Ceramic disc grinding method

Abstract

The present application discloses a method for grinding the surface of a ceramic disc, which is applied to a ceramic disc grinding device, and includes: obtaining the surface information of the ceramic disc and the grinding disc, inputting the surface information into a pre-established calculation model to obtain processing data; fixing the ceramic disc to a rotating assembly so that the axis of the ceramic disc coincides with the axis of the rotating assembly; controlling the ceramic disc and the grinding disc according to the processing data; driving the rotating assembly to drive the ceramic disc to rotate, and the ceramic disc drives the grinding disc that is attached to it to rotate, and the grinding disc grinds the surface of the ceramic disc. This method can still manufacture ceramic discs with high precision without using complex grinding equipment.

Description

Technical Field

[0001] The present application relates to the technical field of wafer grinding, and in particular to a ceramic disc type grinding method. Background Art

[0002] In the prior art, semiconductor wafer processing generally goes through the following process: crystal flattening - crystal multi-wire cutting - wafer grinding - wafer polishing - cleaning, testing and packaging. The current mainstream processing technology uses a single-sided polishing machine to polish the wafer, that is, the pressure module of the equipment transmits the pressure to the equipment pressure head, and the equipment pressure head presses the ceramic disk with the wafer attached to the carrier plate, which is covered with polishing liquid. The ceramic disk and the carrier plate rotate separately, and the pressure and rotation cause the wafer surface and the abrasive components in the polishing liquid to grind and cut, thereby achieving the purpose of surface removal.

[0003] The existing grinding methods and the ceramic discs used for grinding cannot be adjusted according to the surface shape required for wafer polishing. The ceramic discs used for wafer polishing need to meet high precision, so the processing equipment for producing and processing the ceramic discs also needs high precision to process high-precision ceramic discs. It is urgent to propose a more effective ceramic disc processing method that can process high-precision ceramic discs without the help of high-precision processing equipment to reduce the production cost of ceramic discs. Summary of the invention

[0004] In order to address the deficiencies of the prior art, the purpose of the present application is to provide a ceramic disc surface grinding method, based on which a ceramic disc grinding device with lower precision can be used to process a ceramic disc with higher precision.

[0005] To achieve the above objectives, this application adopts the following technical solutions:

[0006] A ceramic disc surface grinding method, the grinding method is applied to a ceramic disc grinding device, the ceramic disc grinding device comprises a base, a rotating assembly and a grinding assembly, the rotating assembly is installed above the base and has an axis extending in the height direction, the rotating assembly can drive the ceramic disc to rotate around the axis; the grinding assembly is fixed to the base, the grinding assembly comprises a grinding disc located above the rotating assembly, the grinding disc is configured to fit with the ceramic disc to grind the surface of the ceramic disc, the grinding method comprises:

[0007] Obtaining the surface information of the ceramic disc and the grinding disc, and inputting the surface information into a pre-established calculation model to obtain processing data;

[0008] Fixing the ceramic disk to the rotating assembly so that the axis of the ceramic disk coincides with the axis of the rotating assembly;

[0009] Control ceramic disc and grinding disc according to processing data;

[0010] The rotating assembly is driven to drive the ceramic disc to rotate, and the ceramic disc drives the grinding disc in contact with it to rotate, and the grinding disc grinds the surface of the ceramic disc.

[0011] Further, the processed data includes at least one of the following data:

[0012] The rotation speed of the rotating assembly, the pressure of the grinding disc on the ceramic disc, and the distance between the axis of the grinding disc and the axis of the ceramic disc.

[0013] Furthermore, the surface information is input into a pre-established calculation model to obtain processing data, including:

[0014] The relative speed between the ceramic disc and the grinding disc is determined according to the rotation speed of the rotating component, and the etching rate of the ceramic disc is determined based on the relative speed and the pressure of the grinding disc on the ceramic disc. The etching rate satisfies the following relationship:

[0015] ;

[0016] in, represents the etching rate, represents the grinding coefficient, Indicates the pressure of the grinding disc on the ceramic disc, Indicates the relative speed between the ceramic disc and the grinding disc.

