Disc cover unit and baking device

Abstract

The invention provides a disc cover unit and a baking device. The disc cover unit comprises a disc cover and a heater assembly, and a plurality of air inlet holes are distributed in the disc cover in the circumferential direction; the heater assembly comprises a heater base plate, a heating body and a plurality of fixing columns, the heating body is fixed to the heater base plate, the fixing columns are circumferentially distributed and fixed to the edge of the heater base plate and surround the heating body, the fixing columns protrude towards the disc cover and are connected with the disc cover, a preheating area is formed between the heating body and the disc cover, and the preheating area communicates with the air inlet hole. The preheating area is used for preheating gas entering through the gas inlet hole; a gap exists between the side wall of the heater base plate and the side wall of the disc cover and is used for conveying preheated gas into the baking cavity. According to the disc cover unit, the temperature of the gas in the baking cavity can be uniform, the baking temperature uniformity of a wafer process is improved, meanwhile, the gas in the baking cavity can flow uniformly, and defects such as wind marks are not prone to being generated on the surface of a wafer.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a tray cover unit and a baking device. Background Art

[0002] The baking unit is the core process unit of the coating and developing equipment. Its main function is to achieve the process requirements of the wafer by baking, including: soft baking after photoresist coating to volatilize organic solvents; promote photoacid reaction to eliminate standing wave effect; eliminate water vapor to solidify the film, etc. The working principle is: place the wafer in the center of the tray of the baking unit, heat the baking cavity, complete the wafer baking process, and meet the process requirements.

[0003] In order to achieve better process effects for wafer baking, certain requirements are usually placed on the temperature uniformity of the baking unit and the inlet and exhaust pressure of the hot plate during the process. However, in the prior art, process defects often occur in the actual process of the wafer due to incomplete consideration and design. For example, if the temperature difference on the wafer surface is too large, or abnormal vortices appear in the flow field in the baking chamber, it will lead to problems such as poor uniformity of the film thickness on the wafer surface and substandard line width consistency after development; if the exhaust is insufficient, the organic solvent volatilized from the wafer surface will fall back and form pollution; if the exhaust is too large, it will cause the film on the wafer surface to flow and produce wind marks.

[0004] The solution closest to the present invention is as follows Figure 1 As shown: When the baking unit is working, the gas enters the cavity from the edge gap and is discharged from the exhaust hole in the middle of the upper end of the pan cover, that is, air enters from the edge and exhausts in the middle.

[0005] But if Figure 1 The technical solution shown has the following defects in actual use:

[0006] 1. Room temperature gas directly enters the baking chamber from the external environment. Due to the large difference between the temperature of the room temperature gas and the temperature inside the baking chamber, the combined influence of heat conduction and convection will cause the wafer process temperature near the air inlet (i.e. the edge area) to be low, while the wafer process temperature near the exhaust port (i.e. the center area) to be high, thereby affecting the temperature uniformity of the baking unit in the process.

[0007] 2. The air intake structure of the edge slit will cause the airflow entering the baking chamber to be affected by the adverse pressure gradient, forming a separation vortex near the air inlet (i.e., the edge area). This flow can easily cause the film layer on the wafer surface in the corresponding area to be thin, and in severe cases, wind mark defects will occur, affecting the process effect.

[0008] 3. The baking unit can often only achieve qualified process effects under specific exhaust values. In actual production, due to the variety of photoresists, the corresponding process formulas are also different. When the exhaust value parameters change, such as Figure 1 The structure of the technical solution shown may no longer be applicable.

[0009] 4. The air intake gap of the baking unit is controlled by adjusting the lifting mechanism. The manual adjustment steps are cumbersome and consistency is difficult to ensure.

[0010] Therefore, it is necessary to provide a novel pan cover unit and baking device to solve the above problems existing in the prior art. Summary of the invention

[0011] The object of the present invention is to provide a tray cover unit to achieve uniform gas temperature inside a baking chamber, improve the baking temperature uniformity of a wafer process, and at the same time achieve uniform gas flow inside the baking chamber, which is not easy to produce defects such as wind marks on the wafer surface.

