Wafer loading and detecting integrated device and method

Abstract

The invention relates to the technical field of semiconductors, in particular to a wafer loading and detecting integrated device and method, and the method comprises the following steps: S10, a crown block carries a wafer box and reads the wafer box on a box carrying platform; s20, identifying and confirming the wafer box, and unlocking the locking mechanism; s30, the detection frame mechanism ascends to open the cover, and state information of the wafer box and the wafer is obtained; s40, the detection frame mechanism descends to close a cover, and state information of the wafer box and the wafer after operation is completed is obtained; s50, a locking mechanism carries out a box cover locking action; carrying the wafer box; according to the invention, bearing and wafer picking and placing result detection are integrated; compared with the prior art, the whole processing and manufacturing process is shortened, the wafer detection requirements in the wafer storage, wafer taking, cover opening and cover closing processes are considered, the wasted time and labor cost are reduced, the pollution and bending of the wafer and the subsequent larger quality risk caused by prominent storage are reduced on the aspect of entity, and the efficiency and quality of the wafer processing technological process are improved on the whole.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a wafer loading and detection integrated device and method. Background Art

[0002] In the semiconductor manufacturing process, wafer transportation is crucial to IC manufacturing. In order to ensure the quality of wafers when transported between different processes and to prevent them from being contaminated by dust or other pollutants, more and more wafers are transported in standard transport containers, namely wafer boxes, for temporary storage. During the wafer processing, it is necessary to transfer and load between multiple devices and equipment. The conventional operation method is to manually carry out the wafer box handling and opening and closing actions to adapt to each step in the processing project; however, frequent manual operations and turnover steps will increase human errors and cause unsustainable quality risks; The existing AGV carts can meet the needs of wafer box transportation. Their programmable and remotely controllable features can adapt to the transportation and transfer needs in various application scenarios and improve the efficiency of turnover transportation. However, the opening and closing of wafer boxes are still mainly manual operations. Therefore, there is an urgent need for a customized box opening platform or device that can be adapted to the automated AGV cart to reduce manual operations and improve the overall automation coverage of wafer processing. Summary of the invention

[0003] The object of the present invention is to provide a wafer loading and testing integrated device and method with a simplified structure, reasonable design and rich functional integration.

[0004] To achieve the above object, the present invention provides the following technical solutions: A wafer loading and detection method includes a box reading platform, a detection frame mechanism and a lifting assembly; the box reading platform includes a locking mechanism, the detection frame mechanism includes a seat edge portion for guiding the wafer box, a bellows side plate for supporting the seat edge portion, and a lifting back plate for driving the bellows side plate and the seat edge portion to move; a wafer box state sensor and a wafer protrusion sensor are arranged on the bellows side plate. The method steps are as follows: S10, the overhead crane transports the wafer box to the top of the box reading platform, and the detection frame mechanism guides the wafer box to be placed on the box reading platform.

[0005] S20, the box reader stage identifies and confirms the wafer box, and the locking mechanism unlocks the wafer box cover; S30, the lifting assembly drives the detection frame mechanism to carry the wafer box cover to rise and open the cover; at the same time, the wafer box status sensor and the wafer protrusion sensor obtain the wafer box and wafer status information; S40, wait until the operation of the external device is completed; the lifting assembly drives the detection frame mechanism to carry the wafer box cover down and close the cover, and the wafer box status sensor and the wafer protrusion sensor obtain the wafer box and wafer status information after the operation is completed again; S50, after the inspection is completed, the locking mechanism on the reading box carrier performs the box cover locking action; wait for the overhead crane to move the wafer box to complete the next work cycle; Further, the box reading platform includes a platform plate body, and the platform plate body is provided with at least one sensing part for reading the label at the bottom of the wafer box and an adjusting member for fine-tuning the height of the platform plate body; the locking mechanism is installed on the lower end surface of the platform plate body; S20 specifically comprises: S21, the sensing unit reads, identifies and compares the bottom of the wafer box; S22, after identification and confirmation, the locking mechanism unlocks the bottom of the wafer box; Furthermore, the locking mechanism includes a locking base 332 for mounting a locking rod, a locking drive for driving the locking base, and a locking sensor for detecting that the locking base 332 has moved into position.

