Capacitor pin pre-shaping device

Abstract

The invention relates to the technical field of capacitor processing, and discloses a capacitor pin pre-shaping device which comprises a rack, a bending assembly is installed on the rack, a sliding rail assembly is arranged on one side of the bending assembly, and a positioning mechanism used for clamping a capacitor body is installed on the sliding rail assembly. The positioning mechanism comprises a base connected with the sliding rail assembly, and a positioning seat capable of ascending and descending is mounted on the base; a guide hole is formed in the positioning seat, and a top plate is embedded in the guide hole; a pressing mechanism is further arranged above the positioning mechanism, the capacitor body is clamped on a positioning seat of the positioning mechanism, and along with the backward movement of the capacitor body along the sliding rail assembly, the pin body interferes with the bending assembly, so that the pin body is bent for the first time; then, a pressing block of the downward pressing mechanism drives the positioning seat to move downwards, so that the top plate protrudes out of the guide hole, and secondary bending is conducted on the pin body; according to the device, secondary bending of the pin body can be achieved, and the application range of customized shaping of the capacitor pin is greatly widened.

Description

Technical Field

[0001] The invention relates to the technical field of capacitor processing, and in particular to a capacitor pin pre-shaping device. Background Art

[0002] The two pins of the capacitor are connected to different nodes in the circuit, connecting the internal plate of the capacitor with the external circuit. The common shape of capacitor pins is straight, but some special types of capacitors, such as surface mount capacitors (SMC / SMD), have flat metal electrodes. This shape is suitable for direct mounting on the surface of the printed circuit board (PCB) through processes such as reflow soldering; and for plug-in capacitors, in addition to straight pins, there are some that may have bent shapes. For example, in some cases where the capacitor needs to be installed in a specific position and avoid other components, the pins may be bent at a certain angle (such as Fig. 9 as shown).

[0003] In order to shape the pins of the capacitor into a specified shape for easy welding; for example, a Chinese patent with publication number CN205798242U disclosed a capacitor pin shaping device on December 14, 2016, including: a positioning seat for positioning the capacitor, two bending mechanisms symmetrically arranged on both sides of the positioning seat, and a pressure seat arranged directly above the positioning seat; the positioning seat includes a positioning block, and two limit blocks symmetrically arranged on the top surface of the positioning block, both limit blocks are provided with a receiving groove and a pin groove connected, the positioning block is provided with two symmetrically arranged rotating holes, and the front of the two limit blocks is provided with a bending end face; the bending mechanism includes a driving cylinder, a telescopic plate, a connecting block, a pin shaft and a rotating shaft. The capacitor pin shaping device is safe, reliable, convenient and efficient.

[0004] The capacitor pin shaping device disclosed in the above patent can only perform certain bending and shaping on the capacitor pins, and cannot meet the customization requirements for the pins with raised parts in the middle after bending. Summary of the invention

[0005] The purpose of the present invention is to overcome the shortcomings of the prior art and to provide a capacitor pin pre-shaping device. During the process of the positioning mechanism moving backward along the slide rail assembly, the pin body is initially bent and perpendicular to the axis of the capacitor body under the interference of the bending assembly. Then, the pressing block of the pressing mechanism drives the positioning seat to move downward, so that the top plate protrudes from the guide hole and the pin body is bent for the second time.

[0006] In order to achieve the above object, the technical solution adopted by the present invention is: A capacitor pin pre-shaping device comprises a frame, on which a bending assembly is installed, a slide rail assembly is arranged on one side of the bending assembly, and a positioning mechanism for clamping a capacitor body is installed on the slide rail assembly; the positioning mechanism comprises a base connected to the slide rail assembly, and a positioning seat that can be raised and lowered is installed on the base, and when the positioning mechanism moves backward along the slide rail assembly, the bending assembly can bend the pin body at the end of the capacitor body; a guide hole is opened on the positioning seat, and a top plate is slidably embedded in the guide hole; a pressing mechanism is also arranged above the positioning mechanism, and the pressing mechanism comprises a pressing block that can be raised and lowered; and when the pressing block is pressed downward to drive the positioning seat to move downward, the upper end of the top plate protrudes from the guide hole and bends the pin body for a second time.