[0017] Furthermore, the surface information is input into a pre-established calculation model to obtain processing data, which also includes:

[0018] Obtaining the relative motion trajectory between the ceramic disc and the grinding disc, and obtaining the relative speed according to the relative motion trajectory;

[0019] Integrate the relative speed within one rotation period of the ceramic disk to obtain the variation trend of the etching rate within the rotation period;

[0020] Several rotation cycles are superimposed to obtain the changing trend of the etching rate during the entire processing process.

[0021] Furthermore, the ceramic disc includes a first surface and a second surface that are arranged opposite to each other; the grinding disc grinds the surface of the ceramic disc, including:

[0022] Preprocessing the first surface and the second surface so that the planarity of the first surface and the second surface both reach a first threshold;

[0023] Grinding the first surface so that the first surface is concave;

[0024] Grinding the second surface so that the second surface forms a concave surface with a flatness of a second threshold;

[0025] The first surface is ground so that the first surface forms a convex surface with a flatness of a third threshold.

[0026] Furthermore, the diameter of the grinding disc is greater than the radius of the ceramic disc. When grinding a convex surface, the end face of the grinding disc facing the ceramic disc is a convex surface, and the ratio between the diameter of the grinding disc and the radius of the ceramic disc is greater than or equal to 0.5 and less than or equal to 0.8.

[0027] Furthermore, when grinding the concave surface, the end surface of the grinding disc facing the ceramic disc is a concave surface, and the ratio between the diameter of the grinding disc and the radius of the ceramic disc is greater than or equal to 0.33 and less than or equal to 0.75.

[0028] Furthermore, the relative speed between the grinding disc and the ceramic disc is defined as the grinding rate;

[0029] When machining the convex surface, the grinding rate of the outer circumference portion of the first surface is greater than the grinding rate of the inner circumference portion of the first surface;

[0030] When the concave surface is machined, the grinding rate of the outer circumference portion of the second surface is lower than the grinding rate of the inner circumference portion of the second surface.

[0031] Furthermore, the ceramic disc grinding device also includes an abrasive conveying assembly, which is fixed to the base, and the abrasive conveying assembly includes a conveying pipe, one end of which extends toward the direction of the ceramic disc and is located above the ceramic disc; the grinding disc grinds the surface of the ceramic disc, and also includes:

[0032] The conveying pipeline conveys the abrasive to the surface of the ceramic disc, and the mesh size of the abrasive is adjusted according to the etching rate of the surface of the ceramic disc.

[0033] Furthermore, the face shape information includes at least one of the following information:

[0034] The flatness of the surfaces on both sides of the ceramic disc, the flatness of the end surface of the grinding disc facing the ceramic disc, the diameter of the ceramic disc and the diameter of the grinding disc.

[0035] The ceramic disc surface grinding method inputs the surface information of the ceramic disc and the grinding disc into a calculation model to obtain the processing data of the ceramic disc, and grinds the ceramic disc based on the processing data, thereby improving the grinding accuracy of the ceramic disc, and does not require complex grinding equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A schematic diagram of a ceramic disc grinding device in an embodiment of the present application;

[0037] Figure 2 This is a flow chart of a ceramic disc type grinding method in an embodiment of the present application;

[0038] Figure 3 A flow chart of obtaining the etching rate variation trend during the processing in the embodiment of the present application;

[0039] Figure 4 This is a flow chart of the grinding process of the grinding disc on the ceramic disc in the embodiment of the present application;

[0040] Figure 5 A schematic diagram of the flatness detection of the concave surface of the ceramic disk in the embodiment of the present application;

[0041] Figure 6 Schematic diagram of flatness detection of the convex surface of the ceramic disk in an embodiment of the present application. DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the specific implementation manner of the present application will be clearly and completely described below in conjunction with the drawings in the implementation manner of the present application.

[0043] It should be noted that, in the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a concrete way. The terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, "multiple" means two or more.

[0044] In the prior art, in order to obtain a high-precision ceramic disc, high-precision processing equipment is required. In order to solve this problem, an embodiment of the present application provides a ceramic disc surface grinding method.

[0045] The ceramic disc surface grinding method provided in the embodiment of the present application is described in detail below through specific examples.

