Intelligent Power Module

Abstract

The present invention discloses an intelligent power module, comprising: a plastic package, a first substrate, a second substrate, a frame, a power chip, a driving chip and a conductive member, wherein the first substrate and the second substrate are both arranged in the plastic package, a side surface of the first substrate away from the second substrate is flush with a side surface of the plastic package in the thickness direction, and a side surface of the second substrate away from the first substrate is flush with another side surface of the plastic package in the thickness direction; the frame is arranged between the first substrate and the second substrate, and the frame comprises a base island, a control pin and a power pin; the power chip is arranged on a side of the first substrate adjacent to the base island; the driving chip is arranged on a side of the base island adjacent to the first substrate; the conductive member is arranged between the base island and the power pin, the conductive member is electrically connected to the power chip through a first lead, and the conductive member is electrically connected to the driving chip through a second lead. According to the intelligent power module of the present invention, the heat dissipation efficiency and reliability of the intelligent power module are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of power modules, and in particular to an intelligent power module. Background Art

[0002] In the related art, in order to facilitate the electrical connection between the driver chip and the power chip, the driver chip and the power chip are usually arranged on the same side, and single-sided heat dissipation is adopted, that is, heat dissipation is performed by setting a circuit board for the power chip, resulting in poor heat dissipation effect of the intelligent power module. Heat will accumulate in the plastic package of the intelligent power module, which will affect the electrical performance of the driver chip and the power chip, and further cause failure of the intelligent power module, poor stability and other phenomena. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide an intelligent power module, which can reduce the mutual interference between the power chip and the driver chip while improving the heat dissipation efficiency of the intelligent power module, thereby improving the reliability of the intelligent power module.

[0004] According to an embodiment of the present invention, an intelligent power module comprises: a plastic package; a first substrate and a second substrate, wherein the first substrate and the second substrate are both arranged in the plastic package, and the first substrate and the second substrate are respectively arranged on both sides of the plastic package in a thickness direction, a surface of the first substrate on one side away from the second substrate is flush with a surface of the plastic package in a thickness direction, and a surface of the second substrate on one side away from the first substrate is flush with a surface of the plastic package in another thickness direction; a frame, wherein the frame is arranged between the first substrate and the second substrate, and the frame comprises a base island, a control pin and a power pin, wherein the base island is arranged in the plastic package, the base island and the first substrate are spaced apart along a length direction of the plastic package, and the base island is connected to the second substrate, and one end of the control pin and one end of the power pin both extend into the plastic package; a power chip, wherein the power chip is arranged in the first The power chip is electrically connected to the power pin on the side of the substrate adjacent to the base island; a driving chip is arranged on the side of the base island adjacent to the first substrate, and the driving chip is electrically connected to the control pin; a conductive member is arranged between the base island and the power pin, one end of the conductive member is connected to the first substrate, the conductive member is electrically connected to the power chip through a first lead, and the conductive member is electrically connected to the driving chip through a second lead; wherein the conductive member includes: a first conductive segment, the first conductive segment extends along the width direction of the plastic package, and the second lead is connected to the first conductive segment; a second conductive segment, one end of the second conductive segment is connected to the first conductive segment; a third conductive segment, the third conductive segment is connected to the other end of the second conductive segment, the third conductive segment extends along the width direction of the plastic package, and the third conductive segment is connected to the first substrate.

[0005] According to the intelligent power module implemented by the present invention, a first substrate and a second substrate are respectively arranged on both sides of the frame in the thickness direction, a conductive member is arranged between the base island and the power pin, the conductive member is electrically connected to the power chip through the first lead, and the conductive member is electrically connected to the driver chip through the second lead. Thus, while improving the heat dissipation efficiency of the intelligent power module, the mutual interference between the power chip and the driver chip can be reduced, and the reliability of the intelligent power module is improved.

[0006] According to some embodiments of the present invention, the second substrate includes: a heat dissipation body; a first insulating layer, wherein the first insulating layer is arranged between the base island and the heat dissipation body, and the width of the first insulating layer in the width direction of the plastic package body is greater than or equal to the width of the base island.

[0007] According to some embodiments of the present invention, the heat dissipation body includes: a first heat dissipation layer, a portion of the first heat dissipation layer protrudes toward the first substrate to form a protrusion, the protrusion is opposite to the base island in the thickness direction of the plastic package body, and the first insulating layer is provided between the protrusion and the base island.

