Wafer jacking device of semiconductor

Abstract

The invention provides a wafer jacking device of a semiconductor, and belongs to the technical field of semiconductor processing equipment. The device comprises a process cavity, a supporting part and a wafer, and further comprises a jacking assembly, a uniform-flow gas-flowing assembly and a gas-blocking and gas-exhausting assembly, through the arrangement of the gas storage tank and the annular baffle, it is ensured that the movable part is subjected to uniform and stable thrust in the rising process, the abrasion, inclination or jamming phenomena caused by uneven pressure are avoided, meanwhile, gas can be uniformly discharged only through one gas conveying pump, and an additional valve control system is not needed; through a magnetic control mechanism, opening and closing control over the vent groove is achieved in the jacking process, air can be automatically exhausted after jacking is completed, additional pumping treatment is not needed, and energy consumption is reduced; the corrugated sleeve and the sealing gasket are dual-guaranteed, so that support can be provided under extreme conditions, and the spring and the corrugated sleeve cooperatively buffer and reduce vibration so as to protect the wafer; the ejector pin is flexibly adjusted and is suitable for jacking processing of wafers of multiple specifications, and the universality of the device is enhanced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing equipment, and in particular to a semiconductor wafer lifting device. Background Art

[0002] In the field of semiconductor integrated circuit manufacturing, integrated circuits are usually made on wafers, and the production of a complete chip requires multiple steps. In each process step, the wafer needs to be placed in the process chamber of the corresponding semiconductor equipment. The placement of the wafer is automated. During the automatic placement of the wafer, a wafer lifting device is required to raise and lower the wafer in the process chamber to facilitate the placement of the robot.

[0003] After searching, it was found that most of the existing technologies use cylinders, gas sources, etc. to lift the ejector pins, and the cylinders usually need to occupy a certain space in the equipment to be installed, which may lead to limited flexibility in equipment design. In some compact process chambers, the installation position of the cylinder may be difficult to meet, thereby limiting the application scope of the wafer lifting device; if a gas source is used, in order to ensure the uniformity of the gas source input, an additional valve control system needs to be installed to adjust the gas pressure, which increases the complexity and cost of the equipment. If it is not installed, it will cause uneven gas source input, which will cause wear, tilting or jamming during the wafer lifting process, affecting the wafer processing quality and equipment stability.

[0004] How to invent a semiconductor wafer lifting device to solve these problems has become an urgent problem to be solved by technical personnel in this field. Summary of the invention

[0005] In order to make up for the above shortcomings, the present invention provides a semiconductor wafer lifting device, aiming to solve the problems mentioned in the above background.

[0006] The present invention is achieved in that: The present invention provides a semiconductor wafer lifting device, comprising a process chamber, a support part and a wafer, wherein the support part is composed of a plane part and a support shaft, a suction cup is installed on the plane part, the plane part is located in the process chamber and is used to support the wafer, a plurality of through grooves are correspondingly arranged in the plane part and the suction cup, the support shaft is connected to the bottom of the plane part and extends from the inside of the process chamber to the outside of the process chamber, and further comprises: Lifting assembly: The lifting assembly is arranged inside the process chamber and is used to elastically lift the wafer; Uniform flow ventilation assembly: the uniform flow ventilation assembly is arranged inside the process chamber, and the uniform flow ventilation assembly is used to ensure that the airflow acts uniformly on the elastic lifting assembly; The air-blocking and exhaust-gas assembly is arranged at the bottom of the process chamber, and controls the air flow inside the lifting assembly according to the state of the uniform-flow ventilation assembly.

[0007] Preferably, the lifting assembly includes a movable part, an installation cavity and a corrugated sleeve, the installation cavity is located in the bottom side wall of the process cavity, a sealing gasket is installed at the bottom of the movable part, the top of the movable part passes through the inner bottom wall of the process cavity, a ejector pin is installed at the top of the movable part, a screw is provided at the bottom of the ejector pin, and a screw groove meshing with the screw is provided at the top of the movable part.

[0008] Preferably, the upper end of the corrugated sleeve is fixedly connected to the bottom of the sealing gasket, and the lower end is fixedly connected to the bottom of the installation cavity. A third spring is arranged inside the corrugated sleeve, and the ends of the third spring are respectively fixedly connected to the bottom of the sealing gasket and the inner bottom wall of the corrugated sleeve, and the installation cavity and the bottom of the corrugated sleeve are both through-arranged.

