of the substrate 9 against the front ends of the plurality of fixing pins 25.

[0192] Each fixing pin 25 includes a pin contact portion 26, a wide portion 27, and a base end portion 28. The base end portion 28 has a rod-like shape extending in the vertical direction. As a more specific example, the base end portion 28 has a substantially cylindrical shape with a central axis along the vertical direction. The lower end of the base end portion 28 is fixed to the bottom plate portion 11 of the chamber 10, for example.

[0193] The wide portion 27 is fixed to the upper end of the base end portion 28. The wide portion 27 includes a portion whose upper width is wider than that of the lower width. Fig.16 In the example, the wide portion 27 has a shape whose width continuously widens as it goes upward. As a more specific example, the wide portion 27 has an inverted frustum-shaped shape obtained by inverting a frustum upside down. As a further specific example, the wide portion 27 has an inverted circular frustum-shaped shape obtained by inverting a substantially circular frustum upside down. The width (e.g., maximum diameter) of the wide portion 27 is wider than the width (e.g., diameter) of the base end portion 28, and may be, for example, more than 1.5 times, or more than 2 times the width of the base end portion 28.

[0194] The pin contact portion 26 is fixed to the upper surface of the wide portion 27. The pin contact portion 26 has a rod-like shape extending in the up-down direction. As a more specific example, the pin contact portion 26 has a substantially cylindrical shape with the central axis extending in the up-down direction. The width (e.g., diameter) of the pin contact portion 26 is the same as the width (e.g., diameter) of the base end portion 28, or is narrower than the width of the base end portion 28. The front end portion of the pin contact portion 26 may also have a pointed tapered shape whose width narrows as it goes upward. The fixing pin 25 supports the substrate 9 by the front end of the pin contact portion 26 contacting the second surface F2 (lower surface) of the substrate 9.

[0195] As mentioned above, in Fig.16 In the example of FIG. 2 , a single pin contact portion 26 and a single base end portion 28 are fixed to the wide portion 27 , and the fixing pin 25 has a rod-like shape extending in the up-down direction as a whole.

[0196] exist Fig.16In the example of , although the bottom straightening plate 40 and the side straightening plate 50 are omitted from the illustration, the bottom straightening plate 40 and the side straightening plate 50 may also be provided. In this case, the fixing pin 25 may also pass through the bottom straightening plate 40. Alternatively, the lower end of the fixing pin 25 may also be fixed to the bottom straightening plate 40 instead of the bottom plate portion 11 of the chamber 10. In any embodiment, the lower end of the wide portion 27 of the fixing pin 25 is located above the upper surface of the bottom straightening plate 40, and at least a portion of the base end portion 28 protrudes upward from the bottom straightening plate 40. Therefore, the space between the bottom straightening plate 40 and the base end portion 28 is connected to the lower surface of the substrate 9 through the space between the wide portions 27.

[0197] Thus, under reduced pressure, as described above, the temperature in the chamber 10 drops significantly, while the temperature drop of the fixing pin 25 is smaller than that of the gas. Therefore, an upward airflow G is generated around the fixing pin 25. The gas generated by the upward airflow G flows obliquely upward in a direction close to the horizontal direction through the wide portion 27. Therefore, the temperature distribution of the substrate 9 can be made more uniform.

[0198] As described above, the reduced pressure drying device 1 is described in detail, but the description is illustrative in all aspects, and the disclosure is not limited to this. In addition, the various modifications described above can be combined and applied as long as they are not contradictory. Moreover, it can be understood that multiple modifications not illustrated can be assumed without departing from the scope of the disclosure.

[0199] For example, in the above-mentioned embodiment, the chamber 10 has four exhaust ports 16a, 16b, 16c, and 16d, but the present invention is not limited thereto. For example, the number of exhaust ports in the chamber 10 may be any one from one to three and five or more. In addition, for example, there may be no separate valve Va, separate valve Vb, separate valve Vc, and separate valve Vd.

[0200] In the above-described embodiment, the reduced pressure drying device 1 dries the coating film 90 on the substrate 9 by reducing pressure, but the present invention is not limited thereto. For example, the reduced pressure drying device 1 may dry the coating film 90 on the substrate 9 by reducing pressure and heating.

[0201] In one embodiment, a loading and unloading port 14 for the substrate 9 is provided on the side wall portion 12 of the chamber 10, but the invention is not limited thereto. For example, a structure in which the four side wall portions 12 and the top plate portion 13 of the chamber 10 form an integral cover portion, and the cover portion can be separated from the bottom plate portion 11 and retreat upward. In this case, for example, the cover portion can also be moved up and down by an opening and closing drive portion 16 or the like. Moreover, the chamber 10 can be selectively set to a state in which the cover portion contacts the bottom plate portion 11 via a sealing material such as an O-ring and the internal space 10s is sealed (a closed state), and a state in which the cover portion is separated from the bottom plate portion 11 upward and the internal space 10s is opened (an open state). Here, if the chamber 10 is in an open state, the substrate 9 can be loaded into the internal space 10s of the chamber 10 and the substrate 9 can be unloaded from the internal space 10s of the chamber 10. When the chamber 10 is in a closed state, the coating film 90 on the substrate 9 can be dried by reducing the pressure through exhaust from the internal space 10 s and supply of gas to the internal space 10 s.

[0202] In the above-described embodiment, for example, the bottom straightening plate 40 and the side straightening plate 50 may be omitted.

[0203] In the above-described embodiment, for example, various operations in the reduced-pressure drying apparatus 1 may be started or ended in response to, for example, an operation of the user on the input unit 804 or a signal input from an external device to the communication unit 806 .

[0204] In the above-described embodiment, for example, at least a part of the functional configuration implemented in the control unit 80 may include hardware such as a dedicated electronic circuit.

Claims

1. A reduced pressure drying device for drying a coating film formed on an upper surface of a substrate, the reduced pressure drying device comprising: a chamber for accommodating the substrate; A wide portion, disposed in the chamber and including a portion whose upper width is wider than its lower width; A pin contact portion extending upward from the wide portion and contacting the lower surface of the substrate; a narrow width portion extending downward from the wide width portion and having a width narrower than that of the wide width portion; an exhaust part for exhausting the gas in the chamber; as well as a lifting part for lifting the narrow width part, The wide portion includes a portion whose width increases as it goes upward. The plurality of wide width portions include a plurality of support plates arranged in a first predetermined direction, A plurality of the pin abutment portions are vertically arranged on the upper surface of the support plate. The exhaust portion exhausts gas in the chamber in a state in which the pin abutting portion abuts against the lower surface of the substrate.

2. The reduced pressure drying device according to claim 1, wherein: The wide portion includes a portion whose width continuously increases upward.

3. The reduced pressure drying device according to claim 1 or 2, wherein: The wide portion includes a portion whose width gradually increases upward.

4. The reduced pressure drying device according to claim 1 or 2, wherein: The wide width portion comprises: A first component is provided in the support plate; and A pair of umbrella parts extend obliquely downward from both sides of the first member.

5. The reduced pressure drying device according to claim 1 or 2, wherein: The plurality of narrow width portions are arranged in a second predetermined direction and extend downward from the support plate of the wide width portion. The support plate of the wide portion includes: a first member extending along the second prescribed direction; as well as The plurality of second members are provided in regions overlapping the narrow width portions, avoiding a portion of the region between the narrow width portions in a plan view, and have a width wider than that of the first member.

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