Underwater sound communication machine and underwater equipment

Abstract

The invention provides an underwater sound communication machine and underwater equipment, and relates to the technical field of underwater sound communication machines. The underwater sound communication machine comprises a shell assembly and a circuit board, a cavity is formed in the shell assembly, and a heat-conducting medium is contained in the cavity; the shell assembly is provided with a cavity, the circuit board is arranged in the cavity and connected with the shell assembly, the heat-conducting medium makes contact with the circuit board, and the heat-conducting medium is used for conducting heat generated by the circuit board to the shell assembly and then conducting the heat to water through the shell assembly. According to the underwater sound communication machine provided by the invention, the heat-conducting medium is injected into the shell assembly, the heat-conducting medium is in contact with the circuit board, the contact area between the heat-conducting medium and the circuit board is larger, the heat-conducting medium has excellent heat conductivity and chemical stability, and the heat-conducting medium can conduct heat generated in the working process of the circuit board to the shell assembly; and the heat is conducted into the water through the shell assembly, so that the heat dissipation efficiency is effectively improved, and the underwater sound communication machine can work normally.

Description

Technical Field

[0001] The present invention relates to the technical field of underwater acoustic communication machines, and in particular to an underwater acoustic communication machine and underwater equipment. Background Art

[0002] The use of underwater sonar machines is inseparable from a sealed cabin, and the overall structure of the cabin ensures its sealing and pressure resistance. The deepwater environment places high demands on the pressure resistance of the sealed cabin of the sonar machine, and requires that the weight and volume be reduced as much as possible to ensure miniaturization while ensuring the pressure resistance.

[0003] Usually, a small-power underwater sonar machine contacts a heat dissipation chip or electronic component coated with thermal silicone grease through a metal heat sink, and the heat is conducted to the cylinder through the air inside the cabin, and then the cylinder conducts the heat to the water for dissipation; however, this heat dissipation method has low heat dissipation efficiency and cannot meet the use requirements of high-power underwater sonar machines. Summary of the invention

[0004] The invention provides an underwater sonicator, which is used to solve the problem of low heat dissipation efficiency of the existing underwater sonicators.

[0005] The present invention provides an underwater sonic communication device, comprising: A shell component, wherein the shell component has a cavity inside, and the cavity contains a heat-conducting medium; A circuit board is arranged in the cavity and connected to the shell assembly. The heat-conducting medium is in contact with the circuit board. The heat-conducting medium is used to conduct the heat generated by the circuit board to the shell assembly, and then conduct the heat to the water through the shell assembly.

[0006] According to an underwater sonicator provided by the present invention, the housing assembly comprises: A shell body, wherein the cavity is located inside the shell body, and both ends of the shell body have openings communicating with the cavity; Two end covers are arranged on the two openings in a one-to-one correspondence to seal the openings.

[0007] According to the underwater sonicator provided by the present invention, the end cover and the inner wall of the opening are sealed by a first sealing ring.

[0008] According to an underwater sonicator provided by the present invention, a plurality of mounting holes are arranged on the side wall of the shell body, fasteners connected to the end cover are arranged in the mounting holes, and the fasteners are used to fix the end cover.

[0009] According to an underwater sonicator provided by the present invention, at least one of the end covers is provided with a through hole communicating with the cavity, a liquid inlet nozzle plug is provided in the through hole, and the liquid inlet nozzle plug is sealingly matched with the through hole.

[0010] An underwater sonic communication device according to the present invention further comprises: A mounting bracket is arranged in the cavity, the circuit board is arranged on at least one side of the mounting bracket, and one end of the mounting bracket away from the circuit board is connected to the shell body or the end cover.

[0011] According to an underwater sonicator provided by the present invention, the mounting bracket is made of metal.

[0012] According to the underwater sonicator provided by the present invention, there is a gap between the mounting bracket and the circuit board.