[0009] Preferably, the installation cavity and the corrugated sleeve are both annular and coaxial with the support shaft, the ejector pin and the through slot are matched, the number of the screw slots and the through slots is equal, and the ejector pin and the third spring are distributed in annular shape along the edge of the movable part.

[0010] Preferably, the movable part and the top of the mounting cavity, and the sealing gasket and the inner wall of the mounting cavity are all connected by sliding sealing, the top of the ejector pin is located inside the through groove when the third spring is in an initial state, and the top of the ejector pin is located above the top of the planar part when the bottom of the movable part contacts the top of the mounting cavity.

[0011] Preferably, the uniform flow ventilation component includes an air storage tank arranged in the bottom of the process chamber, the bottom wall of the air storage tank is connected to a ventilation pipe, and an exhaust ring groove is opened on one side of the air storage tank facing the outer side of the planar portion.

[0012] Preferably, the air storage tank has a certain height and is arranged in an annular shape, the exhaust ring groove is located at the bottom of the air storage tank, the upper end of the ventilation pipe is located in the middle of the air storage tank, the lower end of the ventilation pipe extends to the outside of the process chamber, the lower end of the ventilation pipe is connected to the air pump through a pipeline, and the end of the exhaust ring groove is connected to the bottom of the installation cavity.

[0013] Preferably, the uniform flow ventilation component also includes a boss arranged at the bottom of the process chamber and a limiting cavity arranged at the bottom of the exhaust ring groove, the top of the limiting cavity passes through the bottom wall of the exhaust ring groove, the bottom wall of the limiting cavity is annularly connected with a plurality of first springs along its edge, the upper end of the first spring is fixedly connected with an annular block, the side of the annular block facing the air storage groove is prismatic, the annular block is annular and its cross-section is a right-angled trapezoid, and the top of the annular block when the first spring is in an initial state forms a contact seal with the top of the exhaust ring groove.

[0014] Preferably, the air-blocking and exhaust-gas-exhausting assembly includes a sliding cavity, a ventilation groove and a magnetic column installed at the bottom of the boss, a waist hole is provided between the limiting cavity and the sliding cavity, a second spring is fixedly connected to the side wall of the sliding cavity close to the waist hole, a flow-cutting magnetic plate is fixedly connected to the end of the second spring, the end of the ventilation groove passes through the process cavity and the side wall of the boss, and a filter plate is installed at the bottom of the ventilation groove.

[0015] Preferably, the magnetic column is located inside the first spring, the width of the intercepting magnetic plate is greater than the width of the ventilation groove, the opposing surfaces of the magnetic column and the intercepting magnetic plate are arranged with the same polarity magnetism, the intercepting magnetic plate in the initial state is located in the sliding cavity, and the bottom of the magnetic column is located above the sliding cavity, and a contact seal is formed between the intercepting magnetic plate and the ventilation groove when the magnetic column and the intercepting magnetic plate are facing each other.

[0016] The beneficial effects of the present invention are: 1. The uniform ventilation assembly can ensure that the movable part is subjected to uniform and stable thrust during the ascent process through the arrangement of the air storage groove and the annular baffle, thereby avoiding wear, tilting or jamming caused by uneven pressure. This not only extends the service life of the equipment, but also improves the accuracy and stability of wafer lifting. At the same time, only one air pump is required to realize the gas transportation, storage and uniform discharge, without the need for an additional valve control system, which not only reduces the manufacturing cost and maintenance difficulty of the system, but also improves the reliability and stability of the system.

[0017] 2. The air-repellent assembly uses a magnetic control mechanism to control the opening and closing of the ventilation slot during the jacking process, ensuring the stable flow of gas during the jacking process, and automatically exhausts the gas after the jacking is completed. No additional pumping treatment is required, saving energy consumption, the overall structure is simple, and failure points and maintenance costs are reduced.