[0046] The method of the embodiment of the present application is applied to Figure 1 The ceramic disc grinding device 100 shown includes a base 11, a rotating assembly 12 and a grinding assembly 13. The rotating assembly 12 is installed above the base 11 and has an axis 101 extending in the height direction. The rotating assembly 12 is equipped with a motor 121, and the rotating assembly 12 is driven by the motor 121 to rotate around the axis 101. The rotating assembly 12 includes a fixing mechanism (not shown), and the number of the fixing mechanisms can be set to be several. The ceramic disc is placed on the surface of the rotating assembly 12, and the ceramic disc is fixed by the fixing mechanism around the outer edge of the ceramic disc, so that the axis of the ceramic disc coincides with the axis of the rotating assembly 12.

[0047] The grinding assembly 13 is mounted on the base 11. The grinding assembly 13 includes a bracket 131 and a grinding disc 132 connected to the bracket 131. The grinding disc 132 is located at one end of the bracket 131 close to the rotating assembly 12. When the ceramic disc is mounted on the rotating assembly 12, the grinding disc 132 is configured to fit the surface of the ceramic disc, and the axis 102 of the grinding disc 132 is parallel to the axis 101 of the ceramic disc. When the rotating assembly 12 drives the ceramic disc to rotate, the grinding disc 132 rotates relative to the ceramic disc under the action of the ceramic disc to grind the surface of the ceramic disc.

[0048] like Figure 2 As shown, the present application embodiment provides a flow chart of a ceramic disc type grinding method, which specifically includes the following steps:

[0049] Step S101: Acquire the surface information of the ceramic disc and the grinding disc, and input the surface information into a pre-established calculation model to obtain processing data.

[0050] The ceramic disk has two opposite surfaces, wherein the surface information of the ceramic disk includes but is not limited to: the flatness of each of the two surfaces of the ceramic disk and the diameter of the ceramic disk.

[0051] The surface information of the grinding disc includes but is not limited to: the flatness of the end surface of the grinding disc facing the ceramic disc, the diameter of the grinding disc, and the surface shape of the grinding disc.

[0052] When the ceramic disk is used to adjust the process of the wafer, the wafer can be polished separately through the convex surface or the concave surface of the ceramic disk to achieve different process effects.

[0053] In some embodiments, the diameter of the grinding wheel is larger than the radius of the ceramic wheel. When grinding the convex surface of the ceramic wheel, the end surface of the grinding wheel facing the ceramic wheel is convex, and the ratio between the diameter of the grinding wheel and the radius of the ceramic wheel is greater than or equal to 0.5 and less than or equal to 0.8.

[0054] Optionally, when grinding the concave surface of the ceramic disc, the end surface of the grinding disc facing the ceramic disc is a concave surface, and the ratio between the diameter of the grinding disc and the diameter of the ceramic disc is greater than or equal to 0.33 and less than or equal to 0.75.

[0055] It should be noted that the above arrangement enables the surfaces on both sides of the ceramic disc to have higher grinding accuracy.

[0056] In some embodiments, by inputting the surface information of the ceramic disc and the grinding disc into a pre-established calculation model, the calculation model is used to predict the polishing process of the ceramic disc, which includes the pressure exerted by the grinding disc on the ceramic disc during the polishing process and the relative speed between the grinding disc and the ceramic disc.

[0057] The processing data include but are not limited to: the rotation speed of the rotating component, the pressure of the grinding disc on the ceramic disc, and the distance between the axis of the ceramic disc and the axis of the grinding disc (hereinafter referred to as the center distance).

[0058] Taking any surface of a ceramic disc as an example, for different center distances, the rotation speed of the rotating assembly is different, and / or the pressure of the grinding disc on the ceramic disc is different, so that the ground ceramic disc has a specific surface shape.

[0059] In some embodiments, when the diameter of the ceramic disc is 576 mm and the diameter of the grinding disc is 430 mm, if the center distance is 80 mm, the surface of the ground ceramic disc is concave; if the center distance is 120 mm, the surface of the ground ceramic disc is convex.

[0060] Step S102: fix the ceramic disk to the rotating assembly so that the axis of the ceramic disk coincides with the axis of the rotating assembly.

[0061] Step S103: Control the ceramic disc and the grinding disc according to the processing data.