[0006] Furthermore, the specific steps of S30 are as follows: S31, the cover grabbing mechanism grabs and fixes the top of the wafer box cover; S32, the lifting assembly drives the lifting back plate and then drives the bellows side plate; S33, detecting the status of the wafer box and the wafer by a round box status sensor and a wafer protrusion sensor installed on the inner side wall of the wind box side plate; Furthermore, the lifting assembly includes a lifting drive, a transmission wheel group driven by the lifting drive, and a transmission screw connected to the transmission wheel group; the lifting drive and the transmission wheel group are both installed in a mounting cavity built into the base frame, and the lifting back plate is fixedly connected to the lifting block installed on the transmission screw; the lifting back plate and the back plate are slidably connected by a lifting slide rail; Further, the seat edge portion includes a seat edge frame for guiding the wafer box cover and a seat edge bottom plate for supporting the seat edge frame; the seat edge frame is a split structure, the seat edge bottom plate is a hollow rectangular frame, and the seat edge frame is symmetrically installed on the upper end surfaces of two opposite sides of the seat edge bottom plate; a group of mapping sensors are arranged below the seat edge bottom plate; Furthermore, the seat edge frame has a built-in cavity, which forms a mounting cavity with the seat edge bottom plate, and a cover grabbing mechanism is installed in the mounting cavity; the cover grabbing mechanism includes a cover body lock tongue rotatably mounted on the seat edge bottom plate, a lock tongue driver driving the cover body lock tongue to rotate, and a lock tongue sensor detecting whether the cover body lock tongue is in place; Furthermore, the moving end of the lock tongue drive is connected to the lock tongue pull rod, and the end of the lock tongue pull rod is installed with a lock tongue connecting rod and a lock tongue sensing piece; one end of the lock tongue connecting rod is fixedly connected to the lock tongue pull rod, and the other end is rotatably connected to the cover body lock tongue; when the cover body lock tongue reaches the specified position, the lock tongue sensing piece enters the sensing area of ​​the lock tongue sensor; A wafer loading and detection integrated device comprises a base frame and a back plate, and is used to implement the wafer loading and detection method described above. The base frame has a built-in mounting cavity, and the mounting cavity is provided with a box reading carrier for carrying and identifying a wafer box, and a detection frame mechanism for detecting the wafer box and the wafer; the detection frame mechanism is covered on the periphery of the box reading carrier, and the detection frame mechanism is driven by a lifting component to perform a lifting action on the front end surface of the back plate.

[0007] Furthermore, the inner wall of the base frame is provided with a reinforcing side plate and auxiliary columns; Compared with the prior art, the beneficial effects of the present invention are as follows.

[0008] In the specific application of the method described in the present invention, the external overhead crane moves the wafer box and the internal wafers as a whole to the top of the box reading platform to realize the loading and temporary storage of the wafer box. The box reading platform identifies and checks the wafer box. After confirming that it is correct, the wafer box is unlocked. After unlocking, the lifting component drives the detection frame mechanism to lift and open the box cover. The detection frame mechanism detects the wafer box and the wafers in the process of lifting and opening the box and closing the box. The overall method is ingeniously conceived, integrating the transfer load of the wafer box with the inspection of wafer handling and placement results after the wafer box is opened; shortening the overall processing and manufacturing process, taking into account the wafer inspection needs during wafer storage, retrieval, opening and closing, reducing the time and labor costs wasted in multiple inspection operations during the manufacturing and processing of wafers, and physically reducing the contamination, bending, and storage protrusions of the wafers that cause greater subsequent quality risks, thereby improving the efficiency and quality of the wafer processing process as a whole. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is an overall oblique schematic diagram of the present invention; Figure 2 It is a schematic diagram of the present invention after the bottom frame is partially hidden; Figure 3 is a schematic diagram of a lifting assembly portion of the present invention; Figure 4 This is a schematic diagram of the hidden back panel of the present invention; Figure 5 It is a structural schematic diagram of the box reading platform of the present invention; Figure 6 It is a schematic diagram of an oblique upward view of a box reading platform of the present invention; Figure 7 It is a structural schematic diagram of the detection framework mechanism of the present invention; Figure 8 It is a schematic diagram of the detection frame mechanism of the present invention after part of it is hidden. DETAILED DESCRIPTION