[0018] 3. On the basis of the corrugated sleeve as the main seal and buffer element, a sealing gasket is added to the movable part to ensure that the wafer can be safely lifted, supported and lowered even in extreme cases such as accidental rupture of the corrugated sleeve, reducing the risk of production interruption and wafer loss; the third spring and the corrugated sleeve work together to provide good elastic support and buffering effect for the lifting and lowering of the movable part, significantly reducing the vibration and impact during the lifting and lowering process, and effectively protecting the wafer from damage; the number and height of the ejector pins can be flexibly adjusted according to the specifications of the wafer, meeting the processing requirements of wafers of different sizes and weights, and enhancing the versatility and adaptability of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a schematic diagram of the overall structure of a semiconductor wafer lifting device provided by an embodiment of the present invention; Figure 2 It is a schematic diagram of the bottom structure of a semiconductor wafer lifting device provided by an embodiment of the present invention; Figure 3 It is a schematic cross-sectional structure diagram of a semiconductor wafer lifting device provided by an embodiment of the present invention; Figure 4 A semiconductor wafer lifting device provided by an embodiment of the present invention Figure 3 The enlarged structural diagram at A in the middle; Figure 5 A semiconductor wafer lifting device provided by an embodiment of the present invention Figure 3 The schematic diagram of the structure is enlarged at B in the middle; Figure 6 A semiconductor wafer lifting device provided by an embodiment of the present invention Figure 5 The schematic diagram of the structure is enlarged at C in the middle; Figure 7 It is a schematic diagram of the cross-sectional structure of a process chamber of a semiconductor wafer lifting device provided by an embodiment of the present invention; Figure 8 It is a schematic structural diagram of a semiconductor wafer lifting device uniform flow ventilation component in operation provided by an embodiment of the present invention; Fig. 9 A semiconductor wafer lifting device provided by an embodiment of the present invention Figure 8 Enlarged structural diagram at D in the middle.

[0021] In the figure: 1. process chamber; 2. plane part; 3. movable part; 4. suction cup; 5. installation chamber; 6. air storage groove; 7. annular block; 8. intercepting magnetic plate; 9. corrugated sleeve; 10. wafer; 11. boss; 12. ventilation groove; 13. filter plate; 21. support shaft; 22. through groove; 31. ejector pin; 32. screw; 33. screw groove; 34. sealing gasket; 61. ventilation pipe; 62. exhaust ring groove; 71. limit chamber; 72. first spring; 73. magnetic column; 74. waist hole; 81. sliding chamber; 82. second spring; 91. third spring. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] Embodiment 1, refer to Figure 1-Figure 5 A semiconductor wafer lifting device includes a process chamber 1, a support part and a wafer 10, providing a closed environment. The process chamber 1 is used for various processing processes of the wafer 10, such as etching, deposition, etc. The support part is composed of a plane part 2 and a support shaft 21. A suction cup 4 is installed on the plane part 2. The plane part 2 is located in the process chamber 1 and is used to support the wafer 10. A plurality of through grooves 22 are correspondingly arranged in the plane part 2 and the suction cup 4. The support shaft 21 is connected to the bottom of the plane part 2 and extends from the inside of the process chamber 1 to the outside of the process chamber 1. The support shaft 21 can be connected to a power source such as a motor to drive the support part to rotate and / or lift, thereby driving the wafer 10 to rotate and / or lift. Source lines such as power lines and radio frequency lines can be accommodated in the support shaft 21. It also includes: Lifting assembly: The lifting assembly is disposed inside the process chamber 1 and is used to elastically lift the wafer 10; Uniform flow ventilation assembly: The uniform flow ventilation assembly is arranged inside the process chamber 1, and is used to ensure that the airflow acts evenly on the elastic lifting assembly; The air-blocking and exhausting assembly is arranged at the bottom of the process chamber 1, and controls the air flow inside the lifting assembly according to the state of the uniform air-flowing assembly.

[0024] Furthermore, the lifting assembly includes a movable part 3, an installation cavity 5 and a corrugated sleeve 9. The installation cavity 5 is located in the bottom side wall of the process chamber 1 to provide a sliding space for the movable part 3. A sealing gasket 34 is installed at the bottom of the movable part 3. The top of the movable part 3 passes through the inner bottom wall of the process chamber 1. A ejector pin 31 is installed at the top of the movable part 3. A screw 32 is provided at the bottom of the ejector pin 31. A screw groove 33 meshing with the screw 32 is provided at the top of the movable part 3. The ejector pin 31 is used to directly lift the wafer 10. A screw 32 is provided at the bottom thereof to mesh with the screw groove 33 at the top of the movable part 3 to achieve fixation and adjustment of the ejector pin 31.