[0012] To achieve the above-mentioned purpose, the disk cover unit of the present invention includes a disk cover and a heater assembly, and the disk cover is circumferentially provided with a plurality of air inlet holes; the heater assembly includes a heater substrate, a heating element and a plurality of fixed columns, and the heating element is fixed on the heater substrate, and the plurality of fixed columns are circumferentially distributed and fixed on the edge of the heater substrate and surround the heating element, the fixed columns protrude toward the disk cover and are connected to the disk cover, a preheating zone is formed between the heating element and the disk cover, the preheating zone is connected with the air inlet holes, and the preheating zone is used to preheat the gas entering through the air inlet holes; there is a gap between the side wall of the heater substrate and the side wall of the disk cover, and the gap is used to transport the preheated gas into the interior of the baking cavity.

[0013] The beneficial effects of the disc cover unit of the present invention are:

[0014] The fixing column protrudes toward the disk cover and is connected to the disk cover, a preheating zone is formed between the heating element and the disk cover, the preheating zone is communicated with the air inlet, and the preheating zone is used to preheat the gas entering through the air inlet, so that the gas is fully preheated before entering the baking cavity, so that the temperature of the gas in the baking cavity is more uniform, and the baking temperature uniformity of the wafer process is improved; there is a gap between the side wall of the heater substrate and the side wall of the disk cover, and the gap is used to transport the preheated gas into the baking cavity, and the gap forms an annular air inlet area, and there is no obstruction at the annular air inlet area, so that the gas flow inside the baking cavity is more uniform, and it is not easy to produce defects such as wind marks on the wafer surface.

[0015] Optionally, the pan cover unit further includes an exhaust head, which includes an air guide channel and a connecting body, wherein the air guide channel is used to discharge the gas inside the baking cavity to the external environment, and the connecting body passes through the pan cover and is connected to the heater substrate.

[0016] Optionally, the disk cover unit further includes an air suction plate, which is fixed on the side of the heater substrate facing away from the disk cover, and the air suction plate is provided with air suction holes, which are connected to the air guide channel for exhausting the gas inside the baking cavity.

[0017] Optionally, the connecting body includes a first connecting portion and a second connecting portion, the first connecting portion is connected to the disk cover, a plurality of the air inlet holes surround the first connecting portion, and the second connecting portion penetrates the disk cover and is connected to the heater substrate.

[0018] Optionally, a first through hole is provided on the first connecting portion, and a first through hole corresponding to the first through hole is provided on the disk cover, and the first through hole is used to accommodate a portion of the first fastening screw passing through the first through hole to fix the exhaust head and the disk cover.

[0019] Optionally, the first connecting portion further includes a first sealing gasket, which is located between the first connecting portion and the disk cover to prevent air leakage.

[0020] Optionally, a second through hole is provided on the heater substrate, and the second connecting portion includes a first end and a second end, the second end is located in the second through hole, and the first end is connected to the heater substrate; the second connecting portion also includes a second sealing gasket, which is located between the first end and the heater substrate to prevent air leakage.

[0021] Optionally, the disk cover is provided with second through holes corresponding one to one with the fixing posts, and the fixing posts are provided with fixing holes, which are used to accommodate a portion of a second fastening screw that passes through the second through holes to fix the disk cover and the heater substrate and simultaneously fix the second sealing gasket.

[0022] Optionally, a guide groove is provided on a side of the air suction plate facing away from the heater substrate, the air suction hole is located in the guide groove, and the guide groove is used to serve as an air flow channel to guide the gas.