[0013] According to an underwater sonicator provided by the present invention, at least one of the inner wall and the outer wall of the shell body is provided with a heat dissipation mechanism, and the heat dissipation mechanism is used to increase the contact area between the shell body and the heat-conducting medium, or to increase the contact area between the shell body and water.

[0014] The present invention also provides an underwater device, comprising any of the underwater sonicators described above.

[0015] The underwater sonicator provided by the present invention injects a heat-conducting medium into the interior of the shell assembly. The heat-conducting medium contacts the circuit board, and the two have a larger contact area. The heat-conducting medium has excellent thermal conductivity and chemical stability. The heat-conducting medium can conduct the heat generated by the circuit board during operation to the shell assembly, and then conduct the heat to the water through the shell assembly, thereby effectively improving the heat dissipation efficiency and ensuring that the underwater sonicator can work normally. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the underwater sonicator provided by the present invention.

[0018] Figure 2 The figure is a schematic diagram of the structure of the underwater sonar provided by the present invention from a top view.

[0019] Figure 3 yes Figure 2Schematic diagram of the cross-section structure along the section line AA.

[0020] Reference numerals: 100, circuit board; 200, housing assembly; 210, housing body; 220, end cover; 230, first sealing ring; 240, mounting hole; 250, liquid inlet plug; 260, mounting bracket; 270, watertight head protection ring; 280, watertight head. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limitations on the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0023] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0024] In the embodiments of the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0025] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0026] Combine the following Figure 1-Figure 3 The specific structure and working principle of the underwater sonicator of the present invention are described.

[0027] like Figures 1 to 3 As shown, the underwater sonicator includes a housing assembly 200 and a circuit board 100. The housing assembly 200 has a cavity inside, and a heat-conducting medium is contained in the cavity. The housing assembly 200 is a sealed housing, and the housing assembly 200 has good sealing performance and high pressure resistance, thereby providing protection for the internal circuit board 100. The circuit board 100 is arranged in the cavity and connected to the housing assembly 200. The heat-conducting medium is in contact with the circuit board 100. The heat-conducting medium is used to conduct the heat generated by the circuit board 100 to the housing assembly 200, and then conduct the heat to the water through the housing assembly 200.

[0028] The underwater sonicator provided by the present invention injects a heat-conducting medium into the interior of the shell component 200. The heat-conducting medium contacts the circuit board 100, and the two have a larger contact area. The heat-conducting medium has excellent thermal conductivity and chemical stability. The heat-conducting medium can conduct the heat generated by the circuit board 100 during operation to the shell component 200, and then conduct the heat to the water through the shell component 200, thereby effectively improving the heat dissipation efficiency and ensuring that the underwater sonicator can work normally.

[0029] It should be noted here that the water in this application can be sea water or lake water, which is determined according to the working scenario of the underwater sonar machine.

[0030] In one embodiment of the present invention, the heat-conducting medium in this embodiment is a fluorinated liquid, which has the following advantages: 1. The fluorinated liquid has extremely high electrical insulation and is suitable as a coolant and dielectric fluid for electrical equipment. 2. The fluorinated liquid has high thermal conductivity and can effectively conduct heat, and is widely used in systems that require efficient heat dissipation. 3. The fluorinated liquid exhibits high stability in chemical reactions, is not easy to react with other substances, and is suitable for cleaning and cooling in a variety of sensitive environments. 4. The fluorinated liquid does not burn, has no flash point or ignition point, and therefore performs well in application scenarios that require high safety. Of course, the specific type of the heat-conducting medium is not limited thereto, and may also be hydrofluoroether (HFE), perfluoropolyether (PFPE), perfluoroolefin, hexafluoropropyl trifluoroethyl ether (HFE449) or octafluoropentyl tetrafluoroethyl ether (HFE6512).

[0031] In one embodiment of the present invention, the housing assembly 200 includes a housing body 210 and two end caps 220. The cavity is located inside the housing body 210. Both ends of the housing body 210 have openings connected to the cavity. In this embodiment, the housing body 210 is a tubular structure, and the outer diameters of both ends of the housing body 210 are equal. The two end caps 220 are arranged in a one-to-one correspondence at the two openings and block the openings. The end caps 220 are sealed with the housing body 210, so as to form a sealed cavity inside the housing body 210.