[0025] The upper end of the bellows 9 is fixedly connected to the bottom of the sealing gasket 34, and the lower end is fixedly connected to the bottom of the installation cavity 5. A third spring 91 is arranged inside the bellows 9, and the ends of the third spring 91 are respectively fixedly connected to the bottom of the sealing gasket 34 and the inner bottom wall of the bellows 9. Through the arrangement of the bellows 9 and the third spring 91, elastic support can be provided for the lifting and lowering of the movable part 3 (thrust pin 31). The bottoms of the installation cavity 5 and the bellows 9 are both through-arranged to facilitate ventilation to the inside of the bellows 9.

[0026] The mounting cavity 5 and the corrugated sleeve 9 are both annular and coaxial with the support shaft 21. The ejector pin 31 is matched with the through slot 22. The number of the screw slots 33 is equal to the number of the through slots 22. The number of the ejector pins 31 can be adjusted according to the specifications of the wafer 10 as required. The ejector pins 31 and the third spring 91 are distributed in an annular shape along the edge of the movable part 3 to ensure that the wafer 10 can be evenly supported to prevent it from tilting.

[0027] It should be noted that the movable part 3 and the top of the installation cavity 5, and the sealing gasket 34 and the inner wall of the installation cavity 5 are all connected by sliding sealing, which ensures the sealing of the inner wall of the installation cavity 5. Even if the corrugated sleeve 9 is accidentally ruptured, the gas can pass through the sealing gasket 34 to push the movable part 3 to move, with double-layer protection. When the third spring 91 is in the initial state, the top of the ejector pin 31 is located inside the through groove 22 and does not contact the wafer 10. At this time, the wafer 10 is supported by the planar part 2 and the suction cup 4. When the bottom of the movable part 3 contacts the top of the installation cavity 5, the top of the ejector pin 31 is located above the top of the planar part 2, ensuring that the wafer 10 can be effectively lifted up, which is convenient for external robot to pick up and place.

[0028] In this embodiment, initial state: in the initial state of the third spring 91, the top of the ejector pin 31 is located inside the through groove 22 and does not contact the wafer 10. The wafer 10 is stably supported by the planar portion 2 and the suction cup 4. At this time, the wafer 10 can be processed accordingly.

[0029] Lifting process: When the wafer 10 needs to be lifted in the semiconductor processing flow, the external driving mechanism (such as a compressed air source, etc.) starts to work and applies an upward force to the movable part 3. This force pushes the movable part 3 to slide upward along the mounting cavity 5. As the movable part 3 rises, the ejector pin 31 at its top also gradually rises along the through groove 22. When the top of the ejector pin 31 exceeds the top of the planar part 2, the ejector pin 31 contacts the bottom of the wafer 10 and continues to rise to lift the wafer 10. In this process, the third spring 91 is stretched to provide necessary elastic support and buffering for the lifting process. This elastic support helps to reduce the impact and vibration during the lifting process, thereby protecting the wafer 10 from damage.

[0030] Stable state: When the ejector pins 31 lift the wafer 10 to the required height, the external driving mechanism stops working. At this time, the wafer 10 is stably supported in the air by the ejector pins 31 and is separated from the plane part 2 and the suction cup 4. This stable state provides sufficient space and time for the external robot to safely pick up and place the wafer 10 for the next step of processing or transfer.

[0031] Descending process: After the processing or transfer of the wafer 10 is completed, it needs to be placed back on the plane part 2 and the suction cup 4. At this time, the external driving mechanism works in reverse to apply a downward force to the movable part 3. This force pushes the movable part 3 to slide downward along the installation cavity 5, and at the same time drives the ejector pin 31 to gradually descend. When the top of the ejector pin 31 returns to the inside of the through groove 22, the wafer 10 is supported by the plane part 2 and the suction cup 4 again.

[0032] It is worth noting that in addition to the third spring 91, the bellows 9 also plays a buffering role during the descent process. When the movable part 3 moves downward, the bellows 9 will be compressed, and the air or gas inside it will be compressed and produce a certain resistance. This resistance helps to slow down the descent speed of the movable part 3 and further protect the wafer 10 from sudden impact.

[0033] Double-layer sealing protection: First, the bellows 9 serves as the main elastic support and buffer element. Under normal circumstances, it can effectively absorb and disperse the impact and vibration during the lifting process. However, if the bellows 9 is accidentally ruptured due to some reason (such as aging, corrosion or external impact), the gas (usually an inert gas, such as nitrogen) can also apply pressure to the movable part 3 through the sealing pad 34. These gases act as additional driving force to push the movable part 3 and the ejector pin 31 thereon to continue moving. This double-layer protection mechanism ensures that even in extreme cases such as accidental rupture of the bellows 9, the wafer 10 can be safely lifted, supported and lowered. This design not only improves the reliability and safety of the equipment, but also reduces production interruptions and wafer 10 losses caused by failures.