[0023] The present invention also provides a baking device, comprising a tray body, a tray body support block, a base plate and the tray cover unit as described above, wherein the tray body is used to place wafers; the tray body and the tray cover unit are detachably connected, and the tray body and the tray cover are connected to form the baking cavity to heat the wafers; the tray body is located on the tray body support block, and the tray body support block is fixed on the base plate.

[0024] The beneficial effects of the baking device of the present invention are:

[0025] The baking device can be used within a wide exhaust pressure range, forming a stable flow field in the baking cavity, coping with a variety of process options, and having high compatibility; at the same time, the baking device does not require manual adjustment of parameters highly related to process effects, such as an air intake gap, and has good process consistency.

[0026] Optionally, the applicable exhaust pressure range of the baking device is -20 Pa to -200 Pa. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is an overall diagram of the prior art in the present invention;

[0028] Figure 2 A cross-sectional view of a disk cover unit according to an embodiment of the present invention;

[0029] Figure 3 An overall diagram of a heater assembly according to an embodiment of the present invention;

[0030] Figure 4 for Figure 2 The enlarged view of point A in the middle;

[0031] Figure 5 for Figure 2 The enlarged view of point B in the middle;

[0032] Figure 6 An overall diagram of the air suction plate of the embodiment provided by the present invention;

[0033] Figure 7 An overall diagram of a baking device according to an embodiment of the present invention;

[0034] Figure 8 This is a flow field distribution diagram of the internal baking cavity of the baking device of the embodiment provided by the present invention at -20 Pa;

[0035] Fig. 9 This is a flow field distribution diagram of the internal baking cavity of the baking device of the embodiment provided by the present invention at -35 Pa;

[0036] Fig.10 This is a flow field distribution diagram of the internal baking cavity of the baking device of the embodiment provided by the present invention at -100 Pa;

[0037] Fig.11 This is a flow field distribution diagram of the internal baking cavity of the baking device of the embodiment provided by the present invention at -200 Pa.

[0038] Reference numerals

[0039] 10. tray cover unit; 20. tray body; 30. tray body support block; 40. bottom plate;

[0040] 11. disk cover; 111. air inlet hole; 112. third through hole; 113. first sealing gasket; 1131. first through hole; 114. first through hole; 115. second through hole;

[0041] 12. exhaust head; 121. first connection part; 1211. first through hole; 122. second connection part; 1221. first end; 1222. second end; 123. air guide channel;

[0042] 13. heater assembly; 131. heater substrate; 1311. second through hole; 1312. groove; 132. heating element; 133. fixing column; 1331. fixing hole; 134. second sealing gasket;

[0043] 14, air suction plate; 141, screw hole; 142, guide groove; 143, circular groove; 144, first sub-air suction hole; 145, second sub-air suction hole;

[0044] 15. Preheating zone; 16. First fastening screw; 17. Second fastening screw. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0046] In view of the problems existing in the prior art, an embodiment of the present invention provides a disk cover unit, comprising a disk cover and a heater assembly, wherein the disk cover is circumferentially provided with a plurality of air inlet holes; the heater assembly comprises a heater substrate, a heating element and a plurality of fixing columns, wherein the heating element is fixed on the heater substrate, and the plurality of fixing columns are circumferentially fixed to the edge of the heater substrate and surround the heating element, the fixing columns protrude toward the disk cover and are connected to the disk cover, a preheating zone is formed between the heating element and the disk cover, the preheating zone is connected to the air inlet holes, and the preheating zone is used for preheating the gas entering through the air inlet holes; there is a gap between the side wall of the heater substrate and the side wall of the disk cover, and the gap is used for conveying the preheated gas into the baking cavity.