[0008] According to some embodiments of the present invention, the first heat dissipation layer includes a first sub-heat dissipation layer and a second sub-heat dissipation layer, the first sub-heat dissipation layer and the second sub-heat dissipation layer are spaced apart along the width direction of the plastic package body, and the first sub-heat dissipation layer has the protrusion.

[0009] According to some embodiments of the present invention, the heat dissipation body further includes: a second insulating layer, which is arranged on a side of the first heat dissipation layer away from the first substrate; and a second heat dissipation layer, which is arranged on a side of the second insulating layer away from the first substrate.

[0010] According to some embodiments of the present invention, in the width direction of the plastic package, one end of the second substrate extends at least to the control pin, and the other end of the second substrate extends at least to the power pin.

[0011] According to some embodiments of the present invention, the conductive member includes: the second conductive segment extending obliquely toward the first substrate; and the length of the third conductive segment in the width direction of the plastic package body is less than or equal to the length of the first conductive segment.

[0012] According to some embodiments of the present invention, in the thickness direction of the plastic package body, a surface of the first conductive segment facing the first substrate is flush with a surface of the base island facing the first substrate.

[0013] According to some embodiments of the present invention, the first conductive segment includes a first sub-segment and a second sub-segment connected to each other, the second sub-segment is connected to the second conductive segment, and at least one side of the first sub-segment protrudes from the second sub-segment in the length direction of the plastic package body.

[0014] According to some embodiments of the present invention, each of the control pins includes a first pin segment and a second pin segment connected to each other, the second pin segment is located on a side of the first pin segment away from the first substrate, the first pin segment is located inside the plastic package, and the second pin segment is located outside the plastic package; each of the power pins includes a third pin segment and a fourth pin segment connected to each other, the fourth pin segment is located on a side of the third pin segment away from the first substrate, the third pin segment is located inside the plastic package, and the fourth pin segment is located outside the plastic package; wherein, in the thickness direction of the plastic package, a side surface of the first pin segment adjacent to the second substrate, a side surface of the third pin segment adjacent to the second substrate, a side surface of the base island adjacent to the second substrate, and a side surface of the first conductive segment adjacent to the second substrate are flush.

[0015] According to some embodiments of the present invention, the first substrate includes a plurality of functional areas and a plurality of connection areas, the plurality of functional areas and the plurality of connection areas are spaced apart along the length direction of the plastic package, the functional areas and the connection areas are spaced apart along the width direction of the plastic package, the power chip is arranged in the functional area, the one end of the conductive member is connected to the connection area, the two ends of the first lead are respectively connected to the connection area and the power chip, and the conductive member and the power chip are electrically connected through the connection area and the first lead.

[0016] According to some embodiments of the present invention, the multiple connection areas include a high-voltage connection area and a low-voltage connection area, and the length of the high-voltage connection area in the length direction of the plastic package body is smaller than the length of the low-voltage connection area; and / or the width of the high-voltage connection area in the width direction of the plastic package body is greater than the length of the low-voltage connection area.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0019] Figure 1 is a schematic diagram of a first substrate of an intelligent power module according to an embodiment of the present invention;

[0020] Figure 2 is a schematic diagram of a second substrate of an intelligent power module according to an embodiment of the present invention;

[0021] Figure 3 is a schematic diagram of a first substrate, a frame and a conductive member of an intelligent power module according to an embodiment of the present invention;

[0022] Figure 4 is a schematic diagram of a second substrate, a frame and a conductive member of an intelligent power module according to an embodiment of the present invention;

[0023] Figure 5 is a schematic diagram of a first substrate, a frame, a power chip and a conductive member of an intelligent power module according to an embodiment of the present invention;

[0024] Figure 6 is a schematic diagram of an intelligent power module according to an embodiment of the present invention, wherein the plastic package is not shown;

[0025] Figure 7 yes Figure 6 The enlarged view of the A part shown in the middle circle;

[0026] Figure 8 is a schematic diagram of an intelligent power module according to an embodiment of the present invention from another angle, wherein the plastic package is not shown;

[0027] Fig. 9 is a schematic diagram of an intelligent power module according to an embodiment of the present invention.