[0034] Elastic support and buffering: The third spring 91 and the corrugated sleeve 9 provide elastic support and buffering effect for the lifting and lowering of the movable part 3, effectively reducing the vibration and impact during the lifting process and protecting the wafer 10 from damage.

[0035] Uniform support: The ejector pins 31 are distributed in a ring shape along the edge of the movable portion 3 and match the through grooves 22, thereby ensuring uniform support of the wafer 10 during the lifting process and avoiding the occurrence of side tilting.

[0036] Flexible adjustment: The number and height of the ejector pins 31 can be flexibly adjusted according to the specifications of the wafer 10, meeting the processing requirements of wafers 10 of different sizes and weights.

[0037] Example 2, refer to Figure 3-Figure 5The uniform flow ventilation component includes an air storage groove 6 arranged in the bottom of the process chamber 1, and the bottom wall of the air storage groove 6 is connected to a ventilation pipe 61. The ventilation pipe 61 is responsible for transporting the gas from the gas pump to the air storage groove 6. An exhaust ring groove 62 is opened on one side of the air storage groove 6 facing the outside of the plane portion 2. The uniform flow ventilation component also includes a boss 11 arranged at the bottom of the process chamber 1 and a limiting cavity 71 arranged at the bottom of the exhaust ring groove 62. The top of the limiting cavity 71 passes through the bottom wall of the exhaust ring groove 62. The bottom wall of the limiting cavity 71 is annularly connected with a plurality of first springs 72 along its edge, which are determined according to actual needs to ensure that the annular stopper 7 can evenly and stably seal the exhaust ring groove 62. The upper end of the first spring 72 is fixedly connected with an annular stopper 7, and the first spring 72 is used to support and adjust the position of the annular stopper 7.

[0038] Furthermore, the gas storage tank 6 has a certain height and is annularly arranged. The exhaust ring groove 62 is located at the bottom of the gas storage tank 6. The exhaust ring groove 62 is used to evenly discharge the gas in the gas storage tank 6 to the bottom area of ​​the installation cavity 5. The upper end of the ventilation pipe 61 is located in the middle of the gas storage tank 6. The lower end of the ventilation pipe 61 extends to the outside of the process cavity 1 to ensure that the gas will first diffuse above the gas storage tank 6 and gradually fill downward. The lower end of the ventilation pipe 61 is connected to the gas pump through a pipeline, and the end of the exhaust ring groove 62 is connected to the bottom of the installation cavity 5. The gas storage tank 6 is used to temporarily store the gas from the gas pump so that it can be evenly released into the corrugated sleeve 9 when needed.

[0039] It should be noted that one side of the annular stopper 7 facing the air storage groove 6 is prismatic, and the annular stopper 7 is annular and its cross-section is a right-angled trapezoid. As the gas is continuously introduced, the air pressure inside the air storage groove 6 will continue to increase. Under this pressure, the gas will be discharged outward through the exhaust ring groove 62 at its bottom. Since the exhaust ring groove 62 is a flat annular setting, the pressure of the gas discharged from the exhaust ring groove 62 will be large and uniform. At this time, this air pressure will act on the edge surface of the annular stopper 7 and gradually push it to move downward. Finally, the exhaust ring groove 62 will be fully opened, and the gas discharged through the exhaust ring groove 62 will gradually enter the corrugated sleeve 9 through the opening at the bottom of the mounting cavity 5, thereby pushing the movable part 3 to move upward. The top of the annular stopper 7 when the first spring 72 is in the initial state forms a contact seal with the top of the exhaust ring groove 62. The annular stopper 7, supported by the first spring 72, can move up and down and form a contact seal with the top of the exhaust ring groove 62 to prevent gas leakage.