[0047] The advantages of the disc cover unit of the present invention are:

[0048] The fixing column protrudes toward the disk cover and is connected to the disk cover, a preheating zone is formed between the heating element and the disk cover, the preheating zone is communicated with the air inlet, and the preheating zone is used to preheat the gas entering through the air inlet, so that the gas is fully preheated before entering the baking cavity, so that the temperature of the gas in the baking cavity is more uniform, and the baking temperature uniformity of the wafer process is improved; there is a gap between the side wall of the heater substrate and the side wall of the disk cover, and the gap is used to transport the preheated gas into the baking cavity. The gap forms an annular air inlet area, and there is no obstruction at the annular air inlet area, so that the gas flow inside the baking cavity is more uniform, and it is not easy to produce defects such as wind marks on the wafer surface.

[0049] In some embodiments, the pan cover unit also includes an exhaust head, which includes an air guide channel and a connecting body. The air guide channel is used to discharge the gas inside the baking cavity to the external environment. The connecting body passes through the pan cover and is connected to the heater substrate.

[0050] In some embodiments, the connecting body includes a first connecting portion and a second connecting portion, the first connecting portion is connected to the disk cover, a plurality of the air inlet holes surround the first connecting portion, and the second connecting portion passes through the disk cover and is connected to the heater substrate.

[0051] Figure 2 A cross-sectional view of a disk cover unit according to an embodiment of the present invention; Figure 3 This is an overall diagram of the heater assembly of the embodiment provided by the present invention. Figure 2 and Figure 3As shown, the pan cover unit 10 includes a pan cover 11, an exhaust head 12, a heater assembly 13 and an air suction plate 14, the exhaust head 12 includes an air guide channel 123 and a connecting body, the exhaust head 12 is provided with an air guide channel 123, the air guide channel 123 is used to connect the external environment and the inside of the baking cavity, the connecting body includes a first connecting portion 121 and a second connecting portion 122, the first connecting portion 121 is fixed to the pan cover 11 so that the exhaust head 12 is fixed to the pan cover 11, the pan cover 11 is circumferentially evenly distributed with air inlet holes 111, the air inlet holes 111 surround the first connecting portion 121; the heater assembly 13 includes a heater substrate 131, a heating element 132 and a fixing column 133, the heating element 132 is annular, the heating element 132 is fixed on the heater substrate 131, the fixing columns 133 are evenly distributed circumferentially and fixed on the edge of the heater substrate 131, the fixing columns 133 surround the heating element 132, the fixing columns 133 protrude toward the disk cover 11 and abut against the disk cover 11, a preheating zone 15 is formed between the heating element 132 and the disk cover 11, the preheating zone 15 is connected with the air inlet 111, a third through hole 112 is provided on the disk cover 11, and the second connecting portion 122 passes through the disk cover 11 from the third through hole 112 and is connected to the heater substrate 131.

[0052] Reference Figure 2 As shown, there is a gap between the side wall of the heater substrate 131 and the side wall of the disk cover 11, and the gap forms an annular air intake area, which evenly transports the gas heated in the preheating zone 15 into the baking cavity, ensuring uniform gas flow.

[0053] In some embodiments, the number of the air inlet holes is m, where m is greater than 3 and is an integer.

[0054] In some embodiments, the air inlet hole may be changed to a slot-type air inlet, or other structures or components such as an air inlet joint may be installed to enable gas to enter the disk cover unit.

[0055] In some embodiments, the number of the fixing columns is n, where n is greater than 3 and is an integer.

[0056] In some embodiments, the preheating zone may be formed into a labyrinth-shaped structure to further increase the gas temperature at the annular air inlet and improve temperature uniformity.

[0057] In some embodiments, a porous structure may be provided at the annular air inlet area for conveying the gas in the preheating zone into the baking cavity.

[0058] In some embodiments, a first through hole is provided on the first connecting portion, and a first via hole corresponding to the first through hole is provided on the disk cover, and the first via hole is used to accommodate a portion of a first fastening screw passing through the first through hole to fix the exhaust head and the disk cover.

[0059] In some embodiments, the first connecting portion further includes a first sealing gasket, and the first sealing gasket is located between the first connecting portion and the disk cover to prevent air leakage.