[0007] Optionally, a groove is formed on the base, a guide column is fixedly installed in the groove, the guide column slides through the positioning seat, and a spring is sleeved on the guide column, and the spring is located between the base and the positioning seat.

[0008] Optionally, a positioning groove for accommodating the capacitor body is formed on the positioning seat, a positioning notch for the pin body to pass through is formed on the side wall of the positioning groove, a positioning block is provided on the front side of the positioning notch, and the guide hole is located between the positioning notch and the positioning block.

[0009] Optionally, a pressure plate capable of being flipped in the longitudinal direction is also mounted on the positioning seat, and a pad capable of contacting the capacitor body is disposed at the bottom of the pressure plate.

[0010] Optionally, the bending assembly includes a support plate fixedly connected to the frame, a bending plate is installed on the top of the support plate, a limiting groove is opened at the bottom of the end of the bending plate, and the pin body passes through the limiting groove.

[0011] Optionally, a support frame is fixedly mounted on the frame, the pressing mechanism is mounted on the support frame, and the positioning mechanism is located on the inner side of the support frame.

[0012] Optionally, the pressing mechanism includes a first linear module installed on the top of the support frame, the output end of the first linear module extends to the inner side of the support frame and is connected to a bracket, the pressing block is installed at the bottom of the bracket, and the pressing block can contact the positioning seat.

[0013] Optionally, a slide groove is provided at the front end of the positioning seat, a receiving tray connected to the slide groove is installed at the front end of the base, and a cutting mechanism for cutting off the excess length of the pin body is also installed on the bracket.

[0014] Optionally, the cutting mechanism includes a second linear module mounted on the bracket, an output end of the second linear module is connected to a cutter, and a distal end of the cutter can extend into the slide groove.

[0015] Beneficial Effects

[0016] (1) In the present invention, the capacitor body is clamped on the positioning seat of the positioning mechanism. As it moves backward along the slide rail assembly, the pin body interferes with the bending assembly so that the pin body completes the initial bending. Then, the pressing block of the pressing mechanism drives the positioning seat to move downward, so that the top plate protrudes from the guide hole and performs a secondary bending on the pin body. The device has a compact structure and is easy to operate. It can also achieve secondary bending of the pin body, greatly improving the scope of application of customized shaping of capacitor pins.

[0017] (2) In the present invention, the excess length of the lead body after pre-shaping can be cut off by the cutting mechanism. As the cutter moves downward, the excess part of the lead body is cut off, and the excess material head can fall into the receiving tray along the slide groove, which is convenient for subsequent unified collection and processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a structural schematic diagram of a capacitor pin pre-shaping device according to an embodiment of the present invention; Figure 2 is a structural schematic diagram of a positioning mechanism in an embodiment of the present invention; Figure 3 is a schematic structural diagram of a top plate in a positioning mechanism according to an embodiment of the present invention; Figure 4 It is a structural schematic diagram of a positioning seat in a positioning mechanism according to an embodiment of the present invention; Figure 5 is a schematic diagram of the internal structure of the positioning mechanism in an embodiment of the present invention; Figure 6 is a schematic structural diagram of a bending assembly in an embodiment of the present invention; Figure 7 is a structural schematic diagram of a pressing mechanism in an embodiment of the present invention; Figure 8 is a schematic structural diagram of a cutting mechanism in an embodiment of the present invention; Fig. 9 is a schematic diagram of the position structure of the capacitor body and the pin body in an embodiment of the present invention; Among them, 1. frame; 2. support frame; 3. Pressing mechanism; 31. Bracket; 32. Pressing block; 33. First linear module; 34. Guide rod; 4. Positioning mechanism; 41. Base; 411. Groove; 42. Positioning seat; 421. Positioning groove; 422. Pick-and-place groove; 43. Guide column; 44. Top plate; 45. Press plate; 451. Pad; 46. Bending assembly; 461. Support plate; 462. Bending plate; 463. Limiting groove; 47. Guide hole; 48. Positioning notch; 49. Positioning block; 5. Cutting mechanism; 51. Second linear module; 52. Cutter; 53. Slide; 54. Receiving tray; 6. Slide rail assembly; 7. Telescopic assembly; 8. Operation button; 91. Capacitor body; 92. Pin body. DETAILED DESCRIPTION