[0062] Step S104: driving the rotating assembly to drive the ceramic disc to rotate, and the ceramic disc drives the grinding disc in contact with it to rotate, and the grinding disc grinds the surface of the ceramic disc.

[0063] In some embodiments, the relative speed between the ceramic disc and the grinding disc is determined according to the rotation speed of the rotating assembly. Since there is abrasive on the surface of the ceramic disc, when the ceramic disc drives the grinding disc to rotate, the abrasive increases the friction between the two, so that there is a rotation speed difference between the ceramic disc and the grinding disc. The etching rate of the ceramic disc is determined according to the relative speed between the ceramic disc and the grinding disc and the pressure applied by the grinding disc to the ceramic disc.

[0064] It is understandable that due to the different etching rates at different positions on the ceramic disk, the ceramic disk can be ground into a specific surface shape, such as a convex surface or a concave surface. When the etching rate of the outer circumference of the ceramic disk is greater than the etching rate of the inner circumference, the surface of the ceramic disk is ground into a convex surface; when the etching rate of the outer circumference of the ceramic disk is less than the etching rate of the inner circumference, the surface of the ceramic disk is ground into a concave surface.

[0065] like Figure 3 As shown, the above step S101 specifically includes the following steps:

[0066] S1011: determining the relative speed between the ceramic disc and the grinding disc according to the rotation speed of the rotating component, and determining the etching rate of the ceramic disc based on the relative speed and the pressure of the grinding disc on the ceramic disc;

[0067] Specifically, the etching rate satisfies the following relationship:

[0068] ;(Formula 1)

[0069] In the formula, represents the etching rate, represents the grinding coefficient, Indicates the pressure of the grinding disc on the ceramic disc, Indicates the relative speed between the ceramic disc and the grinding disc.

[0070] It should be noted that the grinding coefficient It depends on at least one of the following factors: the mesh of the abrasive, the material of the abrasive, the material of the ceramic disc and / or the grinding disc, etc.

[0071] S1012: Obtain the relative motion trajectory between the ceramic disc and the grinding disc, and obtain the relative speed according to the relative motion trajectory.

[0072] Any point on the ceramic disk is defined as ,in, For point The distance from the axis of the ceramic disk, For point The angle between the line connecting the axis of the ceramic disk and the x-axis, where the x-axis is an axis parallel to the horizontal direction.

[0073] In some embodiments, the grinding assembly includes a sun wheel and a planetary wheel distributed around the sun wheel, and the grinding disc is mounted on the planetary wheel, and the grinding disc is driven to rotate by the mutual cooperation between the sun wheel and the planetary wheel. The rotation speed of the sun wheel is defined as , the rotation speed of the grinding disc is defined as The orbital speed of the planetary wheel around the sun wheel is defined as The rotation speed of the planetary wheel is defined as , the rotation speed of the ceramic disk is defined as , the center distance between the planetary wheel and the grinding disc is defined as , the eccentricity of the planetary wheel is defined as ;

[0074] The relative motion trajectory of the grinding disc and the ceramic disc satisfies the following relationship:

[0075] ;(Formula 2)

[0076] ;(Formula 3)

[0077] By taking the derivative of Formula 2 and Formula 3, the instantaneous relative speed between the ceramic disc and the grinding disc is obtained.

[0078] S1013: Integrate the relative speed within one rotation period of the ceramic disk to obtain a variation trend of the etching rate within the rotation period.

[0079] Based on the above formula 1, the etching rate of each point is calculated. Since the movement of the ceramic disk is periodic, the etching rate of each point is also periodic. Therefore, the changing trend of the etching rate on the surface of the ceramic disk within a cycle is calculated, that is, the integral of the relative speed within a rotation cycle, and the changing trend of the etching rate within a cycle can be obtained.

[0080] like Figure 1 As shown, the ceramic disc grinding device 100 used in the method of the embodiment of the present application also includes an abrasive delivery assembly 14, which is fixed to the base 11. The abrasive delivery assembly 14 includes a delivery pipe 141, one end of which extends toward the ceramic disc and is located above the ceramic disc.

[0081] In some embodiments, the delivery pipe 141 delivers the abrasive with a good ratio to the surface of the ceramic disc, and adjusts the mesh size of the abrasive and the ratio between the abrasive, grinding oil and water according to the etching rate of the ceramic surface. The etching rate of each point on the ceramic disc can also be adjusted by the above method, which will not be described in detail here.