[0060] Figure 4 for Figure 2 Enlarged view of point A in the middle. Figure 2 and 4 As shown, a first sealing gasket 113 is arranged between the first connecting portion 121 and the disk cover 11, and the first sealing gasket 113 surrounds the second connecting portion 122. A first through hole 1211 is arranged on the first connecting portion 121, and a first through hole 1131 corresponding to the first through hole 1211 is arranged on the first sealing gasket 113. A first through hole 114 corresponding to the first through hole 1131 is arranged on the disk cover 11. A first fastening screw 16 passes through the first through hole 1211 and the first through hole 1131 in sequence and is partially accommodated in the first through hole 114, so as to fix the exhaust head 12, the first sealing gasket 113 and the disk cover 11 together in sequence, and the first sealing gasket 113 abuts against the first connecting portion 121 and the disk cover 11 respectively to seal the connection between the first connecting portion 121 and the disk cover 11 to ensure the sealing of the disk cover unit 10.

[0061] In some embodiments, the number of the first fastening screws is determined by the number of the first through holes, and the number of the first fastening screws is x, where x is greater than 3 and is an integer.

[0062] In some embodiments, a second through hole is provided on the heater substrate, and the second connecting portion includes a first end and a second end, the second end is located in the second through hole, and the first end is connected to the heater substrate; the second connecting portion also includes a second sealing gasket, and the second sealing gasket is located between the first end and the heater substrate to prevent air leakage.

[0063] In some embodiments, the disk cover is provided with second through holes corresponding one to one with the fixing posts, and the fixing posts are provided with fixing holes, which are used to accommodate a portion of a second fastening screw that passes through the second through holes to fix the disk cover and the heater substrate and at the same time fix the second sealing gasket.

[0064] Figure 5 for Figure 2 Enlarged view of point B in the middle. Figure 2 and Figure 5 As shown, the second connection part 122 is connected to the heater substrate 131, and the second connection part 122 includes a first end 1221 and a second end 1222. The heater substrate 131 is provided with a second through hole 1311, and the second end 1222 is located in the second through hole 1311. A second sealing gasket 134 is provided between the first end 1221 and the heater substrate 131 around the second through hole 1311, and the second sealing gasket 134 surrounds the second end 1222. The disk cover 11 is provided with a second through hole 115 corresponding to the fixing column 133, and the fixing column 133 is provided with a fixing hole 1331. The second fastening screw 17 passes through the second through hole 115 and is partially accommodated in the fixing hole 1331 to fix the disk cover 11 and the heater substrate 131, so that the second sealing gasket 134 is pressed and fixed and seals the connection between the first end 1221 and the heater substrate 131, thereby ensuring the sealing of the disk cover unit 10.

[0065] In some embodiments, the number of the second fastening screws is determined by the number of the fixing holes, and the number of the second fastening screws is y, where y is greater than 3 and is an integer.

[0066] In some embodiments, the pan cover unit further includes an air suction plate, which is fixed on the side of the heater substrate facing away from the pan cover, and has air suction holes disposed on the air suction plate, which are connected to the air guide channel for exhausting gas inside the baking cavity.

[0067] Referring to the figure, a groove 1312 is provided on the side of the heater substrate 131 facing the air suction plate 14 , and the second through hole 1311 is located in the groove 1312 .

[0068] In some embodiments, a guide groove is provided on a side of the air suction plate facing away from the heater substrate, the air suction hole is located in the guide groove, and the guide groove is used to serve as an air flow channel to guide the gas.