[0019] The present invention will now be further described in detail with reference to the accompanying drawings and embodiments. These drawings are simplified schematic diagrams that only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0020] Embodiment 1

[0021] like Figure 1-Figure 2 As shown, a capacitor pin pre-shaping device includes a frame 1, on which a support frame 2, a slide rail assembly 6, a telescopic assembly 7 and a bending assembly 46 are arranged; the support frame 2 adopts a gantry structure, and a pressing mechanism 3 is installed on the top; the bending assembly 46 is located on the inner side of the support frame 2, the slide rail assembly 6 is located on one side of the bending assembly 46, and a positioning mechanism 4 is installed on the slide rail assembly 6, the positioning mechanism 4 is located on the inner side of the support frame 2, and the telescopic assembly 7 is used to drive the positioning mechanism 4 to move along the slide rail assembly 6, and its output end is connected to the positioning mechanism 4.

[0022] The end of the capacitor body 91 has a pin body 92, and the two are coaxial for ease of production. After the capacitor body 91 is clamped in the positioning mechanism 4, the pin body 92 extends to the outside of the positioning mechanism 4, and under the drive of the telescopic assembly 7, the positioning mechanism 4 moves backward along the slide rail assembly 6, and the pin body 92 interferes with the bending assembly 46, that is, under the restriction of the bending assembly 46, as the positioning mechanism 4 moves backward, the pin body 92 is forced to bend, and at this time, it is perpendicular to the axis of the capacitor body 91. Subsequently, with the coordinated action of the pressing mechanism 3 and the positioning mechanism 4, the pin body 92 can be bent for a second time.

[0023] like Figure 2-Figure 5 As shown, the positioning mechanism 4 includes a base 41 , a positioning seat 42 , a guide column 43 , a top plate 44 and a pressing plate 45 .

[0024] A groove 411 is provided on the base 41, and the positioning seat 42 is floatingly embedded in the groove 411; a positioning groove 421 is provided on the positioning seat 42, and the capacitor body 91 is placed in the positioning groove 421, and both sides of the positioning groove 421 are also provided with a pick-up and drop groove 422 to facilitate the taking of the capacitor; the pressure plate 45 is an L-shaped structure, one end of which is rotatably connected to the base 41, and the other end is clamped with the base 41, and a pad 451 is also installed at the bottom of the pressure plate 45, and the pad 451 is in close contact with the capacitor body 91 to firmly fix the capacitor body 91 in the positioning groove 421.

[0025] One end of the guide column 43 is fixedly installed in the groove 411, and the other end slides through the positioning seat 42, and a spring is sleeved on the guide column 43, and the spring is located between the base 41 and the positioning seat 42; a guide hole 47 is also opened on the positioning seat 42, and the lower end of the top plate 44 is fixedly installed in the groove 411, and the upper end slides and embeds into the guide hole 47.

[0026] Driven by the pressing mechanism 3, the positioning seat 42 moves downward along the guide column 43 and compresses the spring, so that the upper end of the top plate 44 protrudes from the guide hole 47 and extends outward, performing a secondary bending on the pin body 92; as the pressing mechanism 3 is reset, the positioning seat 42 rises and resets under the elastic force of the spring, and at this time the upper end of the top plate 44 is re-embedded in the guide hole 47, which will not affect the initial bending of the pin body 92.

[0027] Furthermore, a positioning notch 48 is provided on the side wall of the positioning groove 421, a positioning block 49 is provided on the front side of the positioning notch 48, and the guide hole 47 is located between the positioning notch 48 and the positioning block 49. When the capacitor body 91 is inserted into the positioning groove 421, the pin body 92 can pass through the positioning notch 48 and extend to the outside; the positioning block 49 is integrally formed with the base 41, which can ensure that the initial bending of the pin body 92 will not be excessive, that is, ensure that the axis of the pin body 92 and the capacitor body 91 after the initial bending is perpendicular to each other.