[0028] Reference numerals:

[0029] 100: Intelligent power module;

[0030] 1: first substrate; 11: functional area; 111: low voltage functional area; 112: high voltage functional area; 12: connection area; 121: high voltage connection area; 122: low voltage connection area; 2: frame; 21: base island; 22: control pin; 221: first pin segment; 222: second pin segment; 23: power pin; 231: third pin segment; 232: fourth pin segment; 3: power chip; 31: high voltage power chip; 32: low voltage power chip; 4: drive Dynamic chip; 5: conductive part; 51: first conductive segment; 511: first sub-segment; 512: second sub-segment; 52: second conductive segment; 53: third conductive segment; 6: first lead; 7: second lead; 8: plastic package; 9: second substrate; 91: heat dissipation body; 911: first heat dissipation layer; 912: protrusion; 913: first sub-heat dissipation segment; 914: second sub-heat dissipation segment; 915: second insulating layer; 916: second heat dissipation layer; 92: first insulating layer. DETAILED DESCRIPTION

[0031] Reference below Figure 1-Figure 9 An intelligent power module 100 according to an embodiment of the present invention is described.

[0032] like Figure 1-Figure 9As shown, the intelligent power module 100 according to the embodiment of the present invention includes a plastic package 8, a first substrate 1, a second substrate 9, a frame 2, a power chip 3, a driving chip 4 and a conductive member 5.

[0033] Specifically, the first substrate 1 and the second substrate 9 are both disposed in the plastic package 8, and the first substrate 1 and the second substrate 9 are respectively located in the thickness direction of the plastic package 8 (for example, Fig. 9 On both sides of the first substrate 1 (in the up and down direction), the side surface of the first substrate 1 away from the second substrate 9 is flush with the side surface of the plastic package 8 in the thickness direction, and the side surface of the second substrate 9 away from the first substrate 1 is flush with the other side surface of the plastic package 8 in the thickness direction. The frame 2 is arranged between the first substrate 1 and the second substrate 9, and the frame 2 includes a base island 21, a control pin 22 and a power pin 23. The base island 21 is located in the plastic package 8, and one end of the control pin 22 and one end of the power pin 23 both extend into the plastic package 8. The power chip 3 is arranged on a side of the first substrate 1 adjacent to the base island 21, and the power chip 3 is electrically connected to the power pin 23. The drive chip 4 is arranged on a side of the base island 21 adjacent to the first substrate 1, and the drive chip 4 is electrically connected to the control pin 22.

[0034] For example, in Figure 3-Figure 9 In the example, the first substrate 1, the frame 2 and the second substrate 9 are arranged in sequence along the thickness direction of the plastic package 8. The driver chip 4 and the second substrate 9 are respectively located on both sides of the thickness direction of the base island 21, and one side surface of the second substrate 9 in the thickness direction (i.e., the side surface away from the base island 21) is exposed to the outside of the plastic package 8. The heat generated by the driver chip 4 during operation can be transferred to the outside of the plastic package 8 through the base island 21 and the second substrate 9, thereby achieving heat dissipation of the driver chip 4. The power chip 3 is located between the first substrate 1 and the frame 2, and one side surface of the first substrate 1 in the thickness direction (i.e., the side surface away from the power chip 3) is exposed to the outside of the plastic package 8. The heat generated by the power chip 3 during operation can be transferred to the outside of the plastic package 8 through the first substrate 1, thereby achieving heat dissipation of the power chip 3. In this way, the heat dissipation efficiency of the intelligent power module 100 can be improved, and heat accumulation in the plastic package 8 can be avoided, thereby preventing the intelligent power module 100 from short circuiting, breaking or leaking due to excessive temperature. At the same time, the flatness of the surface in the thickness direction of the intelligent power module 100 is ensured, thereby improving the regularity of the intelligent power module 100.

[0035] The conductive member 5 is disposed between the base island 21 and the power pin 23, one end of the conductive member 5 is connected to the first substrate 1, the conductive member 5 is electrically connected to the power chip 3 through the first lead 6, and the conductive member 5 is electrically connected to the driving chip 4 through the second lead 7. Figure 3-Figure 6, the conductive member 5 is fixed on the first substrate 1, the two ends of the first lead 6 are respectively connected to the conductive member 5 and the power chip 3, and the two ends of the second lead 7 are respectively connected to the conductive member 5 and the driving chip 4. Thus, the driving chip 4 and the power chip 3 are electrically connected through the first lead 6, the conductive member 5 and the second lead 7.