[0010] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0011] refer to Figure 1-Figure 8 As shown, a wafer loading and detection method includes a reading box carrier 3, a detection frame mechanism 4 and a lifting assembly; the reading box carrier 3 includes a locking mechanism 33, including the reading box carrier 3, the detection frame mechanism 4 and the lifting assembly; the reading box carrier 3 includes a locking mechanism 33, the detection frame mechanism 4, the detection frame mechanism 4 includes a seat edge portion 41 for guiding the wafer box, a bellows side plate 42 for supporting the seat edge portion 41, and a lifting back plate 43 for driving the bellows side plate 42 and the seat edge portion 41 to move; a wafer box state sensor 47 and a wafer protrusion sensor 48 are provided on the bellows side plate 42. The method steps are as follows: S10, the overhead crane transports the wafer box to the top of the reading box carrier 3, and the detection frame mechanism 4 guides the wafer box to be placed on the reading box carrier 3. S20, the reading box carrier 3 identifies and confirms the wafer box, and the locking mechanism 33 unlocks the wafer box cover; S30, the lifting component drives the detection frame mechanism 4 to carry the wafer box cover to rise and open the cover; at the same time, the wafer box state sensor 47 and the wafer protrusion sensor 48 obtain the wafer box and wafer state information; S40, wait for the external device operation to be completed; the lifting component drives the detection frame mechanism 4 to carry the wafer box cover to descend and close the cover, and the wafer box state sensor 47 and the wafer protrusion sensor 48 again obtain the wafer box and wafer state information after the operation is completed; S50, after the detection is completed, the locking mechanism 33 on the reading box carrier 3 performs the box cover locking action; wait for the overhead crane to transport the wafer box to complete the next work cycle.

[0012] In actual use, the industrial control host 6 performs communication control, and the external crane moves the wafer box and the internal wafers as a whole to the top of the box reading stage 3 to realize the carrying and temporary storage of the wafer box. The box reading stage 3 identifies and proofreads the wafer box. After confirming that it is correct, the wafer box is unlocked. After unlocking, the lifting component drives the detection frame mechanism 4 to lift and open the box cover. The detection frame mechanism 4 detects the wafer box and the wafers in the process of lifting and opening the box. The overall method is ingeniously conceived, integrating the transfer load of the wafer box with the inspection of wafer handling and placement results after the wafer box is opened; the overall processing and manufacturing process takes into account the wafer inspection needs during wafer storage, retrieval, opening and closing, reducing the time and labor costs wasted in multiple inspection operations during the manufacturing and processing of wafers, and physically reducing the contamination, bending, and storage protrusions of the wafers that cause greater quality risks in the future, thereby improving the efficiency and quality of the wafer processing process as a whole.

[0013] In this embodiment, the box reading platform 3 includes a platform plate 31, and the platform plate 31 is provided with at least one sensing portion 311 for reading the label at the bottom of the wafer box and an adjusting member 312 for fine-tuning the height of the platform plate 31; the locking mechanism 33 is installed on the lower end surface of the platform plate 31; S20 specifically comprises the following steps: S21, the sensing unit 311 reads, identifies and compares the bottom of the wafer box; S22, after identification and confirmation, the locking mechanism 33 unlocks the bottom of the wafer box; In the specific steps, the stage plate 31 is used to carry the wafer box from the overhead crane. The bottom of the wafer box is pre-installed with an RFID electronic tag. The sensor 311 reads the information of the wafer box to obtain and record the batch and related model information of the incoming wafer box. In this embodiment, at least one group of antenna mounting grooves 313 is provided under each of the sensing parts 311, and the antenna mounting grooves 313 are used to install a reading antenna 34 for reading the electronic tag of the wafer box; providing multiple groups of antenna mounting grooves 313 can ensure that the installation position of the reading antenna 34 can be adjusted as needed to adapt to wafer boxes of different sizes and wafer boxes with different label positions, thereby improving the adaptability of the component to wafer boxes of various types and sizes, realizing multiple uses of one machine, and reasonably saving costs.

