Built-in self-test repairing method for PE matrix of AI accelerator chip
By introducing built-in self-testing and self-repair circuits into the AI accelerator chip, using scan test generators and redundant computing units, the problem of large area of test circuit modules and external diagnostic dependence is solved, improving chip yield and reducing manufacturing costs .
Patent Information
- Application Number
- CN202411036803.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2044-07-31
AI Technical Summary
The test circuit module area of existing AI accelerator chips accounts for a large proportion, resulting in a significant increase in the chip area. It is necessary to diagnose the faulty PE computing unit through external software, resulting in a decrease in yield rate and an increase in manufacturing costs.
Using built-in self-testing and self-repair methods of AI accelerator chip PE matrix, built-in self-testing and self-repair through scanning test generators, configurable PE computing unit, output response comparator, fault PE diagnostics and redundant computing unit, the built-in self-testing and self-repairing unit is realized through scanning test generators, configurable PE computing unit, output response comparator, fault PE diagnostics and redundant computing units. Fixed to reduce external software dependencies and circuit area.
It effectively reduces the proportion of circuit module area, improves the chip yield, reduces the manufacturing cost, and reduces the number of failed PE computing units, and improves the calculation accuracy.
Smart Images

Figure CN119248544A_ABST
Abstract
Citation Information
Patent Citations
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