[0036] Among them, by setting a conductive member 5 between the base island 21 and the power pin 23, the distance between the first substrate 1 and the base island 21 can be increased, thereby increasing the distance between the driver chip 4 and the power chip 3, so that the heat generated by the driver chip 4 and the power chip 3 during operation can be dispersed and dissipated through the first substrate 1 and the second substrate 9, thereby reducing the heat transfer between the power chip 3 and the driver chip 4, thereby reducing the electromagnetic induction between the power chip 3 and the driver chip 4, and further reducing the mutual interference between the power chip 3 and the driver chip 4, thereby improving the reliability of the intelligent power module 100.

[0037] In addition, while increasing the distance between the first substrate 1 and the base island 21, the minimum distance between the conductive member 5 and the power pin 23 is reduced, so that the first substrate 1 can be designed as a small-sized substrate, which is conducive to the miniaturized design of the intelligent power module 100 and can reduce the cost of the intelligent power module 100.

[0038] According to the intelligent power module 100 implemented in the present invention, the first substrate 1 and the second substrate 9 are respectively arranged on both sides of the frame 2 in the thickness direction, and the conductive member 5 is arranged between the base island 21 and the power pin 23. The conductive member 5 is electrically connected to the power chip 3 through the first lead 6, and the conductive member 5 is electrically connected to the driving chip 4 through the second lead 7. Therefore, while improving the heat dissipation efficiency of the intelligent power module 100, the mutual interference between the power chip 3 and the driving chip 4 can be reduced, and the reliability of the intelligent power module 100 is improved.

[0039] According to some embodiments of the present invention, the second substrate 9 includes a heat dissipation body 91 and a first insulating layer 92, and the first insulating layer 92 is disposed between the base island 21 and the heat dissipation body 91. Figure 6 As shown, the first insulating layer 92 can separate the heat dissipation body 91 from the base island 21, and the first insulating layer 92 is disposed along the length direction of the plastic package body 8 (for example, Fig. 9 Since the base island 21 is usually a metal part, the first insulating layer 92 can prevent the current on the base island 21 from being transmitted to the heat dissipation body 91, thereby preventing the intelligent power module 100 from leaking electricity.

[0040] Reference Figure 6, the width of the first insulating layer 92 in the width direction of the plastic package 8 is greater than or equal to the width of the base island 21. In this way, the first insulating layer 92 can cover the base island 21 to prevent the base island 21 from contacting the heat dissipation body 91, thereby further preventing the intelligent power module 100 from leaking electricity and improving the safety of the intelligent power module 100.

[0041] Furthermore, the heat dissipation body 91 includes a first heat dissipation layer 911, a portion of the first heat dissipation layer 911 protrudes toward the first substrate 1 to form a protrusion 912, the protrusion 912 is opposite to the base island 21 in the thickness direction of the plastic package 8, and a first insulating layer 92 is provided between the protrusion 912 and the base island 21. Figure 6 and Figure 7 As shown, a protrusion 912 is provided at a position where the first heat dissipation layer 911 and the base island 21 are opposite in the thickness direction of the plastic package 8, and the first heat dissipation layer 911 is thick at one end and thin at the other end. Since the driver chip 4 is provided on the base island 21, the driver chip 4 will generate heat when the intelligent power module 100 is working, and the thicker protrusion 912 can receive as much heat of the driver chip 4 as possible, and then the heat is transferred to the outside through the heat dissipation body 91. In this way, the driver chip 4 can be quickly dissipated, and the heat can be prevented from accumulating at the base island 21, so that the temperature distribution of the intelligent power module 100 is uniform.

[0042] Furthermore, the first heat dissipation layer 911 includes a first sub-heat dissipation layer and a second sub-heat dissipation layer, and the first sub-heat dissipation layer and the second sub-heat dissipation layer are connected along the width direction of the plastic package body 8 (for example, Fig. 9 The first sub-heat dissipation layer is spaced apart from the driver chip 4 (in the front-to-back direction), and the first sub-heat dissipation layer has a protrusion 912. Since the first sub-heat dissipation layer is opposite to the driver chip 4, and the second sub-heat dissipation layer is opposite to the power chip 3, the first sub-heat dissipation layer and the second sub-heat dissipation layer are spaced apart, so that the current between the driver chip 4 and the power chip 3 is prevented from being transmitted through the first heat dissipation layer 911, and the driver chip 4 and the power chip 3 can work normally.