[0082] Through the above method, the machining process of the ceramic disc is simulated in advance based on the calculation model, and the final machining result is obtained, which can greatly improve the yield rate of the ceramic disc. In addition, the machining data in the machining process can be obtained based on the calculation model, and then the workpiece of the ceramic disc can be accurately controlled, such as the pressure of the grinding disc, the size of the grinding disc, etc.

[0083] S1014: Superimpose several rotation cycles to obtain a variation trend of the etching rate during the entire processing process.

[0084] The two side surfaces of the ceramic disk generally have different surface shapes, that is, one side surface is a concave surface and the other side surface is a convex surface. When processing the two side surfaces of the ceramic disk, the two side surfaces are first pre-processed and then ground respectively.

[0085] like Figure 4 As shown, in step S104, the grinding disc grinds the surface of the ceramic disc, which specifically includes the following steps:

[0086] S1041: Preprocess the first surface and the second surface so that the planarity of the first surface and the second surface both reach a first threshold.

[0087] In some embodiments, a grinding disc with a concave end surface facing the ceramic disc (hereinafter referred to as a concave grinding disc) is selected to pre-treat the first surface and the second surface by the concave grinding disc. The concave grinding disc is specifically a solid grinding disc, so that the surface of the pre-treated ceramic disc is more uniform, and the ceramic disc is less likely to have a surface shape with potholes and fluctuations.

[0088] The flatness (PV value) of the first surface and the second surface is 10 μm. It should be noted that the flatness refers to the difference between the highest point and the lowest point of a straight line passing through the axis on a surface.

[0089] Taking any one of the first surface and the second surface as an example, several detection lines extending radially on the surface of the ceramic disk are recorded, and the several detection lines intersect with each other, and the intersection coincides with the axis of the ceramic disk. The angles between any two adjacent detection lines are consistent, and the flatness difference between the several detection lines is less than 3 μm.

[0090] S1042: Grinding the first surface so that the first surface is concave.

[0091] In some embodiments, after the first surface and the second surface are pre-processed, the first surface is ground so that the surface of the first surface is concave. At this time, no requirement is imposed on the flatness of the first surface.

[0092] For example, the grinding disc uses a cast iron disc with a diameter of 300 mm, a center distance of 10 mm, a pressure of 10 kg on the ceramic disc, a 1200 mesh white corundum powder, and a grinding oil and water are mixed in a certain proportion to form an abrasive with a concentration of 1.2 g / ml, and the rotation speed of the rotating component is 14 Hz. After grinding for a set time, a first surface with a concave surface is formed.

[0093] It should be noted that the above is only a preferred embodiment. In the actual grinding process, grinding discs such as ceramic materials, grinding discs of different sizes, abrasives of different concentrations, and rotating components with different rotation speeds can also be selected, which will not be described in detail here.

[0094] like Figure 5 As shown, four detection lines are shown on the first surface, and the jagged edges on each detection line represent the flatness of different points on the detection line. When the first surface is ground, the flatness of each detection line is within 10 μm.

[0095] S1043: Grind the second surface so that the second surface forms a concave surface with a flatness of a second threshold.

[0096] After the first surface is ground into a concave surface, the ceramic disc is turned over so that the second surface of the ceramic disc faces the grinding disc, and a concave grinding disc is used to grind the second surface so that the second surface is ground into a concave surface with a flatness of a second threshold; wherein the range of the second threshold is 1 μm to 2 μm.

[0097] In some embodiments, the grinding disc is a cast iron disc with a diameter of 300 mm, the center distance is 10 mm, the pressure of the grinding disc on the ceramic disc is 10 kg, the abrasive is 1200 mesh white corundum powder, and the grinding oil and water are mixed in a certain proportion to form an abrasive with a concentration of 1.2 g / ml, and the rotation speed of the rotating component is 14 Hz. After grinding for a set time, a second surface with a concave surface and a flatness of 5 μm is formed.