[0040] In this embodiment, after the gas pump is started, the gas is transported to the gas storage tank 6 through the ventilation pipe 61. The gas will first diffuse above the gas storage tank 6 and gradually fill downward. Since the gas storage tank 6 is designed as an annular structure, the gas pressure in the gas storage tank 6 will gradually increase with the continuous input of gas, and the pressure increase is uniform, and no excessive pressure difference will be formed in a local area. This uniformly distributed gas pressure is crucial for the subsequent gas discharge and wafer 10 lifting process. It can ensure that when the gas is discharged outward through the exhaust ring groove 62, the pressure is uniform and stable, thereby pushing the movable part 3 on the corrugated sleeve 9 to move upward in a smooth manner, thereby reducing the friction and wear caused by uneven pressure release, which not only extends the service life of the equipment, but also improves the accuracy and stability of the wafer 10 lifting.

[0041] Gas discharge and sealing adjustment: After a certain air pressure threshold is reached inside the air storage groove 6, the gas will begin to look for a release channel. At this time, the exhaust ring groove 62 located at the bottom of the air storage groove 6 becomes the main path for gas discharge; since the exhaust ring groove 62 is designed as a flat annular structure, this design not only helps to evenly distribute the gas in the groove, but also enables the gas pressure discharged from the groove to remain relatively consistent and large. When the gas is discharged outward through the exhaust ring groove 62, it will directly act on the edge surface of the annular stopper 7. This edge surface design enables the annular stopper 7 to respond more effectively to changes in gas pressure.

[0042] As the gas pressure continues to increase, the annular stopper 7 will gradually move downward under the action of the gas pressure. In this process, the first spring 72 plays a key supporting and regulating role. On the one hand, it provides an initial supporting force for the annular stopper 7 to prevent it from moving at will when there is no gas pressure; on the other hand, it also allows the annular stopper 7 to move downward smoothly when the gas pressure is large enough, thereby gradually opening the exhaust ring groove 62.

[0043] When the annular stopper 7 is completely pushed to the bottom of its stroke, the exhaust annular groove 62 will be fully opened. At this time, the gas can quickly enter the interior of the corrugated sleeve 9 through the opening at the bottom of the installation cavity 5 at the maximum flow rate and pressure. This airflow forms pressure in the corrugated sleeve 9, thereby pushing the movable part 3 to move upward.

[0044] To sum up, the uniform ventilation assembly in this embodiment, through its unique structural design, can ensure that the movable part 3 is subjected to uniform and stable thrust during the rising process, thereby avoiding wear, tilting or jamming caused by uneven pressure. This not only extends the service life of the equipment, but also improves the accuracy and stability of the wafer 10 lifting. At the same time, only one gas pump is required to realize the gas transportation, storage and uniform discharge, without the need for an additional complex valve control system. This simplified design not only reduces the manufacturing cost and maintenance difficulty of the system, but also improves the reliability and stability of the system.

[0045] Example 3, refer to Figure 3-Figure 9 The air-blocking and exhausting assembly includes a sliding cavity 81, a vent groove 12 and a magnetic column 73 installed at the bottom of the annular block 7, a waist hole 74 is provided between the limiting cavity 71 and the sliding cavity 81, a second spring 82 is fixedly connected to the side wall of the sliding cavity 81 close to the waist hole 74, and a cut-off magnetic plate 8 is fixedly connected to the end of the second spring 82. The end of the vent groove 12 passes through the side walls of the process cavity 1 and the boss 11. At this time, the gas inside the corrugated sleeve 9 will be discharged through the vent groove 12, and its internal air pressure is consistent with the outside world. A filter plate 13 is installed at the bottom of the vent groove 12 to filter the gas entering the corrugated sleeve 9 to prevent impurities from entering.

[0046] It should be noted that the magnetic column 73 is located inside the first spring 72, the width of the intercepting magnetic plate 8 is greater than the width of the venting groove 12, ensuring that the venting groove 12 can be effectively blocked, the opposite surfaces of the magnetic column 73 and the intercepting magnetic plate 8 are magnetically arranged with the same polarity, the intercepting magnetic plate 8 in the initial state is located in the sliding cavity 81, and the bottom of the magnetic column 73 is located above the sliding cavity 81, at this time, the venting groove 12 is in a fully open state (refer to Figure 6 ), the internal air pressure of the corrugated sleeve 9 is consistent with the external environment, and a contact seal is formed between the intercepting magnetic plate 8 and the ventilation groove 12 when the magnetic column 73 is facing the intercepting magnetic plate 8. When the jacking starts, the gas pushes the annular stopper 7 and the magnetic column 73 to move downward. At this time, the first spring 72 is in a compressed state. After the magnetic column 73 moves downward, it will apply a repulsive magnetic force (greater than the elastic force of the second spring 82) to the intercepting magnetic plate 8, so that the intercepting magnetic plate 8 can block the ventilation groove 12 (refer to Fig. 9 ), ensuring that the gas can only enter the inside of the corrugated sleeve 9 at this time to complete the jacking action. When the ventilation is stopped, under the action of the first spring 72, the second spring 82, and the third spring 91, the device will return to its initial state, and the gas inside the corrugated sleeve 9 will be discharged through the ventilation groove 12, and no additional pump is needed for suction processing, thereby saving energy.