[0043] According to some specific embodiments of the present invention, Figure 6 and Figure 7As shown, the heat dissipation body 91 also includes a second insulating layer 915 and a second heat dissipation layer 916. The second insulating layer 915 is arranged on the side of the first heat dissipation layer 911 away from the first substrate 1, and the second heat dissipation layer 916 is arranged on the side of the second insulating layer 915 away from the first substrate 1. For example, the second substrate 9 can be a DBC (i.e., ceramic copper clad board) board, the first heat dissipation layer 911 can be a first copper layer, the second heat dissipation layer 916 can be a second copper layer, and the second insulating layer 915 is a ceramic layer. In this case, the second substrate 9 is a three-layer structure. The second insulating layer 915 prevents current from being transmitted between the first heat dissipation layer 911 and the second heat dissipation layer 916, thereby preventing the intelligent power module 100 from dew point. Among them, the second heat dissipation layer 916 is exposed outside the plastic package 8 to transfer the heat of the driver chip 4 to the outside. Since the copper layer has good thermal conductivity, the heat dissipation efficiency of the intelligent power module 100 can be improved.

[0044] According to some embodiments of the present invention, in the width direction of the plastic package 8, one end of the second substrate 9 extends at least to the control pin 22, and the other end of the second substrate 9 extends at least to the power pin 23. That is, one end of the second substrate 9 in the width direction extends to the control pin 22; or, one end of the second substrate 9 in the width direction extends along the width direction of the plastic package 8 and exceeds the control pin 22. Similarly, the other end of the second substrate 9 in the width direction extends to the power pin 23; or, the other end of the second substrate 9 in the width direction extends along the width direction of the plastic package 8 and exceeds the power pin 23. With such a configuration, the second substrate 9 can be designed as a large-sized substrate, thereby improving the heat dissipation efficiency of the second substrate 9.

[0045] In addition, since the second substrate 9 is not provided with power pins 23 and control pins 22, the area of ​​the second substrate 9 exposed outside the plastic package 8 can be greater than or equal to the area of ​​the first substrate 1 exposed outside the plastic package 81, so as to quickly reduce the temperature inside the plastic package 8.

[0046] Optionally, the first substrate 1 may also be a DBC (ie, ceramic copper clad laminate) board, but is not limited thereto.

[0047] According to some embodiments of the present invention, the conductive member 5 includes a first conductive segment 51, a second conductive segment 52 and a third conductive segment 53, the first conductive segment 51 extends along the width direction of the plastic package 8, the second lead 7 is connected to the first conductive segment 51, one end of the second conductive segment 52 is connected to the first conductive segment 51, and the second conductive segment 52 extends obliquely in a direction toward the first substrate 1. Figure 6 and Figure 7As shown, the first conductive segment 51 extends from the base island 21 to the power pin 23, that is, the first conductive segment 51 is close to the base island 21, which is conducive to the bonding of the two ends of the second lead 7 to the first conductive segment 51 and the driver chip 4 respectively, and the length of the second lead 7 can be shortened. The second conductive segment 52 extends obliquely from the first conductive segment 51 to the first substrate 1, that is, the second conductive segment 52 is close to the power chip 3, and the length of the first lead 6 can also be shortened. As a result, the cost of the intelligent power module 100 is further reduced.

[0048] Among them, by setting the second conductive segment 52 to be inclined, the length of the second conductive segment 52 is increased and the structural strength of the conductive member 5 is enhanced. At the same time, the distance between the first conductive segment 51 and the first substrate 1 can be reduced, thereby reducing the thickness of the intelligent power module 100, which is more conducive to the miniaturization design of the intelligent power module 100.

[0049] The third conductive segment 53 is connected to the other end of the second conductive segment 52, and the third conductive segment 53 extends along the width direction of the plastic package body 8, and the third conductive segment 53 is connected to the first substrate 1. In other words, the first conductive segment 51 and the third conductive segment 53 are respectively located at the two ends of the length direction of the second conductive segment 52, and the first conductive segment 51 and the third conductive segment 53 are both extended in a direction away from the second conductive segment 52. Through the third conductive segment 53, the contact area between the conductive member 5 and the first substrate 1 can be increased, so that the connection reliability between the conductive member 5 and the first substrate 1 can be improved.

[0050] The length of the third conductive segment 53 in the width direction of the plastic package 8 is less than or equal to the length of the first conductive segment 51. This arrangement can reduce the length of the conductive member 5 while ensuring the connection reliability between the conductive member 5 and the first substrate 1, thereby preventing the intelligent power module 100 from being too wide.