[0032] In a preferred embodiment of the present invention, the shell body 210 is made of metal. The use of metal shell body 210 not only improves the structural strength of the shell body 210, ensuring that the shell body 210 has sufficient strength and rigidity to withstand underwater pressure, especially when working at a greater depth; it can also improve the thermal conductivity of the shell body 210. Metal has good thermal conductivity and can quickly transfer the heat generated by the circuit board 100 to seawater or lake water. At the same time, the metal shell body 210 also has good corrosion resistance. Due to the corrosiveness of the underwater environment, the metal shell body 210 has good corrosion resistance, which can ensure that the underwater sonicator has high reliability.

[0033] In a preferred embodiment of the present invention, the material of the end cap 220 is also metal, so the end cap 220 has good structural strength, pressure resistance and corrosion resistance. Preferably, the material of the shell body 210 and the end cap 220 is aluminum alloy. Of course, the material of the shell body 210 and the end cap 220 is not limited thereto, and is specifically determined according to the optimal experimental results. The use of the metal end cap 220 increases the heat conduction path. In addition to being transferred outward through the shell body 210, heat can also be transferred outward through the end cap 220, which increases the heat conduction area of ​​the shell assembly 200 and further improves the heat dissipation efficiency of the shell assembly 200.

[0034] In one embodiment of the present invention, the end cap 220 is sealed with the inner wall of the opening by the first sealing ring 230. Specifically, the outer peripheral surface of the end cap 220 is provided with a first positioning groove, the first sealing ring 230 is partially embedded in the first positioning groove, the first sealing ring 230 is squeezed by the inner wall of the opening, and fits with the end cap 220 and the inner wall of the opening respectively, so as to achieve the sealing cooperation between the end cap 220 and the inner wall of the opening. Alternatively, the inner wall of the opening is provided with a first positioning groove, the first sealing ring 230 is partially embedded in the first positioning groove, the first sealing ring 230 is squeezed by the end cap 220, and fits with the end cap 220 and the inner wall of the opening respectively, so as to achieve the sealing cooperation between the end cap 220 and the inner wall of the opening. Preferably, the first sealing ring 230 is an O-ring.

[0035] In one embodiment of the present invention, the side wall of the housing body 210 is provided with a plurality of mounting holes 240, the plurality of mounting holes 240 are located at both ends of the housing body 210, the plurality of mounting holes 240 are arranged at intervals along the circumferential direction, and the distance between two adjacent mounting holes 240 is equal. The mounting holes 240 are through holes, and fasteners are provided in the mounting holes 240, and the fasteners are used to fix the end cover 220. The outer peripheral surface of the end cover 220 is provided with positioning holes, and the positions of the positioning holes correspond to the positions of the mounting holes 240 one by one, and the fasteners are inserted into the positioning holes. Preferably, the fasteners are screws.

[0036] In one embodiment of the present invention, at least one end cap 220 is provided with a through hole connected to the cavity, and the through hole is a circular hole, and the through hole is used to inject a heat-conducting medium into the cavity, or discharge the heat-conducting medium in the cavity. A liquid inlet nozzle plug 250 is provided in the through hole, and the liquid inlet nozzle plug 250 is sealed with the through hole. When the liquid inlet nozzle plug 250 is opened, the cavity is connected to the outside through the through hole, and a container can be used to inject a heat-conducting medium into the cavity through the through hole. After the heat-conducting medium reaches a certain amount, the injection of the heat-conducting medium is stopped, and the liquid inlet nozzle plug 250 is installed in the through hole. The through hole is sealed by the liquid inlet nozzle plug 250 to prevent leakage of the heat-conducting medium.