[0069] Figure 6 This is an overall diagram of the air suction plate of the embodiment provided by the present invention. Figure 2 and Figure 6As shown, the air suction plate 14 is provided with a screw hole 141, and the heater substrate 131 is provided with a mounting hole (not shown in the figure) corresponding to the screw hole 141 one by one, and a third fastening screw (not shown in the figure) passes through the screw hole 141 and is partially accommodated in the mounting hole to fix the air suction plate 14 on the heater substrate 131, and the air suction plate 14 is provided with a guide groove 142 and a circular groove 143, and the guide groove 142 is circumferentially distributed on the air suction plate 14 with the circular groove 143 as the center, and the guide groove 142 is connected with the circular groove 143, and the guide groove 142 guides the gas, and an air suction hole is provided in the guide groove 142, and the air suction hole includes a first sub-air suction hole 144 and a second sub-air suction hole 145, the aperture of the first sub-air suction hole 144 is larger than the aperture of the second sub-air suction hole 145, and the second sub-air suction hole 145 is provided in the circular groove 143.

[0070] In some embodiments, the number of the third fastening screws is determined by the number of the screw holes, and the number of the third fastening screws is z, where z is greater than 3 and is an integer.

[0071] Referring to the figure, the air guiding channel 123 is connected to the air suction hole.

[0072] In some embodiments, the number of the guide grooves is p, where p is greater than 3 and is an integer.

[0073] In some embodiments, the number of the first sub-air suction holes is q, where q is greater than p and is an integer.

[0074] In some embodiments, the number of the second sub-air suction holes is x, where x is greater than q and is an integer.

[0075] The present invention also provides a baking device, comprising a tray body, a tray body support block, a base plate and the tray cover unit as described above, wherein the tray body is used to place wafers; the tray body and the tray cover unit are detachably connected, and the tray body and the tray cover are connected to form the baking cavity to heat the wafers; the tray body is located on the tray body support block, and the tray body support block is fixed on the base plate.

[0076] The advantages of the baking device described in the present invention are:

[0077] The baking device can be used within a wide exhaust pressure range, forming a stable flow field in the baking cavity, coping with a variety of process options, and having high compatibility; at the same time, the baking device does not require manual adjustment of parameters highly related to process effects, such as an air intake gap, and has good process consistency.

[0078] Figure 7 This is an overall diagram of the baking device of the embodiment provided by the present invention. Figure 7As shown, the baking device includes a tray body 20, a tray body support block 30, a base plate 40 and a tray cover unit 10, the tray body 20 is located on the tray body support block 30, the tray body 20 support block is fixed on the base plate 40, the tray body 20 and the tray cover unit 10 are detachably connected, the tray body 20 and the tray cover unit 10 are connected to form the baking cavity to heat the wafer, and the tray body 20 is used to place the wafer.

[0079] In summary, when the wafer is subjected to the baking process, the disk cover unit is first separated from the disk body, the wafer is placed at a designated position on the disk body, the disk cover unit is combined with the disk body to form the baking device, and the baking cavity is formed inside, and the interior of the baking cavity and the wafer are heated by the disk cover unit and the disk body; during the heating process and the baking process after the designated temperature is reached, gas is continuously drawn into the baking cavity through the air inlet hole under the negative pressure of the exhaust head, the gas enters the preheating zone through the air inlet hole, the gas is heated by the heating element, and then the preheated gas is transported to the baking cavity through the annular air inlet area to heat the wafer, and finally the gas in the baking cavity is discharged from the air guide channel of the exhaust head through the suction holes on the suction plate.

[0080] In some embodiments, the applicable exhaust pressure range of the baking device is -20 Pa to -200 Pa.

[0081] Figure 8 This is a flow field distribution diagram of the internal baking cavity of the baking device of the embodiment provided by the present invention at -20 Pa; Fig. 9 This is a flow field distribution diagram of the internal baking cavity of the baking device of the embodiment provided by the present invention at -35 Pa; Fig.10 This is a flow field distribution diagram of the internal baking cavity of the baking device of the embodiment provided by the present invention at -100 Pa; Fig.11 This is a flow field distribution diagram of the internal baking cavity of the baking device of the embodiment provided by the present invention at -200 Pa.