[0047] In this embodiment, in the initial state, the intercepting magnetic plate 8 is located in the sliding cavity 81 under the action of the second spring 82, and the bottom of the magnetic column 73 is located above the sliding cavity 81. The two are not in a directly facing state, so there is no significant magnetic repulsion between the two. At this time, the ventilation groove 12 is fully opened, and the internal air pressure of the corrugated sleeve 9 is consistent with the external pressure (refer to Figure 6 ).

[0048] Lifting starts: When the gas is transported to the gas storage tank 6 and pushes the annular stopper 7 to move downward, the magnetic column 73 moves downward and enters the bottom of the limiting cavity 71. Since the magnetic column 73 and the intercepting magnetic plate 8 are magnetically arranged with the same polarity, the magnetic column 73 will exert a repulsive force on the intercepting magnetic plate 8 through the waist hole 74 (the force is greater than the elastic force of the second spring 82), so the intercepting magnetic plate 8 is pushed to move in the sliding cavity 81 until it completely blocks the ventilation groove 12 (refer to Fig. 9 ), at this time, the gas can only enter the interior of the corrugated sleeve 9 through the exhaust ring groove 62, pushing the movable part 3 to move upward to complete the lifting action.

[0049] Lifting completion and reset: When ventilation stops, the device returns to its initial state under the joint action of the first spring 72 (restoring the position of the annular stopper 7), the second spring 82 (restoring the position of the intercepting magnetic plate 8) and the third spring 91 (restoring the position of the corrugated sleeve 9 and the movable part 3). At this time, the ventilation groove 12 is reopened, and the gas inside the corrugated sleeve 9 will be naturally discharged to the outside without the need for additional pumping treatment, thereby saving energy.

[0050] In summary, the air-blocking and air-exhaust assembly realizes the opening and closing control of the ventilation groove 12 during the jacking process through the magnetic control mechanism, ensuring the stable flow of gas during the jacking process, and automatically exhausts the gas after the jacking is completed without the need for additional pumping treatment, saving energy consumption, simplifying the overall structure, and reducing failure points and maintenance costs.

[0051] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0052] It should be noted that the specific model and specifications of the motor need to be selected and determined based on the actual specifications of the device, and the specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

[0053] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor wafer lifting device, comprising a process chamber (1), a support portion and a wafer (10), wherein the support portion is composed of a plane portion (2) and a support shaft (21), a suction cup (4) is mounted on the plane portion (2), the plane portion (2) is located in the process chamber (1) and is used to support the wafer (10), a plurality of through grooves (22) are correspondingly spaced apart in the plane portion (2) and the suction cup (4), the support shaft (21) is connected to the bottom of the plane portion (2) and extends from the inside of the process chamber (1) to the outside of the process chamber (1), It is characterized in that Also includes: Lifting assembly: the lifting assembly is arranged inside the process chamber (1), and is used to elastically lift the wafer (10); A uniform flow ventilation component: the uniform flow ventilation component is arranged inside the process chamber (1), and is used to ensure that the airflow acts evenly on the elastic lifting component; The air-blocking and exhaust-gas component is arranged at the bottom of the process chamber (1), and controls the air flow inside the lifting component according to the state of the uniform air flow component.

2. A semiconductor wafer lifting device according to claim 1, It is characterized in that The lifting assembly comprises a movable part (3), a mounting cavity (5) and a corrugated sleeve (9); the mounting cavity (5) is located in the bottom side wall of the process cavity (1); a sealing gasket (34) is installed at the bottom of the movable part (3); the top of the movable part (3) penetrates the inner bottom wall of the process cavity (1); a ejector pin (31) is installed at the top of the movable part (3); a screw rod (32) is arranged at the bottom of the ejector pin (31); and a screw groove (33) meshing with the screw rod (32) is arranged at the top of the movable part (3).