[0037] In a preferred embodiment of the present invention, the outer peripheral surface of the liquid inlet nozzle plug 250 is provided with a section of external thread, and the inner wall of the through hole is provided with a section of internal thread, and the liquid inlet nozzle plug 250 is threadedly matched with the inner wall of the through hole. Of course, the assembly method of the liquid inlet nozzle plug 250 and the through hole is not limited thereto, and can also be connected by snap connection, flange connection or other methods.

[0038] In a preferred embodiment of the present invention, the liquid inlet plug 250 is sealed with the through hole via a second sealing ring (not shown). Figure 3 As shown, the inner wall of the through hole has a section of annular sealing surface, the outer peripheral surface of the liquid inlet nozzle plug 250 is provided with a second positioning groove, the position of the second positioning groove corresponds to the position of the annular sealing surface, the second sealing ring is partially embedded in the second positioning groove, the second sealing ring is squeezed by the inner wall of the through hole, and fits with the annular sealing surface and the liquid inlet nozzle plug 250 respectively, thereby achieving a sealed fit between the liquid inlet nozzle plug 250 and the inner wall of the through hole. Alternatively, the outer peripheral surface of the liquid inlet nozzle plug 250 has a section of annular sealing surface, the inner wall of the through hole is provided with a second positioning groove, the position of the second positioning groove corresponds to the position of the annular sealing surface, the second sealing ring is partially embedded in the second positioning groove, the second sealing ring is squeezed by the annular sealing surface, and fits with the annular sealing surface and the inner wall of the through hole respectively, thereby achieving a sealed fit between the liquid inlet nozzle plug 250 and the inner wall of the through hole.

[0039] In one embodiment of the present invention, the underwater sonicator further includes a mounting bracket 260, which is disposed in the cavity, and the circuit board 100 is disposed on at least one side of the mounting bracket 260, and the mounting bracket 260 is used to provide a mounting base for the circuit board 100 and fix the circuit board 100 in the cavity; one end of the mounting bracket 260 away from the circuit board 100 is connected to the shell body 210 or the end cover 220.

[0040] Specifically, the mounting bracket 260 is L-shaped, and one end of the mounting bracket 260 away from the circuit board 100 has a connecting portion, the connecting portion is perpendicular to the mounting bracket 260, and the connecting portion is connected to an end cover 220 by screws, so that the mounting bracket 260 is fixed to the end cover 220. Of course, the connection method of the connecting portion and the end cover 220 is not limited to this, and an integral molding or other connection methods can also be adopted.

[0041] In another embodiment of the present invention, the mounting bracket 260 is connected to the shell body 210, and can be connected by screws or snaps. Compared with connecting the mounting bracket 260 to the shell body 210, connecting the mounting bracket 260 to the end cover 220 can facilitate the installation and removal of the circuit board 100, shorten the installation and removal time of the underwater sonar machine, and improve the assembly efficiency. When the end cover 220 is taken out, the mounting bracket 260 and the circuit board 100 can be taken out together with the end cover 220, and there is no need to remove the mounting bracket 260 separately. When installing the end cover 220, it is only necessary to insert the mounting bracket 260 and the circuit board 100 into the cavity, install the end cover 220 in the opening, and then use fasteners to fix the end cover 220, so that the mounting bracket 260 and the circuit board 100 can be fixed, without the need to install the mounting bracket 260 separately.

[0042] In one embodiment of the present invention, the mounting bracket 260 is made of metal material. The mounting bracket 260 made of metal material can not only enhance the structural strength of the mounting bracket 260, thereby improving the stability of the circuit board 100, but also use the mounting bracket 260 to conduct part of the heat to the end cover 220, and conduct the heat to sea water or lake water through the end cover 220.

[0043] Preferably, a metal pad (not shown) is provided between the circuit board 100 and the mounting bracket 260, one side of the metal pad contacts the position of the circuit board 100 where no electronic components are provided, and the other side of the metal pad contacts the mounting bracket 260. The provision of the metal pad allows the circuit board 100 to be in good contact with the mounting bracket 260, thereby conducting as much heat on the circuit board 100 as possible through the mounting bracket 260 to the end cover 220, further improving the heat dissipation efficiency of the underwater sonar.