[0028] The capacitor body 91 is clamped on the positioning seat 42 of the positioning mechanism 4. As it moves backward along the slide rail assembly 6, the pin body 92 interferes with the bending assembly 46, so that the pin body 92 completes the initial bending; then the pressing mechanism 3 drives the positioning seat 42 to move downward, so that the top plate 44 protrudes from the guide hole 47 and performs a secondary bending on the pin body 92; the device has a compact structure, simple operation, and can realize the secondary bending of the pin body 92, which greatly improves the scope of application of customized shaping of capacitor pins.

[0029] like Figure 2-Figure 3 , Figure 6 As shown, the bending assembly 46 includes a support plate 461 fixedly connected to the frame 1, a bending plate 462 is installed on the top of the support plate 461, a limiting groove 463 is opened at the bottom of the end of the bending plate 462, and the pin body 92 passes through the limiting groove 463.

[0030] The bending assembly 46 is fixed relative to the slide rail assembly 6, and the positioning mechanism 4 can slide along the slide rail assembly 6 under the drive of the telescopic assembly 7, and one end of the bending plate 462 extends to the outside of the positioning notch 48; based on the obstruction of the bending plate 462, when the capacitor body 91 slides with the positioning mechanism 4, the pin body 92 interferes with the bending plate 462, and as the capacitor body 91 continues to move, the pin body 92 is forced to bend, and when bending, the pin body 92 is located in the limiting groove 463. The limiting groove 463 can ensure that when the pin body 92 is bent, it only deforms in the specified direction to avoid warping upward or in other directions.

[0031] like Figure 1 , Figure 7 As shown, the pressing mechanism 3 includes a first linear module 33 installed on the top of the support frame 2, the output end of the first linear module 33 extends to the inner side of the support frame 2 and is connected to the bracket 31, and a pressing block 32 is installed at the bottom of the bracket 31, and the pressing block 32 can contact the positioning seat 42.

[0032] Driven by the first linear module 33, the bracket 31 can drive the pressure block 32 to rise and fall in the vertical direction. As the first linear module 33 extends, the pressure block 32 moves downward and contacts the positioning seat 42. When the pressure block 32 is pressed downward to drive the positioning seat 42 to move downward, the upper end of the top plate 44 protrudes from the guide hole 47 and bends the pin body 92 for a second time.

[0033] The pressing block 32 adopts an L-shaped structure to ensure that when it contacts the positioning seat 42, it does not affect the axial movement of the pin body 92 during the secondary bending, and can also prevent the pin body 92 from warping, ensuring that the secondary bending is carried out smoothly.

[0034] In order to improve the stability of the bracket 31 when it is lifted and lowered, a guide rod 34 is movably provided on the top of the support frame 2. The lower end of the guide rod 34 is fixedly connected to the bracket 31, and the guide rod 34 and the support frame 2 are connected via a linear bearing.

[0035] Working principle: Driven by the telescopic assembly 7, the positioning mechanism 4 moves forward along the slide rail assembly 6 to the upper and lower material positions, and after the capacitor is loaded into the positioning groove 421, the pressure plate 45 is closed; then the operation button 8 is pressed, and the positioning mechanism 4 moves backward along the slide rail assembly 6. Under the limitation of the bending plate 462 and the limit groove 463, the pin body 92 of the capacitor undergoes an initial bending, so that the pin body 92 and the capacitor body 91 are perpendicular to each other; then the pressing block 32 of the pressing mechanism 3 moves under the drive of the first linear module 33, and when the pressing block 32 is pressed downward to drive the positioning seat 42 to move downward, the upper end of the top plate 44 protrudes from the guide hole 47 and bends the pin body 92 for a second time.