[0098] Furthermore, the size of the grinding wheel was changed, and a cast iron wheel with a diameter of 430 mm and a center distance of 133 mm was selected. The pressure of the grinding wheel on the ceramic wheel was 10 kg. The abrasive was 1200 mesh white corundum powder. Grinding oil and water were mixed in a certain proportion to form an abrasive with a concentration of 1.2 g / ml. The speed of the rotating component was 12 Hz. After grinding for a set time, a second surface with a concave surface and a flatness range of 1 μm to 2 μm was formed.

[0099] S1044: Grind the first surface so that the first surface forms a convex surface with a flatness of a third threshold.

[0100] like Figure 6 As shown, there are 4 detection lines on the first surface. When grinding the first surface, after multiple grindings, the flatness of each detection line is within 2.5μm. Specifically, after the surface of the second surface is ground into a concave surface, the ceramic disc is turned over so that the first surface of the ceramic disc faces the grinding disc, and a grinding disc with a convex end surface facing the ceramic disc (hereinafter referred to as a convex grinding disc) is selected to grind the first surface, so that the first surface is ground into a convex surface with a flatness of the third threshold; wherein the range of the third threshold is 2μm to 3μm.

[0101] In some embodiments, the grinding disc is a cast iron disc with a diameter of 430 mm, the center distance is 198 mm, the pressure of the grinding disc on the ceramic disc is 10 kg, the abrasive is 1200 mesh white corundum powder, and the grinding oil and water are mixed in a certain proportion to form an abrasive with a concentration of 1.2 g / ml, and the rotation speed of the rotating component is 16 Hz. After grinding for a set time, a first surface with a convex surface and a flatness of 15 μm is formed.

[0102] Further, the size of the grinding disc was changed, and a cast iron disc with a diameter of 300 mm was selected, the center distance was 148 mm, the pressure of the grinding disc on the ceramic disc was 10 kg, the abrasive was 1200 mesh white corundum powder, and the grinding oil and water were mixed in a certain proportion to form an abrasive with a concentration of 1.2 g / ml, and the rotation speed of the rotating component was 14 Hz. After grinding for a set time, a convex surface was formed, and a first surface with a flatness of 7 μm was formed.

[0103] Further, the size of the grinding disc was changed, and a cast iron disc with a diameter of 350 mm was selected, the center distance was 93 mm, the pressure of the grinding disc on the ceramic disc was 10 kg, the abrasive was 1200 mesh white corundum powder, and the grinding oil and water were mixed in a certain proportion to form an abrasive with a concentration of 1.2 g / ml, and the rotation speed of the rotating component was 14 Hz. After grinding for a set time, a convex surface was formed, and a first surface with a flatness of 4 μm was formed.

[0104] Further, the size of the grinding disc was changed, and a cast iron disc with a diameter of 300 mm was selected, the center distance was 148 mm, the pressure of the grinding disc on the ceramic disc was 10 kg, the abrasive was 1200 mesh white corundum powder, and the grinding oil and water were mixed in a certain proportion to form an abrasive with a concentration of 1.2 g / ml, and the rotation speed of the rotating component was 12 HZ. After grinding for a set time, a convex surface was formed, and a first surface with a flatness range of 2 μm to 3 μm was formed.

[0105] It should be noted that although the steps in the above process or the flowchart in the accompanying drawings show a logical order, in some cases, the steps shown or described may be executed in an order different from that shown or described here.

[0106] In some embodiments, the relative speed between the grinding wheel and the ceramic wheel is defined as the grinding rate. When the convex surface of the ceramic wheel is processed, the grinding rate of the outer circular portion of the first surface is greater than the grinding rate of the inner circular portion of the first surface; when the concave surface of the ceramic wheel is processed, the grinding rate of the outer circular portion of the second surface is less than the grinding rate of the inner circular portion of the second surface.

[0107] Through the above arrangement, after multiple grindings, the surfaces on both sides of the ceramic disc have lower flatness and higher precision, and do not require reliance on complex equipment.