[0044] In another embodiment of the present invention, there is a gap between the mounting bracket 260 and the circuit board 100. It can be known from the heat conduction calculation formula that, under the premise of a certain medium temperature difference and medium thermal conductivity, the heat dissipation performance of the circuit board 100 is related to the size of the perpendicular area in the heat transfer direction, that is, the larger the heat dissipation area, the better the heat dissipation effect, and vice versa. By reserving a gap between the mounting bracket 260 and the circuit board 100, the heat-conducting medium can enter the gap and contact the circuit board 100, thereby increasing the contact area between the heat-conducting medium and the circuit board 100. After the heat-conducting medium exchanges heat with the circuit board 100, it begins to flow to other areas, thereby conducting heat to other areas. The heat-conducting medium with a lower temperature in other areas enters the gap again to exchange heat with the circuit board 100. Through continuous circulation, the heat on the circuit board 100 can be continuously conducted to the housing assembly 200, further improving the heat dissipation efficiency of the underwater sonicator.

[0045] In one embodiment of the present invention, at least one of the inner wall and the outer wall of the shell body 210 is provided with a heat dissipation mechanism (not shown), and the heat dissipation mechanism is used to increase the contact area between the shell body 210 and the heat-conducting medium, or to increase the contact area between the shell body 210 and the water. Specifically, the inner wall and the outer wall of the shell body 210 are provided with a heat dissipation mechanism, and the heat dissipation mechanism is a fin or a convex pattern. Fins or convex patterns are provided on the inner wall of the shell body 210, which increases the contact area between the shell body 210 and the heat-conducting medium, thereby conducting more heat in the heat-conducting medium to the shell body 210, and then conducting the heat to the water through the shell assembly 200. Fins or convex patterns are provided on the outer wall of the shell body 210, which increases the contact area between the shell body 210 and the water, and improves the heat conduction efficiency between the shell body 210 and the water. Of course, the specific structural form of the heat dissipation mechanism is not limited to fins or convex patterns, and can also be other heat dissipation mechanisms.

[0046] In one embodiment of the present invention, a waterproof motor and a small propeller (not shown) are arranged in the cavity, the rotating shaft of the motor is connected to the small propeller, the motor is electrically connected to the circuit board 100, and the motor is powered by the circuit board 100 to drive the small propeller to rotate. Since one of the ways for the heat-conducting medium to transfer heat is convection, the density of the heat-conducting medium close to the circuit board 100 changes after being heated, and this part of the heat-conducting medium will convect with the heat-conducting medium far away from the circuit board 100, thereby transferring heat to the area far away from the circuit board 100. However, due to the existence of "dead water areas" or "stagnant areas" in the cavity, it is difficult for the heat-conducting medium in these areas to exchange heat with the circuit board 100, which affects the heat conduction efficiency of the heat-conducting medium, and further affects the heat dissipation efficiency of the underwater sonar. By arranging a small propeller in the cavity, the heat-conducting medium is driven to flow in the cavity when the small propeller rotates, which promotes the convection between the heat-conducting media in different areas, thereby improving the heat conduction efficiency of the heat-conducting medium. Preferably, the motor and the small propeller are arranged on the circuit board 100, so that under the same power consumption, more heat-conducting medium near the circuit board 100 can be transported to an area far away from the circuit board 100 for heat exchange, further improving the heat conduction efficiency of the heat-conducting medium.

[0047] In one embodiment of the present invention, the underwater sonicator further includes a watertight head 280, which is disposed through the end cover 220 and is sealed with the end cover 220. The watertight head 280 is electrically connected to the circuit board 100, and the circuit board 100 is electrically connected to external equipment through the watertight head 280 and the cable. In this embodiment, both end covers 220 are provided with the watertight head 280, and of course, the watertight head 280 may also be provided on only one of the end covers 220.