[0036] Among them, the first linear module 33, the second linear module 51 and the telescopic assembly 7 all adopt existing technologies, and cylinders can be used preferentially here; and the slide rail assembly 6 is also existing technology, including slide rails and sliders that slide in cooperation with each other, the slide rails are fixedly installed on the frame 1, and the slider is fixedly connected to the base 41.

[0037] Embodiment 2

[0038] On the basis of the first embodiment, the present invention further proposes a cutting mechanism 5 to cut off the excess length of the pin body 92 after bending, so as to ensure that the size of the pin body 92 meets the customer's requirements.

[0039] like Figure 1-Figure 5 , Figure 7-Figure 8 As shown, the cutting mechanism 5 is installed on the bracket 31 , and a slide groove 53 is provided at the front end of the positioning seat 42 , and a receiving tray 54 connected to the slide groove 53 is installed at the front end of the base 41 .

[0040] The cutting mechanism 5 includes a second linear module 51 installed on the bracket 31 . The output end of the second linear module 51 is connected to a cutter 52 , and the end of the cutter 52 can extend into the slide slot 53 .

[0041] The side wall of the slide groove 53 is flush with the side of the positioning block 49, and in order to facilitate the collection of the cut material heads, the bottom surface of the slide groove 53 is set to an inclined surface; when the secondary bending of the pin is completed, the excess part extends into the slide groove 53. At this time, the pressing mechanism 3 has not yet reset. Under the drive of the second linear module 51, the cutter 52 moves downward to neatly cut off the excess pins along the side wall of the slide groove 53. The cut material heads are affected by gravity and fall into the receiving tray 54 along the bottom surface of the slide groove 53.

[0042] Embodiment 3

[0043] On the basis of the first and second embodiments, the present invention further proposes a capacitor pin pre-shaping method.

[0044] A capacitor pin pre-shaping method comprises the following steps: Step S1: clamp the capacitor to be shaped in the positioning mechanism 4; during clamping, place the capacitor body 91 in the positioning groove 421, and then lock the pressing plate 45 so that the pad 451 firmly fixes the capacitor body 91 in the positioning groove 421.

[0045] Step S2: the telescopic component 7 drives the positioning mechanism 4 to move backward along the slide rail component 6, and completes the initial bending of the pin in the process, so that the bent pin and the axis of the capacitor are perpendicular to each other; the bending component 46 is fixed relative to the slide rail component 6, and the positioning mechanism 4 can slide along the slide rail component 6 under the drive of the telescopic component 7. Based on the obstruction of the bending plate 462, when the capacitor body 91 slides with the positioning mechanism 4, the pin body 92 interferes with the bending plate 462, and as the capacitor body 91 continues to move, the pin body 92 is forced to bend.

[0046] Step S3: After the initial bending is completed, the pressing mechanism 3 drives the positioning seat 42 to move downward, so that the upper end of the top plate 44 protrudes from the guide hole 47 and the pin is bent for the second time; as the first linear module 33 extends, the pressing block 32 moves downward and contacts the positioning seat 42. When the pressing block 32 is pressed downward to drive the positioning seat 42 to move downward, the upper end of the top plate 44 protrudes from the guide hole 47 and the pin body 92 is bent for the second time.

[0047] Step S4: After the secondary bending, the pressing mechanism 3 remains stationary, and the excess length of the pin is cut off by the cutting mechanism 5. After the secondary bending of the pin is completed, the excess part extends into the slide groove 53. At this time, the pressing mechanism 3 has not yet been reset. Under the drive of the second linear module 51, the cutter 52 moves downward to neatly cut off the excess pin along the side wall of the slide groove 53.

[0048] Step S5: the cut material head falls into the receiving tray 54 along the slide groove 53, and then the cutting mechanism 5 and the pressing mechanism 3 are reset in sequence, and the telescopic assembly 7 drives the positioning mechanism 4 to move forward along the slide rail assembly 6 to take away the shaped capacitor.

[0049] In summary, the present invention proposes a capacitor pin pre-shaping device, which can realize secondary bending of the capacitor pins, greatly improving the application scope of customized shaping of the capacitor pins; during the initial bending, its direction is controlled by the limit groove 463, and during the secondary bending, the limit groove 463 and the L-shaped pressure block 32 cooperate with each other, and finally the bending is realized under the lifting of the top plate 44.