[0108] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. A ceramic disc surface grinding method, the grinding method is applied to a ceramic disc grinding device, the ceramic disc grinding device comprises a base, a rotating assembly and a grinding assembly, the rotating assembly is installed above the base and has an axis extending in the height direction, the rotating assembly can drive the ceramic disc to rotate around the axis; the grinding assembly is fixed to the base, the grinding assembly comprises a grinding disc located above the rotating assembly, the grinding disc is configured to fit with the ceramic disc to grind the surface of the ceramic disc, characterized in that, The method comprises: Acquiring surface information of the ceramic disc and the grinding disc, and inputting the surface information into a pre-established calculation model to obtain processing data; Fixing the ceramic disk to the rotating assembly so that the axis of the ceramic disk coincides with the axis of the rotating assembly; controlling the ceramic disc and the grinding disc according to the processing data; The rotating assembly is driven to drive the ceramic disc to rotate, and the ceramic disc drives the grinding disc attached thereto to rotate, so that the grinding disc grinds the surface of the ceramic disc; The ceramic disc comprises a first surface and a second surface which are arranged opposite to each other, and the grinding disc grinds the surface of the ceramic disc, including: Preprocessing the first surface and the second surface so that the planarity of the first surface and the second surface both reach a first threshold; Grinding the first surface so that the first surface is concave; Grinding the second surface so that the second surface forms a concave surface with a flatness of a second threshold; Grinding the first surface so that the first surface forms a convex surface with a flatness of a third threshold; The diameter of the grinding disc is greater than the radius of the ceramic disc. When grinding the convex surface, the end surface of the grinding disc facing the ceramic disc is a convex surface, and the ratio between the diameter of the grinding disc and the radius of the ceramic disc is greater than or equal to 0.5 and less than or equal to 0.8; when grinding the concave surface, the end surface of the grinding disc facing the ceramic disc is a concave surface, and the ratio between the diameter of the grinding disc and the radius of the ceramic disc is greater than or equal to 0.33 and less than or equal to 0.75; the relative speed between the grinding disc and the ceramic disc is defined as the grinding rate; When the convex surface is processed, the grinding rate of the outer circular portion of the first surface is greater than the grinding rate of the inner circular portion of the first surface; when the concave surface is processed, the grinding rate of the outer circular portion of the second surface is less than the grinding rate of the inner circular portion of the second surface.

2. The ceramic disc grinding method according to claim 1, characterized in that: The processing data includes at least one of the following data: The rotation speed of the rotating assembly, the pressure of the grinding disc on the ceramic disc, and the distance between the axis of the grinding disc and the axis of the ceramic disc.

3. The ceramic disc grinding method according to claim 2, characterized in that: Inputting the surface information into a pre-established calculation model to obtain processing data includes: The relative speed between the ceramic disc and the grinding disc is determined according to the rotation speed of the rotating assembly, and the etching rate of the ceramic disc is determined based on the relative speed and the pressure of the grinding disc on the ceramic disc. The etching rate satisfies the following relationship: ； Among them, the represents the etching rate, the represents the grinding factor, represents the pressure of the grinding disc on the ceramic disc, the Indicates the relative speed between the ceramic disc and the grinding disc.

4. The ceramic disc grinding method according to claim 3, characterized in that: Inputting the surface information into a pre-established calculation model to obtain processing data, further comprising: Obtaining a relative motion trajectory between the ceramic disc and the grinding disc, and obtaining the relative speed according to the relative motion trajectory; Integrating the relative speed within a rotation period of the ceramic disk to obtain a variation trend of the etching rate within the rotation period; A plurality of the rotation cycles are superimposed to obtain the variation trend of the etching rate during the entire processing process.

5. The ceramic disc type grinding method according to claim 3, characterized in that: The ceramic disc grinding device further comprises an abrasive conveying assembly, the abrasive conveying assembly is fixed to the base, the abrasive conveying assembly comprises a conveying pipe, one end of the conveying pipe extends toward the ceramic disc and is located above the ceramic disc; The grinding disc grinds the surface of the ceramic disc, and further comprises: The conveying pipe conveys the abrasive to the surface of the ceramic disc, and the mesh size of the abrasive is adjusted according to the etching rate of the surface of the ceramic disc.

6. The ceramic disc grinding method according to claim 1, characterized in that: The face shape information includes at least one of the following information: The flatness of the surfaces on both sides of the ceramic disc, the flatness of the end surface of the grinding disc facing the ceramic disc, the diameter of the ceramic disc and the diameter of the grinding disc, and the surface shape of the grinding disc.

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