[0051] Further, refer to Figure 7 In the thickness direction of the plastic package 8, the surface of the first conductive segment 51 facing the first substrate 1 is flush with the surface of the base island 21 facing the first substrate 1. Since one end of the second lead 7 is connected to the side of the first conductive segment 51 facing the first substrate 1, the other end of the second lead 7 is connected to the driver chip 4, and the driver chip 4 is arranged on the side of the base island 21 facing the first substrate 1. In this way, the height difference between the driver chip 4 and the first conductive segment 51 can be reduced, which is beneficial to the bonding of the second lead 7, and the length of the second lead 7 can be further shortened, thereby further reducing the cost of the intelligent power module 100.

[0052] Furthermore, if Figure 7As shown, the first conductive segment 51 includes a first sub-segment 511 and a second sub-segment 512 connected to each other, the second sub-segment 512 is connected to the second conductive segment 52, and at least one side of the first sub-segment 511 protrudes from the second sub-segment 512 in the length direction of the plastic package body 8. For example, one side of the first sub-segment 511 protrudes from the second sub-segment 512 in the length direction of the first substrate 1, and the shape of the first conductive segment 51 is roughly L-shaped or Z-shaped; or, both sides of the first sub-segment 511 protrude from the second sub-segment 512 in the length direction of the first substrate 1, and the shape of the first conductive segment 51 is roughly T-shaped. Therefore, through the first sub-segment 511, the length of the first conductive segment 51 in the length direction of the first substrate 1 is increased, which is conducive to the bonding of the second lead 7 to the first conductive segment 51, and while ensuring the structural strength of the conductive member 5, the material consumption of the conductive member 5 is reduced, and the weight of the conductive member 5 is reduced.

[0053] Optionally, in the length direction of the first substrate 1 , the width of the second sub-segment 512 is equal to the width of the second conductive segment 52 .

[0054] According to some embodiments of the present invention, each control pin 22 includes a first pin segment 221 and a second pin segment 222 connected to each other, the second pin segment 222 is located on a side of the first pin segment 221 away from the first substrate 1, the first pin segment 221 is located inside the plastic package 8, and the second pin segment 222 is located outside the plastic package 8; each power pin 23 includes a third pin segment 231 and a fourth pin segment 232 connected to each other, the fourth pin segment 232 is located on a side of the third pin segment 231 away from the first substrate 1, the third pin segment 231 is located inside the plastic package 8, and the fourth pin segment 232 is located outside the plastic package 8.

[0055] Among them, in the thickness direction of the plastic package 8, one side surface of the first pin segment 221 adjacent to the second substrate 9, one side surface of the third pin segment 231 adjacent to the second substrate 9, one side surface of the base island 21 adjacent to the second substrate 9 and one side surface of the first conductive segment 51 adjacent to the second substrate 9 are flush.

[0056] Reference Figure 6-Figure 8 , one end of the first substrate 1 in the width direction extends to the second conductive segment 52 of the conductive member 5, and the other end of the first substrate 1 in the width direction extends to the end of the third pin segment 231 away from the fourth pin segment 232. Thus, the size of the first substrate 1 is limited between the conductive member 5 and the power pin 23, further reducing the size of the first substrate 1, and making better use of the miniaturized design of the intelligent power module 100.

[0057] According to some embodiments of the present invention, Figure 1-Figure 5As shown, the first substrate 1 includes a plurality of functional areas 11 and a plurality of connection areas 12. In the description of the present invention, "plurality" means two or more. The plurality of functional areas 11 and the plurality of connection areas 12 are spaced apart along the length direction of the plastic package 8, and the functional areas 11 and the connection areas 12 are spaced apart along the width direction of the plastic package 8. The power chip 3 is arranged in the functional area 11, the above-mentioned one end of the conductive member 5 is connected to the connection area 12, and the two ends of the first lead 6 are respectively connected to the connection area 12 and the power chip 3. The conductive member 5 and the power chip 3 are electrically connected through the connection area 12 and the first lead 6.