[0050] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and the like are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", and the like may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0051] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0052] The above is based on the ideal embodiment of the present invention. Through the above description, relevant personnel can make various changes and modifications without departing from the technical concept of the present invention. The technical scope of the present invention is not limited to the content in the specification, and the technical scope must be determined according to the scope of the claims.

Claims

1. A capacitor pin pre-shaping device, comprising a frame (1), characterized in that: A bending assembly (46) is installed on the frame (1); a slide rail assembly (6) is provided on one side of the bending assembly (46); a positioning mechanism (4) for clamping a capacitor body (91) is installed on the slide rail assembly (6); The positioning mechanism (4) comprises a base (41) connected to the slide rail assembly (6), a positioning seat (42) capable of being raised and lowered is mounted on the base (41), and when the positioning mechanism (4) moves backward along the slide rail assembly (6), the bending assembly (46) can bend the pin body (92) at the end of the capacitor body (91); The positioning seat (42) is provided with a guide hole (47), and a top plate (44) is slidably embedded in the guide hole (47); a pressing mechanism (3) is also provided above the positioning mechanism (4), and the pressing mechanism (3) includes a pressing block (32) that can be raised and lowered; and when the pressing block (32) is pressed downward to drive the positioning seat (42) to move downward, the upper end of the top plate (44) protrudes from the guide hole (47) and bends the pin body (92) for a second time.

2. The capacitor pin pre-shaping device according to claim 1, characterized in that: The base (41) is provided with a groove (411), a guide column (43) is fixedly installed in the groove (411), the guide column (43) slides through the positioning seat (42), and a spring is sleeved on the guide column (43), and the spring is located between the base (41) and the positioning seat (42).

3. The capacitor pin pre-shaping device according to claim 2, characterized in that: The positioning seat (42) is provided with a positioning groove (421) for accommodating the capacitor body (91), a positioning notch (48) for the pin body (92) to pass through is provided on the side wall of the positioning groove (421), a positioning block (49) is provided on the front side of the positioning notch (48), and the guide hole (47) is located between the positioning notch (48) and the positioning block (49).

4. The capacitor pin pre-shaping device according to claim 3, characterized in that: A pressing plate (45) capable of being turned over in the longitudinal direction is also mounted on the positioning seat (42), and a pad (451) capable of contacting the capacitor body (91) is provided at the bottom of the pressing plate (45).

5. The capacitor pin pre-shaping device according to claim 1, characterized in that: The bending assembly (46) comprises a support plate (461) fixedly connected to the frame (1), a bending plate (462) being installed on the top of the support plate (461), a limiting groove (463) being provided at the bottom of the end of the bending plate (462), and the pin body (92) passing through the limiting groove (463).

6. The capacitor pin pre-shaping device according to claim 1, characterized in that: A support frame (2) is fixedly mounted on the frame (1), the pressing mechanism (3) is mounted on the support frame (2), and the positioning mechanism (4) is located on the inner side of the support frame (2).

7. The capacitor pin pre-shaping device according to claim 6, characterized in that: The pressing mechanism (3) comprises a first linear module (33) mounted on the top of the support frame (2), an output end of the first linear module (33) extending to the inner side of the support frame (2) and connected to a bracket (31), the pressing block (32) being mounted on the bottom of the bracket (31), and the pressing block (32) being able to contact the positioning seat (42).

8. The capacitor pin pre-shaping device according to claim 7, characterized in that: A slide groove (53) is provided at the front end of the positioning seat (42), a receiving tray (54) connected to the slide groove (53) is installed at the front end of the base (41), and a cutting mechanism (5) for cutting off the excess length of the pin body (92) is also installed on the bracket (31).

9. The capacitor pin pre-shaping device according to claim 8, characterized in that: The cutting mechanism (5) comprises a second linear module (51) mounted on the bracket (31), the output end of the second linear module (51) being connected to a cutter (52), and the end of the cutter (52) being able to extend into the slide groove (53).

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