[0014] In this embodiment, the adjusting member 312 is an adjusting top screw installed in the countersunk groove, and the adjusting top screw is used to connect the platform plate 31 and the platform frame 35; the platform frame 35 is composed of three plates spliced ​​into an arch shape; the adjusting member 312 is arranged at the four end corners of the end face of the platform plate 31, and by rotating and adjusting the adjusting top screws at different positions, the horizontal plane of the platform plate 31 can be fine-tuned at different heights and inclination angles as needed to adapt to other equipment at the front or back end, ensuring that the overall processing flow is on the same level.

[0015] In this embodiment, the locking mechanism 33 includes a locking base 332 for installing the locking rod 32, a locking drive 331 for driving the locking base 332 to rotate, and a locking sensor 333 for detecting that the locking base 332 rotates to a specified position; the locking drive 331 and the locking sensor 333 are both fixed on the lower end surface of the carrier plate 31, and the locking base 332 is rotatably installed on the lower end surface of the carrier plate 31; the locking drive 331 can use a motor, and the motor uses a belt to drive the locking base 332 to rotate at a predetermined angle. The locking base 332 rotates to drive the locking rod 32 to rotate. The locking rod 32 is usually extended into the corresponding operating hole or operating groove on the wafer box, and rotates to realize the locking and opening of the box cover of the wafer box.

[0016] In this embodiment, a locking paddle 334 is provided at the bottom of the locking base 332, and the locking paddle 334 is used to trigger the locking sensor 333; when the locking base 332 rotates, it rotates with the locking paddle 334, and when the locking paddle 334 rotates, it passes through the locking sensor 333, thereby triggering the locking sensors 333 installed at different positions, so as to realize the detection and judgment of different actions, ensure that the locking and opening actions can be converted into control signals, and facilitate the integration of this component into the overall automation equipment and system.

[0017] In this embodiment, the locking sensor 333 is a slot-type photoelectric switch.

[0018] The wafer box is identified and recorded by the box reading platform 3, and after confirmation, the bottom of the wafer box is unlocked; after unlocking, the lifting component further drives the detection frame mechanism 4 to perform synchronous lifting detection.

[0019] In this embodiment, the detection frame mechanism 4 includes a seat edge portion 41 for guiding the wafer box, a bellows side plate 42 for supporting the seat edge portion 41, and a lifting back plate 43 for driving the bellows side plate 42 and the seat edge portion 41 to move, and the lifting assembly drives the lifting back plate 43 to reciprocate; the wafer box status sensor 47 and the wafer protrusion sensor 48 are installed on the inner wall of the bellows side plate 42; and the inner cavity of the seat edge portion 41 is provided with a grabbing cover mechanism 44.

[0020] Furthermore, the specific steps of S30 are as follows: S31, the cover grabbing mechanism 44 grabs and fixes the top of the wafer box cover; S32, the lifting assembly drives the lifting back plate 43 and then drives the bellows side plate 42; S33, the wafer box status sensor 47 and the wafer protrusion sensor 48 installed on the inner wall of the wind box side plate 42 perform status detection of the wafer box and the wafer; When opening the cover to inspect the wafer, the cover grabbing mechanism 44 locks and grabs the wafer box cover, and the lifting assembly drives the lifting back plate 43 to move, thereby driving the bellows side plate 42 and the seat edge 41 to lift and lower together. During the lifting process, the wafer box status sensor 47 and the wafer protrusion sensor 48 detect the status of the wafer. The seat edge 41 includes a seat edge frame 411 for guiding the wafer box cover and a seat edge bottom plate 412 for supporting the seat edge frame 411; the seat edge frame 411 is a split structure, and the seat edge bottom plate 412 is a hollow rectangular frame, and the seat edge frame 411 is symmetrically installed on the upper end surfaces of the two opposite sides of the seat edge bottom plate 412; the split seat edge frame 411 reduces the side panels on both sides, further increases the compatibility with various types of overhead cranes, and further simplifies the internal wiring.