[0058] For example, in Figure 1-Figure 4 In the example, four functional areas 11 are provided on one side of the surface in the thickness direction of the first substrate 1, and the four functional areas 11 are spaced apart along the length direction of the first substrate 1. At least one power chip 3 is mounted on each functional area 11 to achieve electrical connection between the power chip 3 and the first substrate 1. A connection area 12 is provided on one side of each functional area 11 adjacent to the conductive member 5, and the connection area 12 extends along the length direction of the first substrate 1. The third conductive segment 53 of the conductive member 5 is connected to the connection area 12 to achieve electrical connection between the conductive member 5 and the first substrate 1, and the connection area 12 is electrically connected to the power chip 3 through the first lead 6.

[0059] There are nine conductive members 5 and nine connection areas 12, three of which are opposite to the three functional areas 11, respectively, and the three functional areas 11 are electrically connected to the same driver chip 4 through the three conductive members 5 and the three first leads 6. The remaining six connection areas 12 are opposite to the same functional area 11, and the functional area 11 is electrically connected to another driver chip 4 through the remaining six conductive members 5 and the six first leads 6.

[0060] Therefore, by setting the connection area 12, it is convenient for the first lead 6 to be bonded to the connection area 12, and for the conductive member 5 to be connected to the first substrate 1, so that the first lead 6 and the conductive member 5 in the same connection area 12 are separated, avoiding interference between the first lead 6 and the conductive member 5, and preventing the first lead 6 from crossing, so that the structure of the intelligent power module 100 is more regular.

[0061] Figure 1 Four functional areas 11 are shown for illustrative purposes, but after reading the technical solution of the present application, ordinary technicians can obviously understand that the solution can be applied to technical solutions with other numbers of functional areas 11, which also falls within the scope of protection of the present invention.

[0062] Furthermore, the plurality of connection areas 12 include a high-voltage connection area 121 and a low-voltage connection area 122. Figure 1-Figure 5In the example, there are six high-voltage connection areas 121, which are opposite to the high-voltage functional area 112. Three high-voltage power chips 31 are arranged in the high-voltage functional area 112, and each high-voltage power chip 31 is connected to two high-voltage connection areas 121 through two first leads 6. There are three low-voltage connection areas 122, which are opposite to the three low-voltage functional areas 11, and each low-voltage functional area 11 is provided with a low-voltage power chip 32, which is connected to the low-voltage connection area 122 through the first lead 6.

[0063] The length of the high-voltage connection area 121 is shorter than the length of the low-voltage connection area 122 in the length direction of the plastic package 8. Since the number of high-voltage connection areas 121 is large, the length of the high-voltage connection area 121 is short, and multiple high-voltage connection areas 121 can be spaced apart within the limited length of the first substrate 1, so that the high-voltage connection area 121 is electrically connected to the corresponding pad of the driver chip 4 through the conductive member 5 and the second lead 7. Since one low-voltage connection area 122 corresponds to one low-voltage functional area 11, by making the length of the low-voltage connection area 122 longer, the area of ​​the low-voltage connection area 122 is increased, which facilitates the connection between the first lead 6 and the conductive member 5 and the low-voltage connection area 122.

[0064] In some optional embodiments, the width of the high-voltage connection area 121 is greater than the length of the low-voltage connection area 122 in the width direction of the plastic package 8. With this arrangement, on the one hand, while ensuring that the first lead 6 and the conductive member 5 can be connected to the low-voltage connection area 122, the width of the low-voltage connection area 122 is reduced, so that the low-voltage connection area 122 is closer to the driver chip 4; on the other hand, the area of ​​the high-voltage connection area 121 is increased, which is beneficial to the connection between the first lead 6 and the conductive member 5 and the high-voltage connection area 121.

[0065] Other structures and operations of the intelligent power module 100 according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail here.

[0066] In the description of the present invention, it should be understood that the terms "center", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0067] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0068] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0069] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An intelligent power module, characterized in that: include: Plastic sealing body; A first substrate and a second substrate, wherein the first substrate and the second substrate are both disposed in the plastic package body, and the first substrate and the second substrate are respectively located on both sides of the plastic package body in a thickness direction, a surface of the first substrate on one side away from the second substrate is flush with a surface of the plastic package body on one side in a thickness direction, and a surface of the second substrate on one side away from the first substrate is flush with a surface of the plastic package body on the other side in a thickness direction; A frame, the frame is arranged between the first substrate and the second substrate, the frame comprises a base island, a control pin and a power pin, the base island is located in the plastic package, the base island and the first substrate are spaced apart along the length direction of the plastic package, and the base island is connected to the second substrate, and one end of the control pin and one end of the power pin both extend into the plastic package; A power chip, the power chip is arranged on a side of the first substrate adjacent to the base island, and the power chip is electrically connected to the power pin; A driving chip, the driving chip is arranged on a side of the base island adjacent to the first substrate, and the driving chip is electrically connected to the control pin; A conductive member, the conductive member is disposed between the base island and the power pin, one end of the conductive member is connected to the first substrate, the conductive member is electrically connected to the power chip through a first lead, and the conductive member is electrically connected to the driver chip through a second lead; Wherein, the conductive member comprises: a first conductive segment, the first conductive segment extending along the width direction of the plastic package body, the second lead being connected to the first conductive segment; a second conductive segment, one end of the second conductive segment being connected to the first conductive segment; A third conductive segment is connected to the other end of the second conductive segment, the third conductive segment extends along the width direction of the plastic package body, and the third conductive segment is connected to the first substrate.