3. A semiconductor wafer lifting device according to claim 2, It is characterized in that The upper end of the corrugated sleeve (9) is fixedly connected to the bottom of the sealing gasket (34), and the lower end is fixedly connected to the bottom of the installation cavity (5). A third spring (91) is arranged inside the corrugated sleeve (9), and the ends of the third spring (91) are respectively fixedly connected to the bottom of the sealing gasket (34) and the inner bottom wall of the corrugated sleeve (9). The bottoms of the installation cavity (5) and the corrugated sleeve (9) are both through-arranged.

4. A semiconductor wafer lifting device according to claim 3, It is characterized in that The installation cavity (5) and the corrugated sleeve (9) are both annular and coaxial with the support shaft (21); the ejector pin (31) and the through slot (22) are arranged in a matching manner; the number of the screw grooves (33) and the through slot (22) are equal; and the ejector pin (31) and the third spring (91) are distributed in an annular shape along the edge of the movable portion (3).

5. The semiconductor wafer lifting device according to claim 3, It is characterized in that The movable portion (3) and the top of the mounting cavity (5), as well as the sealing gasket (34) and the inner wall of the mounting cavity (5) are all connected in a sliding seal; when the third spring (91) is in an initial state, the top of the ejector pin (31) is located inside the through groove (22); when the bottom of the movable portion (3) contacts the top of the mounting cavity (5), the top of the ejector pin (31) is located above the top of the plane portion (2).

6. The semiconductor wafer lifting device according to claim 2, It is characterized in that The uniform flow ventilation assembly comprises an air storage groove (6) arranged in the bottom of the process chamber (1), the bottom wall of the air storage groove (6) is connected to a ventilation pipe (61), and an exhaust ring groove (62) is provided on one side of the air storage groove (6) facing the outside of the plane portion (2).

7. A semiconductor wafer lifting device according to claim 6, It is characterized in that The air storage groove (6) has a certain height and is arranged in an annular shape. The exhaust annular groove (62) is located at the bottom of the air storage groove (6). The upper end of the ventilation pipe (61) is located in the middle of the air storage groove (6). The lower end of the ventilation pipe (61) extends to the outside of the process chamber (1). The lower end of the ventilation pipe (61) is connected to the air pump through a pipeline. The end of the exhaust annular groove (62) is connected to the bottom of the installation chamber (5).

8. The semiconductor wafer lifting device according to claim 6, It is characterized in that The uniform flow ventilation component further comprises a boss (11) arranged at the bottom of the process chamber (1) and a limiting cavity (71) arranged at the bottom of the exhaust ring groove (62); the top of the limiting cavity (71) penetrates the bottom wall of the exhaust ring groove (62); the bottom wall of the limiting cavity (71) is annularly connected to a plurality of first springs (72) along its edge; the upper end of the first spring (72) is fixedly connected to an annular stopper (7); the side of the annular stopper (7) facing the air storage groove (6) is prismatic; the annular stopper (7) is annular and has a right-angled trapezoidal cross section; the top of the annular stopper (7) when the first spring (72) is in an initial state forms a contact seal with the top of the exhaust ring groove (62).

9. The semiconductor wafer lifting device according to claim 8, It is characterized in that The air-blocking and exhaust-gas assembly comprises a sliding cavity (81) arranged at the bottom of the boss (11), a vent groove (12), and a magnetic column (73) installed at the bottom of the annular stopper (7); a waist hole (74) is provided between the limiting cavity (71) and the sliding cavity (81); a second spring (82) is fixedly connected to the side wall of the sliding cavity (81) close to the waist hole (74); the end of the second spring (82) is fixedly connected to a flow-blocking magnetic plate (8); the end of the vent groove (12) passes through the side walls of the process cavity (1) and the boss (11); and a filter plate (13) is installed at the bottom of the vent groove (12).

10. The semiconductor wafer lifting device according to claim 9, It is characterized in that The magnetic column (73) is located inside the first spring (72), the width of the intercepting magnetic plate (8) is greater than the width of the ventilation groove (12), the opposing surfaces of the magnetic column (73) and the intercepting magnetic plate (8) are magnetically arranged with the same polarity, the intercepting magnetic plate (8) in the initial state is located in the sliding cavity (81), the bottom of the magnetic column (73) is located above the sliding cavity (81), and when the magnetic column (73) and the intercepting magnetic plate (8) are facing each other, a contact seal is formed between the intercepting magnetic plate (8) and the ventilation groove (12).

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