[0048] Preferably, a watertight head protection ring 270 is provided on the side of the end cover 220 away from the shell body 210, and the watertight head protection ring 270 is arranged around the outer periphery of the watertight head 280. The height of the watertight head protection ring 270 is greater than the height of the watertight head 280, so that foreign objects cannot come into contact with the watertight head 280, thereby protecting the watertight head 280. Specifically, the height of the watertight head 280 is one third of the height of the watertight head protection ring 270. Of course, the height of the watertight head 280 can also be one half, one quarter or other proportional relationship of the height of the watertight head protection ring 270.

[0049] The watertight head protection ring 270 is connected to the end cover 220 through a fifth fastener (not shown). Specifically, the fifth fastener is a hexagon socket head screw. The material of the hexagon socket head screw is preferably stainless steel. The end cover 220 is provided with a plurality of blind holes. The inner walls of the blind holes are provided with threads. The hexagon socket head screw is threadedly connected to the blind holes. Of course, the fifth fastener can also be a rivet, a flat head screw or other types of fasteners.

[0050] The underwater sonicator provided by the present invention injects a heat-conducting medium into the interior of the shell component 200. The heat-conducting medium contacts the circuit board 100, and the two have a larger contact area. The heat-conducting medium has excellent thermal conductivity and chemical stability. The heat-conducting medium can conduct the heat generated by the circuit board 100 during operation to the shell component 200, and then conduct the heat to the water through the shell component 200, thereby effectively improving the heat dissipation efficiency and ensuring that the underwater sonicator can work normally.

[0051] The present invention also provides an underwater device, which includes the underwater sonicator described in any one of the above embodiments.

[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An underwater sonic communication device, characterized in that: include: A housing component (200), wherein the housing component (200) has a cavity inside, and a heat-conducting medium is contained in the cavity; A circuit board (100), the circuit board (100) being arranged in the cavity and connected to the housing component (200), the heat conducting medium being in contact with the circuit board (100), the heat conducting medium being used to conduct heat generated by the circuit board (100) to the housing component (200), and then conducting the heat to water via the housing component (200).

2. The underwater sonicator according to claim 1, characterized in that: The housing assembly (200) comprises: A shell body (210), the cavity being located inside the shell body (210), and both ends of the shell body (210) having openings communicating with the cavity; Two end covers (220), the two end covers (220) are arranged on the two openings in a one-to-one correspondence, and seal the openings.

3. The underwater sonicator according to claim 2, characterized in that: The end cover (220) and the inner wall of the opening are sealed via a first sealing ring (230).

4. The underwater sonicator according to claim 2, characterized in that: The side wall of the shell body (210) is provided with a plurality of mounting holes (240), and fasteners connected to the end cover (220) are provided in the mounting holes (240), and the fasteners are used to fix the end cover (220).

5. The underwater sonicator according to any one of claims 2 to 4, characterized in that: At least one of the end covers (220) is provided with a through hole communicating with the cavity, a liquid inlet nozzle plug (250) is provided in the through hole, and the liquid inlet nozzle plug (250) is in sealing cooperation with the through hole.

6. The underwater sonicator according to any one of claims 2 to 4, characterized in that: Also includes: A mounting bracket (260) is arranged in the cavity, the circuit board (100) is arranged on at least one side of the mounting bracket (260), and one end of the mounting bracket (260) away from the circuit board (100) is connected to the housing body (210) or the end cover (220).

7. The underwater sonicator according to claim 6, characterized in that: The mounting bracket (260) is made of metal.

8. The underwater sonicator according to claim 6, characterized in that: There is a gap between the mounting bracket (260) and the circuit board (100).

9. The underwater sonicator according to claim 6, characterized in that: At least one of the inner wall and the outer wall of the shell body (210) is provided with a heat dissipation mechanism, and the heat dissipation mechanism is used to increase the contact area between the shell body (210) and the heat-conducting medium, or to increase the contact area between the shell body (210) and water.

10. An underwater device, characterized in that: The underwater sonicator comprises the underwater sonicator as described in any one of claims 1 to 9.

Images