[0082] The baking device was placed under different exhaust pressures of -20 Pa, -35 Pa, -100 Pa, and -200 Pa, and flow field distribution diagrams of the baking cavity under different pressures were prepared. Figures 8 to 11 It can be seen that under different exhaust pressures, the gas flow characteristics inside the baking cavity of the baking device are stable, and no obvious vortex is generated, indicating that within a wide exhaust pressure range of -20 Pa to -200 Pa, a stable flow field can be formed inside the baking cavity of the baking device of the present invention. The baking device of the present invention can cope with a variety of process options and has high compatibility.

[0083] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A tray cover unit, characterized in that: Includes pan cover, heater assembly, The disk cover is provided with a plurality of air inlet holes distributed circumferentially; The heater assembly comprises a heater substrate, a heating element and a plurality of fixing columns, wherein the heating element is fixed on the heater substrate, the plurality of fixing columns are circumferentially distributed and fixed on the edge of the heater substrate and surround the heating element, the fixing columns protrude toward the disk cover and are connected to the disk cover, a preheating zone is formed between the heating element and the disk cover, the preheating zone is connected to the air inlet, and the preheating zone is used to preheat the gas entering through the air inlet; There is a gap between the side wall of the heater substrate and the side wall of the pan cover, and the gap is used to transport the preheated gas into the interior of the baking cavity.

2. The disk cover unit according to claim 1, characterized in that: It also includes an exhaust head, which includes an air guide channel and a connecting body. The air guide channel is used to guide the gas inside the baking cavity to the external environment. The connecting body passes through the pan cover and is connected to the heater substrate.

3. The disk cover unit according to claim 2, characterized in that: It also includes an air suction plate, which is fixed on the side of the heater substrate facing away from the pan cover. The air suction plate is provided with air suction holes, which are connected to the air guide channel for exhausting the gas inside the baking cavity.

4. The disk cover unit according to claim 2, characterized in that: The connecting body includes a first connecting portion and a second connecting portion, the first connecting portion is connected to the disk cover, a plurality of the air inlet holes surround the first connecting portion, and the second connecting portion penetrates the disk cover and is connected to the heater substrate.

5. The disk cover unit according to claim 4, characterized in that: The first connecting portion is provided with a first through hole, and the disk cover is provided with a first through hole corresponding to the first through hole one by one, and the first through hole is used to accommodate a part of the first fastening screw passing through the first through hole to fix the exhaust head and the disk cover.

6. The tray cover unit according to claim 5, characterized in that: The first connection part further includes a first sealing gasket, which is located between the first connection part and the disk cover to prevent air leakage.

7. The tray cover unit according to claim 4, characterized in that: The heater substrate is provided with a second through hole, the second connecting portion includes a first end and a second end, the second end is located in the second through hole, and the first end is connected to the heater substrate; The second connection portion further includes a second sealing gasket, which is located between the first end and the heater substrate to prevent air leakage.

8. The tray cover unit according to claim 7, characterized in that: The disk cover is provided with second through holes corresponding to the fixing posts one by one, and the fixing posts are provided with fixing holes for accommodating a portion of a second fastening screw that passes through the second through holes to fix the disk cover and the heater substrate and the second sealing gasket at the same time.

9. The tray cover unit according to claim 3, characterized in that: A guide groove is arranged on the side of the air suction plate facing away from the heater substrate, the air suction hole is located in the guide groove, and the guide groove is used to serve as an air flow channel to guide the gas.

10. A baking device, characterized in that: The invention comprises a tray body, a tray body support block, a bottom plate and a tray cover unit as claimed in any one of claims 1 to 9, The tray is used to place wafers; The tray body is detachably connected to the tray cover unit, and the tray body and the tray cover are connected to form the baking cavity to heat the wafer; The disc body is located on the disc body supporting block, and the disc body supporting block is fixed on the bottom plate.

11. The baking device according to claim 10, characterized in that: The applicable exhaust air pressure range of the baking device is -20 Pa to -200 Pa.

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