2. The intelligent power module according to claim 1, characterized in that: The second substrate comprises: Heat dissipation body; A first insulating layer, wherein the first insulating layer is disposed between the base island and the heat dissipation body, and a width of the first insulating layer in a width direction of the plastic package body is greater than or equal to a width of the base island.

3. The intelligent power module according to claim 2, characterized in that: The heat dissipation body comprises: A first heat dissipation layer, a portion of the first heat dissipation layer protrudes toward the first substrate to form a protrusion, the protrusion is opposite to the base island in the thickness direction of the plastic package body, and the first insulating layer is arranged between the protrusion and the base island.

4. The intelligent power module according to claim 3, characterized in that: The first heat dissipation layer includes a first sub-heat dissipation layer and a second sub-heat dissipation layer, the first sub-heat dissipation layer and the second sub-heat dissipation layer are spaced apart along the width direction of the plastic package body, and the first sub-heat dissipation layer has the protrusion.

5. The intelligent power module according to claim 3, characterized in that: The heat dissipation body also includes: a second insulating layer, the second insulating layer being disposed on a side of the first heat dissipation layer away from the first substrate; A second heat dissipation layer is provided on a side of the second insulating layer away from the first substrate.

6. The intelligent power module according to claim 2, characterized in that: In the width direction of the plastic package body, one end of the second substrate at least extends to the control pin, and the other end of the second substrate at least extends to the power pin.

7. The intelligent power module according to any one of claims 1 to 6, characterized in that: The second conductive segment extends obliquely in a direction toward the first substrate; The length of the third conductive segment in the width direction of the plastic package body is less than or equal to the length of the first conductive segment.

8. The intelligent power module according to claim 1, characterized in that: The first conductive segment includes a first sub-segment and a second sub-segment connected to each other, the second sub-segment is connected to the second conductive segment, and at least one side of the first sub-segment protrudes from the second sub-segment in the length direction of the plastic package body.

9. The intelligent power module according to claim 1, characterized in that: Each of the control pins comprises a first pin segment and a second pin segment connected to each other, the second pin segment is located at a side of the first pin segment away from the first substrate, the first pin segment is located inside the plastic package, and the second pin segment is located outside the plastic package; each of the power pins comprises a third pin segment and a fourth pin segment connected to each other, the fourth pin segment is located at a side of the third pin segment away from the first substrate, the third pin segment is located inside the plastic package, and the fourth pin segment is located outside the plastic package; Among them, in the thickness direction of the plastic package body, a side surface of the first pin segment adjacent to the second substrate, a side surface of the third pin segment adjacent to the second substrate, a side surface of the base island adjacent to the second substrate, and a side surface of the first conductive segment adjacent to the second substrate are flush.

10. The intelligent power module according to any one of claims 1 to 6, characterized in that: The first substrate includes multiple functional areas and multiple connection areas, and the multiple functional areas and the multiple connection areas are spaced apart along the length direction of the plastic package body, and the functional areas and the connection areas are spaced apart along the width direction of the plastic package body. The power chip is arranged in the functional area, and the one end of the conductive member is connected to the connection area, and the two ends of the first lead are respectively connected to the connection area and the power chip, and the conductive member and the power chip are electrically connected through the connection area and the first lead.

11. The intelligent power module according to claim 10, characterized in that: The plurality of connection areas include a high-voltage connection area and a low-voltage connection area, and the length of the high-voltage connection area in the length direction of the plastic package body is shorter than the length of the low-voltage connection area; and / or The width of the high-voltage connection area in the width direction of the plastic package body is greater than the length of the low-voltage connection area.

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