[0021] The wafer box status sensor 47 is any one of the photoelectric, magnetic or mechanical in-place sensing sensors. When the wafer box is placed in a specified position, the signal emitted by the sensor will change, such as blocking light, changing the magnetic field distribution, etc. The sensor receives these changed signals and processes them to determine whether the wafer box is in place; the wafer protrusion sensor 48 includes but is not limited to laser displacement sensors, spectral confocal sensors, photoelectric sensors, etc., which are used to detect unreasonable offset and convexity of the wafer after and during the placement of the wafer in the wafer box to avoid damage to the wafer.

[0022] A wire avoidance groove 421 is provided at the upper edge of the inner end surface of the bellows side panel 42, and a plurality of equally spaced mounting holes 422 are provided in the wire avoidance groove 421, and the mounting holes 422 are used for assembling and fixing at least one set of first brackets 471 and second brackets 481; the wire avoidance groove 421 can reasonably and effectively store wires, thereby improving the efficiency of installation, wiring, and subsequent maintenance and inspection.

[0023] In this embodiment, the first bracket 471 and the second bracket 481 are used to assemble and fix the wafer box state sensor 47 and the wafer protrusion sensor 48. In this embodiment, the seat edge frame 411 is provided with a code scanning device 45; the code scanning device 45 can scan the identification code on the wafer box cover to obtain the number and identification information of the wafer box.

[0024] In the specific steps, the seat edge 41 guides and places the auxiliary wafer box on the carrier plate 31. When it is necessary to open the cover for inspection, the wafer box cover is locked by the cover grabbing mechanism 44, and the external lifting component drives the lifting back plate 43 to rise and fall at a uniform speed. During the lifting process, the wafer box cover is grabbed by the cover grabbing mechanism 44, and the bellows side plate 42 also rises and falls together. The wafer box cover is made of transparent material. The wafer box status sensor 47 and the wafer protrusion sensor 48 also perform reciprocating scanning detection on the wafer box and the wafers in the wafer box during the lifting process; the status information of the wafer box and the wafer is obtained as needed to avoid bending, displacement and protrusion of the wafer during the swing and transportation process.

[0025] In this embodiment, the lifting assembly includes a lifting drive 51, a transmission wheel group 52 driven by the lifting drive 51, and a transmission screw 54 connected to the transmission wheel group 52; the lifting drive 51 and the transmission wheel group 52 are both installed in the installation cavity built into the base frame 1, and the lifting back plate 43 is fixedly connected to the lifting block 53 installed on the transmission screw 54; the lifting back plate 43 and the back plate 2 are slidably connected by a lifting slide rail 55; the lifting slide rail 55 is a double-track and double-drag chain design, respectively on both sides of the back plate 2, and the double-drag chain and double-track design ensures that the lifting back plate 43 can perform stable lifting and lowering movements, thereby ensuring the stability and safety of the overall operation.

[0026] In this embodiment, the seat edge portion 41 includes a seat edge frame 411 for guiding the wafer box cover and a seat edge bottom plate 412 for supporting the seat edge frame 411; the seat edge frame 411 is a split structure, the seat edge bottom plate 412 is a hollow rectangular frame, and the seat edge frame 411 is symmetrically installed on the upper end surfaces of the two opposite sides of the seat edge bottom plate 412; a group of mapping sensors 46 are arranged under the seat edge bottom plate 412; the split seat edge frame 411 reduces the side plates on both sides, further increases the compatibility with various types of overhead cranes, and further simplifies the internal wiring; the mapping sensor 46 is an optical reflective sensor, which can detect the surface of the wafer during the lifting and scanning detection to determine whether there are defects, scratches, contamination and other problems, to ensure that the quality of the wafer meets the production requirements.

[0027] In this embodiment, the seat edge frame 411 has a built-in cavity, which forms an installation cavity with the seat edge bottom plate 412, and a cover grabbing mechanism 44 is installed in the installation cavity; the cover grabbing mechanism 44 includes a cover body lock tongue 446 rotatably installed on the seat edge bottom plate 412, a lock tongue drive 441 that drives the cover body lock tongue 446 to rotate, and a lock tongue sensor 442 that detects whether the cover body lock tongue 446 is in place; the moving end of the lock tongue drive 441 is connected to the lock tongue pull rod 443, and the end of the lock tongue pull rod 443 is installed with a lock tongue connecting rod 444 and a lock tongue sensor sheet 445; one end of the lock tongue connecting rod 444 is fixedly connected to the lock tongue pull rod 443, and the other end is rotatably connected to the cover body lock tongue 446; when the cover body lock tongue 446 reaches the finger The locking tongue sensor 445 is in a fixed position, and the locking tongue sensor 445 enters the sensing area of ​​the locking tongue sensor 442; the locking tongue driver 441 is a cylinder or an electric cylinder, and the locking tongue sensor 442 is a photoelectric sensor. When the locking tongue driver 441 pulls the locking tongue pull rod 443, it drives the locking tongue connecting rod 444 to pull and rotate the cover body locking tongue 446, so as to realize the rotation of the cover body locking tongue 446 to grab and lock the wafer box cover. At the same time, the locking tongue pull rod 443 drives the locking tongue sensor 445 to move, and the locking tongue sensor 445 further triggers the locking tongue sensor 442; the setting of the locking tongue sensor 442 can obtain the opening and closing state of the wafer cover, thereby ensuring the precision and accuracy of the subsequent automated action integration.

[0028] A wafer loading and testing integrated device, comprising a base frame 1 and a back plate 2, for implementing the wafer loading and testing method described above, wherein the base frame 1 has a built-in mounting cavity, in which a reading box carrier 3 for carrying and identifying a wafer box and a detection frame mechanism 4 for detecting the wafer box and the wafer are arranged; the detection frame mechanism 4 is covered on the periphery of the reading box carrier 3, and the detection frame mechanism 4 is driven by a lifting component to perform a lifting action on the front end surface of the back plate 2; During loading and testing, the box reading platform 3 carries and fixes the wafer box, and the lifting assembly drives the testing frame mechanism 4 to open the wafer box and perform testing operations.

[0029] The industrial control host 6 is mounted on the outer wall of the chassis 1. The industrial control host 6 includes E84Port, SMIFPort and Host interface. The E84Port has the ability to communicate with the automated material handling system AMHS and the machine loading port LP. The SMIFPort is mainly used for the switch operation of the SMIF PODStandard Mechanical Interface Pod, and scans the wafer distribution status in the process; the Host has the ability to communicate with the PC end, which is convenient for the equipment to upgrade and maintain subsequent programs and further improve the expansion capability.

[0030] In this embodiment, the inner wall of the base frame 1 is provided with reinforced side panels 11 and auxiliary columns 12; the addition of reinforced side panels 11 and auxiliary columns 12 to the inner wall of the base frame 1 can effectively ensure the structural strength of the base frame 1 and avoid quality accidents in wafer box placement and subsequent processing operations due to deformation of the base frame 1.

[0031] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways without departing from the scope defined by the spirit of the present invention.

Claims

1. A wafer loading and testing method, characterized in that: The invention comprises a reading box carrier (3), a detection frame mechanism (4) and a lifting assembly; the reading box carrier (3) comprises a locking mechanism (33), the detection frame mechanism (4), the detection frame mechanism (4) comprises a seat edge portion (41) for guiding the wafer box, a bellows side plate (42) for supporting the seat edge portion (41), and a lifting back plate (43) for driving the bellows side plate (42) and the seat edge portion (41) to move; a wafer box state sensor (47) and a wafer protrusion sensor (48) are arranged on the bellows side plate (42). The method steps are as follows: S10, the overhead crane transports the wafer box to the top of the box reading platform (3), and the detection frame mechanism (4) guides the wafer box to be placed on the box reading platform (3); S20, the box reading platform (3) identifies and confirms the wafer box, and the locking mechanism (33) unlocks the wafer box cover; S30, the lifting assembly drives the detection frame mechanism (4) to carry the wafer box cover to rise and open the cover; At the same time, the wafer box status sensor (47) and the wafer protrusion sensor (48) obtain the wafer box and wafer status information; S40, waiting for the external device operation to be completed; The lifting assembly drives the detection frame mechanism (4) to carry the wafer box cover down and close the cover, and the wafer box status sensor (47) and the wafer protrusion sensor (48) are used to obtain the wafer box and wafer status information after the operation is completed; S50, after the inspection is completed, the locking mechanism (33) on the reading box carrier (3) performs a box cover locking action; and waits for the overhead crane to move the wafer box to complete the next work cycle.

2. A wafer loading and testing method according to claim 1, characterized in that: The box reading platform (3) comprises a platform plate (31), the platform plate (31) being provided with at least one sensing portion (311) for reading a label at the bottom of a wafer box and an adjusting member (312) for fine-tuning the height of the platform plate (31); the locking mechanism (33) is mounted on the lower end surface of the platform plate (31); the specific steps of S20 are: S21, the sensing unit (311) reads, identifies and compares the bottom of the wafer box; S22, after identification and confirmation, the locking mechanism (33) unlocks the bottom of the wafer box.

3. A wafer loading and testing method according to claim 2, characterized in that: The locking mechanism (33) comprises a locking base (332) for mounting a locking rod (32), a locking drive (331) for driving the locking base (332), and a locking sensor (333) for detecting that the locking base (332) has moved into position.

4. A wafer loading and testing method according to claim 1, characterized in that: The specific steps of S30 are as follows: S31, the cover grabbing mechanism (44) grabs and fixes the top of the wafer box cover; S32, the lifting assembly drives the lifting back plate (43) and then drives the bellows side plate (42); S33, the wafer box status sensor (47) and the wafer protrusion sensor (48) installed on the inner wall of the wind box side plate (42) perform status detection of the wafer box and the wafer.

5. The wafer loading and testing method according to claim 1, characterized in that: The lifting assembly comprises a lifting drive (51), a transmission wheel group (52) driven by the lifting drive (51), and a transmission screw (54) connected to the transmission wheel group (52); the lifting drive (51) and the transmission wheel group (52) are both installed in a mounting cavity built into the base frame (1); the lifting back plate (43) is fixedly connected to a lifting block (53) installed on the transmission screw (54); the lifting back plate (43) and the back plate (2) are slidably connected by means of a lifting slide rail (55).

6. A wafer loading and testing method according to claim 1, characterized in that: The seat edge portion (41) comprises a seat edge frame (411) for guiding the wafer box cover and a seat edge base plate (412) for supporting the seat edge frame (411); the seat edge frame (411) is a split structure, the seat edge base plate (412) is a hollow rectangular frame, and the seat edge frame (411) is symmetrically mounted on the upper end surfaces of two opposite sides of the seat edge base plate (412); a group of mapping sensors (46) are arranged below the seat edge base plate (412).

7. A wafer loading and testing method according to claim 6, characterized in that: The seat edge frame (411) has a built-in cavity, and forms a mounting cavity with the seat edge bottom plate (412), in which a cover grabbing mechanism (44) is installed; the cover grabbing mechanism (44) comprises a cover body lock tongue (446) rotatably mounted on the seat edge bottom plate (412), a lock tongue drive (441) for driving the cover body lock tongue (446) to rotate, and a lock tongue sensor (442) for detecting whether the cover body lock tongue (446) is in place.

8. A wafer loading and testing method according to claim 7, characterized in that: The moving end of the lock tongue drive (441) is connected to the lock tongue pull rod (443), and the end of the lock tongue pull rod (443) is installed with a lock tongue connecting rod (444) and a lock tongue sensing plate (445); one end of the lock tongue connecting rod (444) is fixedly connected to the lock tongue pull rod (443), and the other end is rotatably connected to the cover body lock tongue (446); when the cover body lock tongue (446) reaches a specified position, the lock tongue sensing plate (445) enters the sensing area of ​​the lock tongue sensor (442).

9. A wafer loading and testing integrated device, comprising a base frame (1) and a back plate (2), characterized in that: Used to implement the wafer loading and detection method described in any one of claims 1 to 8, the base frame (1) has a built-in mounting cavity, and the mounting cavity is provided with a box reading platform (3) for carrying and identifying a wafer box and a detection frame mechanism (4) for detecting the wafer box and the wafer; the detection frame mechanism (4) is covered on the periphery of the box reading platform (3), and the detection frame mechanism (4) is driven by a lifting component to perform a lifting action on the front end surface of the back plate (2).

10. The wafer loading and testing integrated device according to claim 9, characterized in that: The inner wall of the base frame (1) is provided with a reinforcing side plate (11) and an auxiliary column (12).

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